• Title/Summary/Keyword: MEMS sensor

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Fabrication of Microstructures for Conductive Polymer Actuators Using MEMS Process (MEMS 공정을 이용한 전도성 고분자 액추에이터용 마이크로 구조물의 제작)

  • Lee, Seung-Ki;Jung, Seng-Hwan
    • