• Journal of the Korean Society of Manufacturing Technology Engineers
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• 제26권4호
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• pp.378-386
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• 2017

Friction stir welding was performed using six welding conditions to evaluate the mechanical properties and microstructure of the welded zone based on its temperature change in the extruded plate of magnesium alloy AZ61. The welded zone temperature was measured using a thermocouple, and the maximum temperature ranges for the advancing and retreating sides were approximately $210-315^{\circ}C$ and $254-339^{\circ}C$, respectively. Depending on the welding conditions, a temperature difference of more than $100^{\circ}C$ was observed. In addition, the maximum yield strength and maximum tensile strength of the welded component was 84.4% and 96.9%, respectively, of those of the base material. For the temperatures exceeding $300^{\circ}C$, oxidation defects occurred in the weld zone, which decreased the mechanical strength of the weld zone. The microstructure and texture confirmed that fracture occurred because of the grain size deviation of the welding tool and the severe anisotropy of the texture of the welded joints.

• International Journal of Internet, Broadcasting and Communication
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• 제12권2호
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• pp.30-36
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• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• 제14권5호
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• pp.1-7
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• 2015

Cleaning by injecting dry ice and water is a generally adopted trend these days to clean molds (injection, diecasting foundry, press, rubber mold, etc). This cleaning method is performed manually, or by installing multiple high pressure spray nozzles. We have manufactured a turbine cleaning module device that is able to clean diecasting modules at any position and angle in the space by mounting an articulated robot instead of the existing pipe type injection nozzle, to minimize lead time and enhance working yield of the cleaning process. In this paper, we analyzed process factors that are required to design the turbine module by reviewing number of revolution, and results according to different blade angles and thicknesses of the mold release injection turbine module, using computational fiuid dynamics (CFD).

• Journal of the Korean Society of Manufacturing Process Engineers
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• 제13권1호
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• pp.8-15
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• 2014

This study investigates structural and vibration analyses for three types of bike frame fork models. As long as the maximum equivalent stresses of these models are lower than the yield stress, the three models are considered to be safe structurally. Type 3, with a maximum equivalent stress of 169.23 MPa, has the lowest stress among the three models and the strongest strength. Types 1, 2 and 3 have natural frequencies lower than 270 Hz. Type 3, with a critical frequency of 118 Hz, has the best durability under vibration among the three models. In order to decrease the vibration transmitted to a bike rider riding on a rough road, the impact due to vibration can be relieved by selecting a Type 3 model from among the three models. The results of this study can be effectively utilized for the design of a bike frame fork as this allows the anticipation and prevention of damage caused by durability issues.

• Journal of the Korean Society of Manufacturing Process Engineers
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• 제6권1호
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• pp.50-56
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• 2007

Exhaust manifold is generally subjected to thermal cycle loadings ; at hot condition, large compressive plastic deformations are generated, and at cold condition, tensile stresses are remained in highly deformed critical zones. These phenomena originate from the fact that thermal expansions of the runners are restricted by inlet flange clamped to the cylinder head, because the former is less stiff than the latter and, the temperature of the inlet flange is lower than that of the runners. Since the failure of an exhaust manifold is mainly caused by geometric constraints between the cylinder head and the manifold, the thermal stress can be controlled by geometric factors. The generic geometric factors include the inter distance (2R), the distance from the head to the outlet (L), the tube diameter(d) and the tube thickness (t). This criteria based on elastic analysis up to onset of yield apparently indicate that the pre-stress also reduces the factor; however, high temperature relaxation may reduce this effect at later operation stage.

