• 제목/요약/키워드: MTTF

검색결과 82건 처리시간 0.063초

플랜트 가용도 평가 시뮬레이터의 신뢰성 검증에 관한 연구 (A Study on the Reliability Verification of Availability Simulation for Complex Plant)

  • 이홍철;황인주;이현동
    • 한국CDE학회논문집
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    • 제20권1호
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    • pp.36-43
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    • 2015
  • Recently, a number of evaluation studies on availability of plant were carried out. This study was conducted to verify of the reliability of a simulation with some variable such as configuration of process, failure probability density function and the number of iteration times for the natural gas liquefaction plant. The error rate of the KICT-RAM solution was evaluated as 0.03~1.79% compared with the result of the MAROS(commercial solution). And the error-rate change was observed in the range of 0.03~1.75 on the condition of the iteration times as 30, 100, 250. As a result the plant availability evaluation approach of KICT-RAM solution was verified as reasonable. However, the careful approach was required to use the solution because the error-rate increased according to iteration times change.

2-Bayes 이론을 이용한 데이터 처리방법에 관한 연구 (A Study on the Processing Method of Reliability Database using 2-Bayes Theory)

  • 이만수;이광원;김태훈;윤익근;오영달;서두현
    • 한국안전학회지
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    • 제24권6호
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    • pp.144-149
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    • 2009
  • The safety assessment for facility industry is now being periodically performed in Korea. For the purpose of scientific safety management, QRA(Quantitative Risk Assessment) is also being performed, and reliability data of the facilities is essential to perform the assessment. The necessary reliability data for QRA have been generally announced the values in other process industries, which results in the drop of risk reliability. The most appropriate method is to perform a direct reliability analysis towards the facilities undergoing safety assessment. In this study, the distinction between homogeneous sample estimation and multi-sample estimation of reliability data clarify using 2-Bayes theory.

통계적 방법을 이용한 연료승압펌프의 신뢰도 예측 (Reliability Prediction of a Fuel Boost Pump using Statistical Methods)

  • 백낙곤;이형주;임진식
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2010년도 제35회 추계학술대회논문집
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    • pp.143-148
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    • 2010
  • 항공용 연료계통의 핵심부품인 연료승압펌프(FBP)의 신뢰도를 예측/평가하기 위하여 운용중에 지속적으로 발생되는 고장자료에 근거하여 고장추세분포를 도출하는데 Weibul Distribution 형태의 통계학적인 방법(Statistical Methods)을 사용하였다. 이를 토대로 하여 고장 자료분포를 시각적으로 분석하여 신뢰성 예측을 하였다. 분석결과, 형상모수(${\beta}$), 척도모수(${\eta}$) 및 평균고장시간(MTTF)을 산출하였다. 결과로부터 주요 고장원인이 기계부품의 마모나 노후화로 인하여 발생하는 마모고장기이며 산출된 평균고장시간 이전에 예방정비를 수행해야 사전에 고장을 방지할 수 있음을 알 수 있다.

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Operational behaviour and reliability measures of a viscose staple fibre plant including deliberate failures

  • Sengar, Surabhi;Singh, S.B.
    • International Journal of Reliability and Applications
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    • 제13권1호
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    • pp.1-17
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    • 2012
  • This Paper deals with the stochastic behavior and failure analysis of a Viscose Staple Fibre Plant which produces fibre for making clothes. The fibre making plant is a complex system with various subsystems as: Vendor (supplies Charcoal and Sulphur, raw materials for the process), Carbon di sulphide Plant, Acid Plant, Pulp Plant and Processing Plant. The considered system can completely fail due to failure of any of the subsystems. The Carbon di Sulphide Plant can fail in two different ways, due to lack of Sulphur or Charcoal. Processing Plant has the configuration 5-out-of-10: d and 6-out-of-10: f. It is also assumed that the system can fail due to workers strike and catastrophic failure. All failures follow exponential time distribution whereas all repairs follow general time distribution. Preventive Maintenance policy has been applied to reduce the failure in the system. Various reliability characteristics such as transition state probabilities, steady state behavior, reliability, availability, M.T.T.F and the cost analysis have been obtained using supplementary variable technique and Gumbel-Hougaard copula methodology.

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전동차 인버터 구동용 전해콘덴서의 신뢰도예측과 수명 연구 (A Study on the Reliability Prediction and Lifetime of the Electrolytic Condenser for EMU Inverter)

  • 한재현;배창한;구정서
    • 한국안전학회지
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    • 제29권1호
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    • pp.7-14
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    • 2014
  • Inverter module, which feeds the converted power to the traction motor for EMU. Consists of the power semiconductors with their gate drive unit(GDU)s and the control computer for driving, voltage, current and speed controls. Electrolytic condenser, connected to the gate drive unit and a core component to drive the power semiconductor, has problems such as reduction in lifetime and malfunction caused by electrical and mechanical characteristic changes from heat generation during high speed switching for generation of stable power. In this study, To check the service life of electrolytic condenser, the test was carried out in two ways. First, In the case of accelerated life testing of condenser, the Arrhenius model is a way of life testing. Another way is to analyze the reliability of the failure data by the method of parametric data analysis. Eventually, life time by accelerated life test than a method of failure data analysis(Weibull distribution) was found to be slightly larger output.

