• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• JSTS:Journal of Semiconductor Technology and Science
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• 제7권3호
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• pp.183-195
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• 2007

MEMS technology is proven to be an enabling technology to realize many components for optical networking applications. Due to its widespread applications, VOA has been one of the most attractive MEMS based key devices in optical communication market. Micromachined shutters and refractive mirrors on top of silicon substrate or on the device layer of SOI (Silicon-on-insulator) substrate are the approaches trapped tremendous research activities, because such approaches enable easier alignment and assembly works. These groups of devices are known as the planar VOAs, or two-dimensional (2-D) VOAs. In this review article, we conduct the comprehensively literature survey with respect to MEMS based planar VOA devices. Apparently MEMS VOA technology is still evolving into a mature technology. MEMS VOA technology is not only the cornerstone to support the future optical communication technology, but the best example for understanding the evolution of optical MEMS technology.

• 센서학회지
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• 제19권4호
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• pp.259-270
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• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1969-1971
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• 2002

This paper presents the design and performance of low pull-in voltage MEMS switches for commercial cellular/PCS applications. The switches have all-metal (3 ${\mu}m$ thick Au) movable plates over CPW(Coplanar Waveguide) transmission line. The stress gradient in a movable plate is considered in mechanical design to obtain an accurate pull-in voltage. Series metal-to-metal contact switches are fabricated and evaluated. Those switches exhibit the low loss(<0.2 dB @1.9 GHz) with good isolation(55 dB @1.9 GHz).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 The IMAPS-Korea Workshop 2000 Emerging Technology on Packaging
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.147-150
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• 2005

Low actuation voltage and no contact stiction are the important factors to apply MEMS RF switches to mobile devices. Conventional electrostatic MEMS RF switches require several tens of voltages for actuation. In this paper we propose PAS MEMS RF switch which adopt PZT actuators and seesaw cantilevers to meet the above requirements. The fundamental structures of PAS MEMS switch were designed, optimized, and fabricated. Through the developed processes PAS SPDT MEMS RF switches were successfully fabricated on 4" wafers and they showed good electrical properties. The driving voltage was less than 5 volts. And the insertion loss was -0.5dB and the isolation was 35dB at 5GHz. The switching speed was about 5kHz. So these MEMS RF switches can be applicable to mobile communication devices or wireless multi-media devices at lower than 6GHz.

• Journal of Mechanical Science and Technology
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• 제18권5호
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• pp.789-797
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• 2004

The nanoscale sensing and manipulation have become a challenging issue in micro/nano-robotic applications. In particular, a feedback sensor-based manipulation is necessary for realizing an efficient and reliable handling of particles under uncertain environment in a micro/nano scale. This paper presents a piezoresistive MEMS cantilever for nanoscale force measurement in micro robotics. A piezoresistive MEMS cantilever enables sensing of gripping and contact forces in nanonewton resolution by measuring changes in the stress-induced electrical resistances. The calibration of a piezoresistive MEMS cantilever is experimentally carried out. In addition, as part of the work on nanomanipulation with a piezoresistive MEMS cantilever, the analysis on the interaction forces between a tip and a material, and the associated manipulation strategies are investigated. Experiments and simulations show that a piezoresistive MEMS cantilever integrated into a micro robotic system can be effectively used in nanoscale force measurements and a sensor-based manipulation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.55-60
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• 2001

RF MEMS is an exciting emerging technology that has great potential to develop TOC (Transceiver-on-Chip). Applications of the RF MEMS to wireless communications systems are presented. The ability of the RF MEMS technology to enhance the performance and to reduce the size of passive components, in particular, switches, inductors, and tunable capacitors, is addressed. A number of potential wireless system opportunities for the TOC are awaiting the maturation of the RF MEMS technology.

• 한국정밀공학회지
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• 제17권11호
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• pp.25-35
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• 2000

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.13-22
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• 2004

MEMS 소자의 패키지는 일반적으로 패키징 과정에서 큰 온도변화를 받게 되는데, 이에 의한 패키지의 변형은 패키지 및 소자의 신뢰성에 큰 영향을 미칠 수 있다. 본 논문에서는 진동형 MEMS 자이로스코프 센서의 패키지를 대상으로 하여, 온도변화로 인한 열변형 거동에 대한 광학실험과 해석을 수행하였다. 이를 위하여 실시간 모아레 간섭계를 이용하여 각 온도단계에서 변위분포를 나타내는 간섭무늬를 얻고, 그로부터 MEMS 패키지의 굽힘변형 거동 및 인장변형에 대한 해석을 수행하였다. MEMS 칩과 EMC 및 PCB의 열팽창계수 차이로 인하여 패키지는 $125^{\circ}C$ 이하에서는 전체적으로 아래로 볼록한 굽힘변형이 발생하였으며, 온도 $140^{\circ}C$를 정점으로 그 이상의 온도에서는 반대의 굽힘변형이 발생하였다. MEMS의 주파수에 영향을 줄 수 있는 칩 자체의 수축변형률은 약 $481{\times}10^{-6}$로 측정되어서 MEMS 설계시 이를 고려하여야 함을 알 수 있다.