• Journal of the Korean Society for Precision Engineering
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• 제31권9호
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• pp.799-804
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• 2014

Hard turning is a machining process for hardened materials with high surface quality so that grinding process can be eliminated. Therefore, the hard turning is capable of reducing machining time and improving productivity. In this study, hardened AISI4140 (high-carbon chromium steel) that has excellent yield strength, toughness and wear resistance was finish turned using CBN tools. Wear characteristics of CBN tool was analyzed in dry and MQL mixed with nano-particle (Nano-MQL). The dominant fracture mechanism of CBN tool is diffusion and dissolution wear on the rake surface resulting in thinner cutting edge. Abrasive wear by hard inclusion in AISI4140 was dominant on the flank surface. Nano-MQL reduced tool wear comparing with the dry machining but chip evacuation should be considered. A cryogenically treated tool showed promising result in tool wear.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• 제20권5호
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• pp.553-558
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• 2011

This study have goal with conceptual design for offshore structures of high pressure drop control valve for localization valve for development accomplished with flow analysis based on provision of ANSI B16.34, ANSI B16.10, ANSI B16.25. In order to localize the Offshore structures high pressure drop control valve. This study is numerical analysis for zambil offshore project of high pressure drop control valve. The solver which ANSYS workbench used for offshore structures analysis. The working fluids assumed the glycerin(C3H8O3). The structural analysis used ANSYS which is a commercial code. Stress analysis result of internal pressure in valve showed lower than yield strength. This is expect to need more detail design and verification for stem and disk structure. In this study a multi-disk of high pressure drop control valve is designed and manufactured. Then, the flow rate and high pressure dorp of fluids flowing in the high pressure drop control valve is CAE. So, this system can be easily substituted for the existing zambil offshore project system. Finally, safety estimation for trim design of high pressure drop control valve for offshore structures.

• Journal of Korean Institute of Industrial Engineers
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• 제40권3호
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• pp.257-266
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• 2014

The semiconductor manufacturing industry is managed by a number of parameters from the FAB which is the initial step of production to package test which is the final step of production. Various methods for prediction for the quality and yield are required to reduce the production costs caused by a complicated manufacturing process. In order to increase the accuracy of quality prediction, we have to extract the significant features from the large amount of data. In this study, we propose the method for extracting feature from the cell level data of probe test process using OPTICS which is one of the density-based clustering to improve the prediction accuracy of the quality of the assembled chips that will be placed in a package test. Two features extracted by using OPTICS are used as input variables of quality prediction model because of having position information of the cell defect. The package test progress for chips classified to the correct quality grade by performing the improved prediction method is expected to bring the effect of reducing production costs.

• Journal of the Korean Society of Manufacturing Process Engineers
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• 제2권2호
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• pp.98-105
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• 2003

In the experimental study, wire EDM was conducted for cold die steel by changing the Wire electrode, peak discharge current and number of finish cut. From the micro structure analysis of SEM photographs, the size of irregular welded and added component on the EDMed surface is decreasing and size of EDMed plane surface is increasing as the decreasing peak current and increasing number of finish cut. From the analysis of coating effect, Zn component is highly contained in Br and Zn Wire EDMed surface and copper component is highly contained in Br and Al wire EDMed surface. Hardness values are Increasing as the increasing peak current and decreasing the number of finish cut The value of hardness is decreasing as Cu, Al, Zn and Br wire electrode because of the residual austenite effect of solid solution copper on solidification, and finally EDMed surface has the highest hardness values for every wire electrode. Yield strength values becomes larger and bending strength values become smaller due to the increasing the hardness. These results are increased as increasing brittleness with hardness.

• Transactions of the Korean Society of Machine Tool Engineers
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• 제15권6호
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• pp.58-63
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• 2006

FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\Phi}10nm$ and smaller is available. Since general FIB uses very short wavelength and extremely high energy, it can directly make a micro structure less than $1{\mu}m$. As a result, FIB has been probability in manufacturing high performance micro devices and high precision micro structures. Until now, FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, IC error correction, etc. In this paper FIB-Sputtering and FIB-CVD characteristic analysis were carried out according to $Ga^+$ ion beam current that is very important parameter for minimizing the pattern size and maximizing the yield. Also, for FIB-Sputtering burr caused by redeposition of the substrate characteristic analysis was carried out.