• Title/Summary/Keyword: MPW

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Design of a Booth's Multiplier Suitable for Embedded Systems (임베디드 시스템에 적용이 용이한 Booth 알고리즘 방식의 곱셈기 설계)

  • Moon, San-Gook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.838-841
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    • 2007
  • In this study, we implemented a $17^*17b$ binary digital multiplier using radix-4 Booth's algorithm. Two stage pipeline architecture was applied to achieve higher throughput and 4:2 adders were used for regular layout structure in the Wallace tree partition. To evaluate the circuit, several MPW chips were fabricated using Hynix 0.6-um 3M N-well CMOS technology. Also we proposed an efficient test methodology and did fault simulations. The chip contains 9115 transistors and the core area occupies about $1135^*1545$ mm2. The functional tests using ATS-2 tester showed that it can operate with 24 MHz clock at 5.0 V at room temperature.

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Measuring Myun Health Worker's Performance by Time-Activity Approach (시간활동 접근법에 의한 면 보건요원의 업무량 분석)

  • Kim, Han-Joong;Kim, Moon-Shik
    • Journal of Preventive Medicine and Public Health
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    • v.10 no.1
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    • pp.34-43
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    • 1977
  • This study attempts to examine the performances of Myun Health Workers-the frontline workers in the Korean rural health care delivery system. The time-activity approach was mainly utilized as a measuring tool. This study was undertaken in September 1976 with 35 Myun Health Workers at the Kang Wha County. The pretested time-activity approach sheets were filled out daily for one month by those Myun Health Workers themselves. Statistical means and variances of analysis were utilized for statistical method in comparing some activities and functions converged into time distribution Findings: 1. The workers's average working hours derived in this study is 8 hours and 48 minutes per day, which takes half an hour longer than normal schedule. 2. They spend 56% working hour for direct services, in other words, the main function, 22% for supportive function, and 22% for other activities, the unrelated health services. 3. Considering the total working hours of main function, out-center activity is far more than in-center services with the ratio of 70% to 30% respectively, which proves, therefore, that the main activity of the workers is home visiting. 4. It takes 20 minutes purely for home visiting and takes 14 minutes for transportation. 5. This research also indicates that such factors as characteristics of the health workers and myun influence in shaping the structures of the worker's function and activity: a. The workers whose working site is located in myun office spend 15% among total working hours in carring out official myun activities, which is incidentally unrelated to health services, while the health subcenter have no rooms for administrative jobs for myun office. b. The workers whose office is in health subcenter contribute much time in doing main function and those working in special project distribute more time in performing supportive function. c. The types of workers are another dominant factor to influence the components of worker's functions and activities. MCH workers and MPW I spend much time for manipulating main function. d. MPW II, whose function is reorganized by special project in 2 myuns shows different pattern of time distribution compared to the TB worker orFP worker in the ordinary area. MPW II distributes their time evenly in performing MCH program, T.B. Program, F.P. program and education activity, while the unipurpose workers engage in carring out only their dominant role. e. Another variables which involve the variation of the worker's activity can be illustrated with the variables like target population, size of myun and convenience for transportation, among which the latter two are remarkable factors in determining the time for out-center service.

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Solid State Joining Processes for Dissimilar Joints of Mg/Al Alloys (고상접합을 이용한 Al/Mg 합금의 이종 용접)

  • Kim, Heung-Ju;Kim, Wook-Seong;Chun, Chang-Keun;Chang, Woong-Seong
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.41-41
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    • 2009
  • To evaluate the applicability of dissimilar joining between Mg and Al alloys in automobile manufacturing process, solid state joining processes such as magnetic pulse welding(MPW), friction stir welding(FSW) and friction spot joining(FSJ) were attempted successfully. MPW process has been concentrated mainly on round section tube to tube and tube to bar welds. AZ31 Mg alloy has been successfully welded to pure Al A1070 as well as to Al alloy A3003. While, for friction stir welding of dissimilar sheet joints, AZ31B/A6061 with the thickness of 2mm were used and a square butt joint with a good quality was obtained at the conditions of 0.8mm/sec of travel speed and tool rotation speed of 850rpm. The maximum tensile strength of 179 MPa, which was about 80 % of the Mg base metal tensile strength, has been obtained. Finally, friction spot joining was attempted to make a dissimilar lap joint between AZ31(0.8mm) and A6061(1mm), while the joint exhibited the same level of tensile shear strength as that of similar Mg joint.

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A Design of AES-based CCMP core for IEEE 802.11i Wireless LAN Security (IEEE 802.11i 무선 랜 보안을 위한 AES 기반 CCMP 코어 설계)

  • Hwang Seok-Ki;Kim Jong-Whan;Shin Kyung-Wook
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.31 no.6A
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    • pp.640-647
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    • 2006
  • This paper describes a design of AES-based CCMP(Counter mode with CBC-MAC Protocol) core for IEEE 802.11i wireless LAN security. To maximize the performance of CCMP core, two AES cores are used, one is the counter mode for data confidentiality and the other is the CBC node for authentication and data integrity. The S-box that requires the largest hardware in ARS core is implemented using composite field arithmetic, and the gate count is reduced by about 27% compared with conventional LUT(Lookup Table)-based design. The CCMP core was verified using Excalibur SoC kit, and a MPW chip is fabricated using a 0.35-um CMOS standard cell technology. The test results show that all the function of the fabricated chip works correctly. The CCMP processor has 17,000 gates, and the estimated throughput is about 353-Mbps at 116-MHz@3.3V, satisfying 54-Mbps data rate of the IEEE 802.11a and 802.11g specifications.

