• Microbiology and Biotechnology Letters
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• v.25 no.4
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• pp.427-433
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• 1997

Sludge Returned CMAS process was applied to treat the wastewater from electric accessory manufacturing company while this type of wastewater was usually treated by chemical process. This result show that the removal rate of TCOD was about 70-80% regardless of hydraulic retention time, On the contrary, the removal rate of BOD was abtained in a range of 77-92% depending on hydraulic retention time. In order to remove more than 80% of organic materials with the proposed process, the F/M ratio should be maintained below 0.17. In this case, the calculated value of organic removal rate, Km, was calculated to be 1.26 hr$^{-1}$, and the ratio of cell synthesis/total energy was 0.32 and 0.26 for COD and BOD base, respectively. The yield coefficient was calculated to be 0.242 and the half velocity coefficient was 0.3 hr$^{-1}$. The value of endogenous respiration coefficient was 0.02 hr$^{-1}$. The measured effluent BOD concentration, MLSS concentration in aeration tank, oxygen uptake rate, and sludge production were matched relatively well with the calculated values using above coefficients, In order to optimize the dewatering of sludge, the hydraulic retention time was recommended to be 15. 6 hrs. These results indicate that the wastewater from an eletric accessory manufacturing company can be treated safely with a biological process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.4
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• pp.400-406
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• 2015

This study researched the structure of the source of an ion milling machine used to fabricate a scanning electron microscope (SEM) sample. An ion source is used to mill out samples of over 1 mm dimension using a broad ion beam to generate plasma between the anode and cathode using a permanent magnet. To mill the sample in the vacuum chamber, the ion source should be greater than 6 kV for a positive ion current over $200{\mu}A$. To discover the optimum operating conditions for the ion miller, the diameter of the extractor, anode shape, and strength of the permanent magnet were varied in the experiments. A silicon wafer was used as the sample. The sputter yield was measured on the milled surface, which was analyzed using the SEM. The wafer was milled by injecting 1 sccm of argon gas into the 0.5 mTorr vacuum chamber.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.81-88
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• 2020

The damping hinge of a built-in refrigerator was examined in terms of its stress and fatigue life. Analysis of the initial design showed that stress concentration occurred at the concave surface of the hinge lever, which was broken during the door opening-and-closing endurance test of the prototype. The maximum von Mises stress at this location exceeded the yield strength. In addition, Goodman fatigue analysis of the initial design showed that the fatigue life at this location was consistent with the failure observed during the endurance test. Based on these results, an improved design for the damping hinge was derived. Analysis of this improved design showed that the stress concentration in the hinge lever of the initial design was eliminated. In this case, the maximum stress occurred at the position where the hinge lever was in contact with the door stopping pin, and the maximum von Mises stress was smaller than the yield strength. Goodman fatigue analysis of the improved design indicated that the fatigue life of the entire damping hinge was infinite. It was therefore concluded that the improved design does not suffer from fatigue damage during the endurance test.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.47-54
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• 2020

Themo-mechanical analysis was carried out using the finite element method for the steel shell of a cupola furnace. When the outer surface of the shell was cooled with water to within the temperature range of 35-80 ℃ during operation of the cupola, the inner surface of the shell was expected to exhibit a temperature of 65-248 ℃ based on heat transfer analysis. The shell was also expected to have an equivalent stress range of 100-280 MPa in the outer surface over the temperature range examined. Upon cooling the shell to obtain an outer surface temperature <80 ℃, the maximum equivalent stress of the shell did not exceed the yield strength. Although the temperature of the outer surface varied between 35 and 80 ℃ periodically due to the cooling control problem, the fatigue stress at the outer surface of the shell was calculated to be within the fatigue strength. During a non-operational period to examine the system between furnace operations, the thermal stress presented in the shell was sufficiently low to reach the desired yield strength and fatigue limit.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.3
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• pp.86-92
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• 2004

This paper describes the properties of temperature-viscosity characteristics of hydrous and anhydrous electro-rheological fluids containing starch and titanium particle in silicone oil ER effects arise from electrostatic forces between the starch particles and titanium particles dispersed to the electrically insulating silicone oil induced when electric field is applied ER fluids under electric field control have been found to provide resonable estimates of ER fluid viscosity variation characteristics. Yield shear stress of the ER fluids were measured the couette cell type rheometer as a function of electrlc fields. The outer cup is connected to positive electrode(+) and bob becomes ground(-). The electrie field is applied by high voltage DC power supply. In this experiment shear rates were increased from 0 to 200 $s^{-1}$ in 2 minutes. The ER fluid's viscosity change is very small and stable at the temperature range of $40^{\circ}C$ to $60^{\circ}C$. Therefore, applications of a new ER fluid to control systems application are suitable.

• Journal of Pharmaceutical Investigation
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• v.25 no.3
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• pp.213-221
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• 1995

The steady shear flow properties of six kinds of commercial toothpastes were measured using a concentric cylinder type rheometer. In this paper, the shear rate and temperature dependencies of their flow behavior were investigated and the validity of the Casson and Herschel-Bulkley models was examined. Further, the flow properties over a wide temperature range were quantitatively evaluated by calculating the various material parameters. Main results obtained from this study can be summarized as follows: (1) Toothpastes are plastic fluids with a yield stress and their flow behavior shows shear-thinning characteristics. (2) With increasing temperature, the degree of shear-thinning becomes weaker and the Newtonian flow behavior occurs at a lower shear rate range. (3) The Herschel-Bulkley model is more effective than the Casson model in predicting their flow behavior. (4) As the temperature increases, the yield stress, plastic viscosity and consistency index become smaller, on the contrary, the flow behavior index becomes larger.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.24 no.3
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• pp.96-104
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• 1998

It was possible to produce W/O/W one step multiple emulsion on the system which satisfied following conditions. 1. 1-5％ of hydrophilic liquid surfactant over HLB20 and lipophilic liquid surfactant which has HLB 3∼5 2. Non wax copolymers as oil thickener 3. More than 0.5％ of carbomer as aqueous thickener 4. The manufacturing process which neutralize the dispersed carbomer (2.0％ in water), after emulsifying. For the selective addition into inner and outer aqueous phase, we melted the glucose in water before emulsifying. Using an Anthrone analysis method, we analyzed the encapsulation yield of glucose in inner water phase. It was possible to raise the water encapsulation yield of the multiple emulsion through the following conditions. 1. Using of anionic hydrophilic surfactant(HLB 40) and lipophilic surfactant (HLB 3∼5) 2. Controlling the ratio of hydrophilic surfactant and lipophilic surfactant 3. Strengthening interface with increase of non wax oil thickener. When the separated adding process of glucose was adopted, approximately 85％ of glucose was added selectively within inner aqueous phase.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.5
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• pp.57-63
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• 2010

Tolerance analysis is one of the most important processes to improve the image quality of products. High resolution camera module for mobile phones needs precision assembly technology since the module becomes smaller and thinner. This paper will focus on the unit tolerance and the assembly tolerance which can affect the performance of the module. Lens shading and relative illumination were used to evaluate the optical axis scatter for each component on camera and estimate the assembly yield rate based on the evaluation result. A program was developed to analyze the impact on optical axis by each module, then to optimize the dimensions and tolerance for reducing the scatter of optical axis assembly. Through the simulation, though a rate of relative illumination was declined in where optical axis is displaced $100{\mu}m$ from sensor center, MTF performance is not influenced by increasing in optical axis displacement. It was seen that assembly yield was improved in result of simulation after correcting optical axis tolerance.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.74-84
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• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.