• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.143-145
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• 1996

A new method of fabricating 3-dimensional patterns on single crystal silicon is presented in this paper. The method utlizes both chemical and mechanical reactions to make patterns with dimensions of few microns in width and submicron in height. The primaryadvantage ofthis new method over conventional methods of making patterns on silicon lies in its cost effectiveness and speed. The process introduced in this paper is a maskless process and does not reauire expensive capital investment. It is expected that this method can be employed for flexible and cost effective fabrication of micro-machine components in MEMS application.

• Journal of the Korean Graphic Arts Communication Society
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• v.26 no.2
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• pp.45-54
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• 2008

We have manufactured a photoresist which has excellent dispersity and good applying property due to 330 cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed with mask by UV-LED light source so we could manufacture the photoresist which proper for the UV light source. And it was developed by air spray with $1.7\;kgf/cm^2$ of injection pressure. Because of the excellence of power and resolution of the UV-LED light sourse, the pencil hardness and solvent resistance of curing photoresist film were excellent as those of conventional photoresist film. Moreover the $100{\mu}m$-width stripe image which has sharp edges was formed. So we confirmed a possibility of dry development process by air spray method.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.274-279
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• 2002

In this paper, the development process of an unique and creative micro/nano-structure fabrication technique based on micro/nano-tribology are reviewed and discussed. The so-called Mechano-Chemical Process(MCP), which has been developed since 1995 by Tribology Research Laboratory at Yonsei University with the motivation to overcome the demerits of the conventional photolithographic techniques, is based on the fundamental understanding of the interaction between the tool tip and the workpiece surface. This process is a maskless process which offers tremendous flexibility in surface patterns that can be created on a workpiece surface without using any capital intensive equipment. It Is capable of fabricating the prototypes of micro/nano-components, micro- structured surface with various geometries, micro-molds for making polymer or metal parts, and micro-fluidic channels for lab-on-a- chip

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2257-2259
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• 2000

This paper reports on the design, fabrication and driving experiment of micro mirror array(MMA) for lithography process to apply to biochip fabrication Photolithography technology is applied to activate specific area on the surface of modified glass surface, DNA monomers are bound on the activated area of the glass surface. After repeat of DNA monomer synthesizing process, DNA single strand probes could be solid-synthesized on the glass substrate. Without using photomask, photolithography process is tried using micro mirror array(MMA). Photomask or mask alignment is not required in maskless photolithography process using micro mirror array.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.612-615
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• 2003

Maskless laser patterning process is developed using 3rd harmonic Diode Pumped Solid State Laser with near visible wavelength of 355 nm. Photo-sensitive curable polymer is irradiated by UV laser and developed using polymer solvent to obtain quasi-3D patterns. We performed basic experiments for the various process conditions such as laser power, writing speed, laser focus, and polymer optical property to gain the optimal conditions. Experimentally, the patterns of trapezoidal shape were manufactured into dimension of 8${\mu}{\textrm}{m}$ width and 5.4${\mu}{\textrm}{m}$ height. This process could be applied to fabricate a single mode waveguide without expensive mask projection method.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.71-78
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• 2005

The purpose of this study is to suggest a hyperfine maskless writing technique by using the nanoindentation and HF wet etching technique. Indents were made on the surface of Pyrex7740 glass by the hyperfine indentation process with a Berkovich diamond indenter, and they were etched in $50\;wr\%$ HF solution. After etching process, convex structure was obtained due to the deformation-induced hillock phenomena. In this study, effects of indentation process parameters (etching time, normal load, loading .ate, hold-time at the maximum load) on the morphologies of the indented surfaces after isotopic etching were investigated from an angle of deformation energies. Finally, sample characters were written to show the possibility of the application.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.1
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• pp.199-206
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• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of the Optical Society of Korea
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• v.18 no.6
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• pp.762-765
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• 2014

We fabricated a periodically poled lithium niobate (PPLN) by direct laser-writing of a quasi-phase-matching (QPM) structure in photolithographic process. Because we do not need to prepare a photomask by electron-beam writing, the "maskless" process shortens the fabrication time and significantly reduces the cost. We evaluated the poling quality of the direct laser-written PPLN by measuring the diffraction noise from the surface relief pattern of the fabricated QPM grating and comparing the results to those from a conventional PPLN made with a photomask. The quality of the PPLN fabricated by direct laser-writing was shown to be equivalent to that fabricated by the conventional method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.268-271
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• 2005

Etch resistance of mask layer on silicon substrate modified by AFM-based Tribo-Nanolithography (TNL) in Aqueous Solution in an aqueous solution was demonstrated. n consists or sequential processes, nano-scratching and wet chemical etching. The simple scratching can form a mask layer on the silicon substrate, which acting as an etching mask. For TNL, a specially designed cantilever with diamond tip, allowing the formation of mask layer on silicon substrate easily by a simple scratching process, has been applied instead of conventional silicon cantilever fur scanning. This study demonstrates how the TNL parameters can affect the etch resistance of mask layer, hence introducing a new process of AFM-based maskless nanolithography in aqueous solution.