A Low Memory Bandwidth Motion Estimation Core for H.264/AVC Encoder Based on Parallel Current MB Processing (병렬처리 기반의 H.264/AVC 인코더를 위한 저 메모리 대역폭 움직임 예측 코어설계)

  • Kim, Shi-Hye;Choi, Jun-Rim
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.2
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    • pp.28-34
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    • 2011
  • In this paper, we present integer and fractional motion estimation IP for H.264/AVC encoder by hardware-oriented algorithm. In integer motion engine, the reference block is used to share for consecutive current macro blocks in parallel processing which exploits data reusability and reduces off-chip bandwidth. In fractional motion engine, instead of two-step sequential refinement, half and quarter pel are processed in parallel manner in order to discard unnecessary candidate positions and double throughput. The H.264/AVC motion estimation chip is fabricated on a MPW(Multi-Project Wafer) chip using the chartered $0.18{\mu}m$ standard CMOS 1P5M technology and achieves high throughput supporting HDTV 720p 30 fps.

Design of Digital Calibration Circuit of Silicon Pressure Sensors (실리콘 압력 센서의 디지털 보정 회로의 설계)

  • Kim, Kyu-Chull
    • Journal of IKEEE
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    • v.7 no.2 s.13
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    • pp.245-252
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    • 2003
  • We designed a silicon pressure sensor interface circuit with digital calibration capability. The interface circuit is composed of an analog section and a digital section. The analog section amplifies the weak signal from the sensor and the digital section handles the calibration function and communication function between the chip and outside microcontroller that controls the calibration. The digital section is composed of I2C serial interface, memory, trimming register and controller. The I2C serial interface is optimized to suit the need of on-chip silicon microsensor in terms of number of IO pins and silicon area. The major part of the design is to build a controller circuit that implements the optimized I2C protocol. The designed chip was fabricated through IDEC's MPW. We also made a test board and the test result showed that the chip performs the digital calibration function very well as expected.

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A DS-QPSK Chip Design and Fabrication for Home RF Wireless Sensors (홈 RF 무선 센서를 위한 DS-QPSK 모듈의 설계 및 칩 제작)

  • Lee Young-Dong;Lee Won-Ki;Jun Soo-Hyun;Chung Wan-Young
    • Proceedings of the IEEK Conference
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    • 2004.06b
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    • pp.411-414
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    • 2004
  • This paper introduces a modulation method for digital wireless communication based on general DS-QPSK. The design and fabrication is for home networking application to a typical RF transmitter with DS-QPSK modulator. This modulator implemented using VHDL hardware programming language, the fabrication of IC chip $5{\times}5 mm^2$ was carried by 27th IDEC MPW(Multi Project Wafer) process in 0.35${\mu}m$ rule at Samsung Inc. This paper presented the important of this technology for the future application in wireless sensor. This module can be efficient usage for home network to transmit the RF wireless sensor system.

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임베디드 SoC 응용을 위한 타원곡선알고리즘 기반 보안 모듈

  • Kim Young-Geun;Park Ju-Hyun;Park Jin;Kim Young-Chul
    • Review of KIISC
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    • v.16 no.3
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    • pp.25-33
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    • 2006
  • 본 논문에서는 임베디드 시스템 온칩 적용을 위한 통합 보안 프로세서를 SIP(Semiconductor Intellectual Property)로 설계하였다. 각각의 SIP는 VHDL RTL로 모델링하였으며, 논리합성, 시뮬레이션, FPGA 검증을 통해 재사용이 가능하도록 구현하였다. 또한 ARM9과 SIP들이 서로 통신이 가능하도록 AMBA AHB의 스펙에 따라 버스동작모델을 설계, 검증하였다. 플랫폼기반의 통합 보안 SIP는 ECC, AES, MD-5가 내부 코어를 이루고 있으며 각각의 SIP들은 ARM9과 100만 게이트 FPGA가 내장된 디바이스를 사용하여 검증하였으며 최종적으로 매그나칩 $0.25{\mu}m(4.7mm\times4.7mm)$ CMOS 공정을 사용하여 MPW(Multi-Project Wafer) 칩으로 제작하였다.

Implementation of Single-Wire Communication Protocol for 3D IC Thermal Management Systems using a Thin Film Thermoelectric Cooler

  • Kim, Nam-Jae;Lee, Hyun-Ju;Kim, Shi-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.1
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    • pp.18-23
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    • 2012
  • We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

A Study on Design for Heterogeneous MPSoC (이종 MPSoC 설계에 관한 연구)

  • Lee, Sang-Chol;Lee, Sung-Jae;Cha, Young-Ho;Kim, Kwan-Young
    • Proceedings of the Korea Information Processing Society Conference
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    • 2010.04a
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    • pp.82-85
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    • 2010
  • MPSoC 는 하나의 칩 안에 여러 개의 프로세서와 이를 뒷받침 하는 다수/다량의 메모리 시스템, 인터페이스, 그리고 그 밖의 여러 IP 등을 탑재하는 기술을 말하며, 본 논문에서는 이종의 EISC 프로세서, DSP 프로세서와 2D 벡터 그래픽 가속기를 이용하여 4 개의 프로세서로 구성된 이종 MPSoC를 설계하였다. 설계한 이종 MPSoC 는 Global Foundies 0.13um MPW 공정으로 구현하였으며, 테스트 보드 상에서 2D 벡터 그래픽 가속기와 DSP 프로세서를 이용한 이미지 처리 및 오디오 재생을 통하여 동작을 검증하였다.