• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• 한국전기화학회:학술대회논문집
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• 2004.04a
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• pp.27-27
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• 2004

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.119-123
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• 2009

Recently, a MEMS gyroscope has been broadly fabricated and used due to development of a micromachining. However, there is a difference between the modeling design and the actual product and this difference can lead to the performance variation of a MEMS gyroscope. A classical design method does not exactly estimate the performance of a MEMS gyroscope. Therefore a design process considering the design variable uncertainty has to be employed to design MEMS gyroscope model. In this paper, the equation of motion of a MEMS gyroscope model is obtained to analyze the performance of a MEMS gyroscope and the effects of the design variables on the MEMS gyroscope performance are investigated. Finally the performance of MEMS gyroscope is estimated through a statistical analysis based on sample statistics.

• The Bulletin of The Korean Astronomical Society
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• v.32 no.2
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• pp.21-21
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• 2007

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.118-121
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• 2003

A new approach, using MEMS, for improving the performance of high efficiency amplifiers is proposed in this paper. The MEMS tuning element is described as a variable-length shorted CPW stub. Class-E amplifiers can be optimally tuned by these MEMS tuning elements because their operation varies with the impedance of the output tuning circuit. A MEMS tuning element was simulated using full-wave EM simulators to obtain its S-parameters. A Class-E amplifier with the MEMS was designed at 8GHz. The non-linear operation of this amplifier was simulated to explore the effect of the MEMS tuning. Comparing the initially designed amplifier without MEMS, the Power Added Efficiency (PAE) of the amplifier with MEMS is improved from 46.3% to 66.9%. For the amplifier with MEMS, the nonlinear simulation results are PAE = 66.90%, $\eta$(drain efficiency) = 75.89%, and $P_{out}$ = 23.37 dBm at 8 GHz. In this paper, the concept of the MEMS tuning element is successfully applied to the Class E amplifier designed with transmission lines.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.394-399
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• 2012

In recent years, MEMS sensors show huge attraction in machine condition monitoring, which have advantages in power, size, cost, mobility and flexibility. They can integrate with smart sensors and MEMS sensors are batch product. So the prices are cheap. And the suitability of it for condition monitoring is researched by experimental study. This paper presents a comparative study and performance test of classification of MEMS sensors in target machine fault classification by 3 intelligent classifiers. We attempt to signal validation of MEMS sensor accuracy and reliability and performance comparisons of classifiers are conducted. MEMS accelerometer and MEMS current sensors are employed for experiment test. In addition, a simple feature extraction and cross validation methods were applied to make sure MEMS sensors availabilities. The result of application is good for using fault classification.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.11
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• pp.180-187
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• 2003

A CAD-based seamless design system for MEMS named DS/MEMS was developed which performs coupled-field analysis, optimal and robust design. DS/MEMS has been developed by means of integrating commercial codes and inhouse code-SolidWorks, FEMAP, ANSYS and CA/MEMS. This strategy results in versatility that means to include various analysis model, corresponding analyses and approximated design sensitivity analysis and user friendliness that design variables are taken to be selectable directly from a CAD model, that the problem is formulated under a window environment and that the manual job during optimization process is almost eliminated. DS/MEMS works on a parametric CAD platform, integrating CAD modeling, analysis, and optimization. Nonlinear programming algorithms, the Taguchi method, and response surface method are made available for optimization. One application problem is taken to illustrate the proposed methodology and show the feasibility of DS/MEMS as a practical tool.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.12
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• pp.1659-1666
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• 2018

When the input sound is mixed voice and sound, it can be seen that the voice recognition rate is lowered due to the noise, and the speech recognition rate is improved by improving the MEMS device which is the H / W device in order to overcome the S/W processing limit. The MEMS microphone device is a device for inputting voice and is implemented in various shapes and used. Conventional MEMS microphones generally exhibit excellent performance, but in a special environment such as noise, there is a problem that the processing performance is deteriorated due to a mixture of voice and sound. To overcome these problems, we developed a newly designed MEMS device that can detect the voice characteristics of the initial input device.

• Journal of KIISE:Computer Systems and Theory
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• v.34 no.2
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• pp.49-56
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• 2007

MEMS-based storage is being developed as a new storage media. Due to its attractive features such as high-bandwidth, low-power consumption, high-density, and low cost, MEMS storage is anticipated to be used for a wide range of applications from storage for small handhold devices to high capacity mass storage servers. However, MEMS storage has vastly different physical characteristics compared to a traditional disk. First, MEMS storage has thousands of heads that can be activated simultaneously. Second, the media of MEMS storage is a square structure which is different from the platter structure of disks. This paper presents a new request scheduling algorithm for MEMS storage that makes use of the aforementioned characteristics. This new algorithm considers the parallelism of MEMS storage as well as the seek time of requests on the two dimensional square structure. We then extend this algorithm to consider the aging factor so that starvation resistance is improved. Simulation studies show that the proposed algorithms improve the performance of MEMS storage by up to 39.2% in terms of the average response time and 62.4% in terms of starvation resistance compared to the widely acknowledged SPTF (Shortest Positioning Time First) algorithm.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.2
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• pp.44-52
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• 2002

본 논문에서는 RF와 마이크로파 응용을 위한 MEMS 수동 소자에 대한 내용이다. 이 수동 소자들을 만들기 위해서 개발된 3타원 MEMS공정은 기존의 실리콘 공정과 완전한 호환성을 가지고 한 칩으로 집적화 시킬 수 있는 공정이다. 이 3차원 MEMS 공정은 기존 실리콘 긍정이 가지고 있는 한계를 극복하기 위한 방법으로써 개발되었다. 개발된 공정을 이용하여 실리콘 공정에서 구현할 수 없었던 좋은 성능의 인덕터, 트랜스포머 및 전송선을 RF와 마이크로파 응용을 위해서 구현하였다. 저 전압, 높은 차단율을 위한 push-pull 개념을 도입한 MEMS 스위치를 구현하였다. 또한 높은 Q를 갖는 MEMS 인덕터를 최초로 CMOS 칩과 집적화에 성공하여 600kHz 옵셋 주파수에서 -122 dBc/Hz의 특성을 갖는 2.6 GHz 전압 제어 발진기를 제작하였다.