Simulation Procedure for Estimating the Reliability of a System with Repairable Units+

  • S. Y. Baek;T.J. Lim;J. S. Hong;C. H. Lie;Park, Chang K.
    • 한국원자력학회:학술대회논문집
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    • 한국원자력학회 1996년도 춘계학술발표회논문집(2)
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    • pp.691-698
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    • 1996
  • This paper propose a procedure to estimate the system lifetime distribution using simulation method in a parametric framework and also develop the criterion for terminating the simulation. We assume that a system is composed of many components whose lifetime and repair time distributions are general, and repair of each component is imperfect or not. General simulation algorithms can not be adopted for this case, due to the dependency of successive operating times and the discontinuity in base line intensity function of failure process. Then we propose algorithms for generating failure times subject to imperfect repair. We develop the event time tracking logic for identifying the system failure time, and also develop the criterion for terminating the simulation. Our procedure is composed of two phases. The first phase of the procedure is to generate the system failure times from the inputs. The second phase is to estimate the lifetime distribution of the system. The best model is selected by a fully automated procedure among well-known parametric families, and the required parameters are estimated. We give examples to show the accuracy of our procedure and the effect of repair effect of components to system MTTF(Mean Time To Failure).

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Pump availability prediction using response surface method in nuclear plant

  • Parasuraman Suganya;Ganapathiraman Swaminathan;Bhargavan Anoop
    • Nuclear Engineering and Technology
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    • 제56권1호
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    • pp.48-55
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    • 2024
  • The safety-related raw water system's strong operational condition supports the radiation defense and biological shield of nuclear plant containment structures. Gaps and failures in maintaining proper working condition of main equipment like pump were among the most common causes of unavailability of safety related raw water systems. We integrated the advanced data analytics tools to evaluate the maintenance records of water systems and gave special consideration to deficiencies related to pump. We utilized maintenance data over a three-and-a-half-year period to produce metrics like MTBF, MTTF, MTTR, and failure rate. The visual analytic platform using tableau identified the efficacy of maintenance & deficiency in the safety raw water systems. When the number of water quality violation was compared to the other O&M deficiencies, it was discovered that water quality violations account for roughly 15% of the system's deficiencies. The pumps were substantial contributors to the deficit. Pump availability was predicted and optimized with real time data using response surface method. The prediction model was significant with r-squared value of 0.98. This prediction model can be used to predict forth coming pump failures in nuclear plant.

FMEA를 활용한 군수품 초도 생산 및 양산 단계의 위험 식별 방안 연구 (A Study on the Risk Identification Methods for Initial and Mass Production Stage of Military Products Using FMEA)

  • 이창희;양경우;박두일;이일랑;권준식;최일홍;김상부
    • 품질경영학회지
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    • 제42권3호
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    • pp.311-324
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    • 2014
  • Purpose: It can deduce improvement plan that recognizes any risk factors in initial production and mass production by using FMEA and through this process, the appropriate criteria for defence items can be established. Methods: It proposes two methodology - Apply DT/OT data achieved from the beginning mass production stage based on FMECA data of the design stage, to risk management, and risk management plan that reflected line and field faliure data in case of is offered. Results: It proposes the risk management plan through Bayesian method and the risk identification that considered MTTF estimated value in case of initial production process. In case of mass production process, both risk identification by using fault occurrence frequency scores and Byaesian method, In case of the Initial production and mass production, it proposes use both two methods. Conclusion: A more realistic risk identification method can be applied, and by this method the quality improvement effect is expected.

63Sn-37Pb 솔더 스트립에서의 Electromigration 거동 (Electromigration Behavior in the 63Sn-37Pb Solder Strip)

  • 임승현;최재훈;오태성
    • 마이크로전자및패키징학회지
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    • 제11권2호
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    • pp.53-58
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    • 2004
  • 63Sn-37Pb 공정솔더의 electromigration 현상을 용이하게 관찰하기 위해 63Sn-37Pb 공정솔 더를 증착하여 스트립 형태의 시편을 제작 후 electromigration 테스트를 실시하였다. $80{\sim}150^{\circ}C$의 온도 및 $1{\times}10^4{\sim}1{\times}10^5\;A/cm^2$의 전류밀도에서 electromigration 테스트시 스트립 형상의 63Sn-37Pb 솔더 합금에서 hillock과 void의 발생이 관찰되었으며, 온도와 전류밀도가 높아질수록 void의 형성이 빨라져서 평균파괴시간이 단축되었다. 평균파괴시간을 이용하여 Black의 식으로부터 구한 63Sn-37Pb 솔더 스트립의 electromigration에 대한 활성화 에너지는 $0.16{\sim}0.5\;eV$이었다.

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The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package

  • Kim, Hyun-Ho;Kim, Do-Hyung;Kim, Jong-Bin;Kim, Hee-Jin;Ahn, Jae-Ung;Kang, In-Soo;Lee, Jun-Kyu;Ahn, Hyo-Sok;Kim, Sung-Dong
    • 마이크로전자및패키징학회지
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    • 제17권3호
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    • pp.65-69
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    • 2010
  • In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.