• 센서학회지
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• 제20권1호
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• pp.58-63
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• 2011

A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

• 한국측량학회지
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• 제36권2호
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• pp.75-84
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• 2018

본 연구의 목적은 MEMS 기반의 INS를 적용한 저가형 MMS를 개발하고, 개발된 MMS를 이용하여 x, y의 평면 거리오차가 0.546m인 정확도를 확보하여 도로시설물의 판독에 활용하고자 함에 있다. MMS 기술은 해외 유수의 측량장비제작 업체를 중심으로 지리정보 구축을 위한 새로운 측량기술로 활발하게 사용되고 있지만 국내에서는 아직 관련 연구가 초기단계에 있다. 또한, MMS 장비개발은 몇몇 연구원 및 업체에서 시도를 하였으나 안정화가 이루어지지 않은 시작품 단계에 불과하다. 이러한 MMS 기술은 빠른 시간 내에 지형 지물 데이터를 취득할 수 있어 정밀지도 제작과 도로시설물 데이터 취득에 활용되고 있다. 따라서 본 연구에서는 MMS 제작에 사용하는 각종 센서(LiDAR, CCD camera, GPS/INS, DMI 등)를 동기화하여 MEMS 기반의 INS를 탑재한 저가형 MMS를 개발하고자 한다.

• 센서학회지
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• 제31권5호
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• pp.286-292
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• 2022

As mobile electronics become smarter, higher-level security systems are necessary to protect private information and property from hackers. For this, biometric authentication systems have been widely studied, where the recognition of unique biological traits of an individual, such as the face, iris, fingerprint, and voice, is required to operate the device. Among them, ultrasound fingerprint imaging technology using piezoelectric materials is one of the most promising approaches adopted by Samsung Galaxy smartphones. In this review, we summarize the recent progress on piezoelectric ultrasound micro-electro-mechanical systems (MEMS) transducers with various piezoelectric materials and provide insights to achieve the highest-level biometric authentication system for mobile electronics.

• 센서학회지
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• 제25권2호
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• pp.116-123
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• 2016

This paper presents the fabrication and evaluation of the novel drag force type air flowmeter using MEMS technologies for the vehicle applications. To obtain the air drag force, the flowmeter utilized the curved beam structure, which was realized by the difference of residual stress between the silicon oxide layer and the silicon nitride layer. The paddle structure was applied for the maximum air drag force, and the dual-beam was adapted to prevent distortion. The basic experiments were performed in the wind tunnel, and the stable outputs were obtained. The device was applied to the internal combustion engine, and the results were compared with the HI-DS output where the convection thermal flowmeter was used as the reference sensor. The results indicated that the comparable resolutions and response times were obtained under the various engine speeds.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.132-137
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• 2022

In this paper, we have studied the quadrature error reduction for the single drive 3-axis MEMS Gyroscope. There was a limitation of the previous study which is the z-axis quadrature error was large. To reduce this value, design methodologies were presented. And the methodologies included a different mesh application, z-rate spring structure change, and mass compensation for balancing of the structure. We conducted the modal analysis, drive mode analysis and sense mode analysis using COMSOL Multiphysics. As a result, a drive resonant frequency was 26003 Hz, with the x-sense, y-sense, z-sense being 26749 Hz, 26858 Hz, 26920 Hz, respectively. And the Mechanical sensitivity was computed at 2000 degrees per second(dps) input angular rate while the sensitivity for roll, pitch, and yaw was computed 0.011, 0.012, and 0.011 nm/dps respectively. And z-axis quadrature error was successfully improved, 2.78 nm to 0.95 nm, which the improvement rate was about 66 %.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1718-1723
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• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Journal of Electrical Engineering and Technology
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• 제8권3호
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• pp.610-612
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• 2013

A novel balanced distributed amplifier (DA) was proposed using novel impedance transforming MEMS baluns. The impedance transforming MEMS balun is matched to $50{\Omega}$ at one input port and $25{\Omega}$ at two output ports. It is based on the electric field mode-change method, thus it is strongly independent of frequency and very compact. The novel balanced DA consists of two $25{\Omega}$-matched DAs and these are combined by $50{\Omega}$-to-$25{\Omega}$ baluns. Theoretically, it has two times wider bandwidth and power capability than the conventional DA. So as to verify the proposed concept, we designed and fabricated a conventional DA and the proposed one using 0.15-${\mu}m$ GaAs pHEMT technology.

• 소성∙가공
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• 제11권7호
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• pp.575-580
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• 2002

To evaluate elastic and micro-failure properties of MEMS materials, the electro-statically operated test devices were designed and fabricated by micro machining technology. The test structures consist or comb drives for loading and suspending beams in testing. From the analysis of beam displacement based on elastic beam theory, elastic modulus and yield strength of Al film were measured. And, by introducing the micro notch and cyclic loading, the micro-failure was Induced and the micro-fracture toughness of Si film was evaluated. Moreover, the cycles to failure were estimated from the degradation of resonant frequency. Finally, the effects of notch on micro failure were discussed.

• 센서학회지
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• 제19권4호
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• pp.320-327
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• 2010

In this paper, electrostatically actuated direct contact type RF MEMS switches have been designed and demonstrated. As driving structures of the switch, cantilever, bridge, and torsion spring beam structures are used and the actuation voltage characteristics of the switches have been compared and discussed. The designed RF switches are fabricated with the surface micromachining technology using the electroplated gold and nickel structures. The characteristics of the fabricated switches are measured and analyzed. The switch, which is fabricated using the 510 ${\mu}m$-length bridge structure with the thickness of 1.5 ${\mu}m$, is actuated with 15 V driving voltage. The insertion losses are less than 0.2 dB over the measured frequency ranges from 0 to 20 GHz and the isolations are more than 30 dB.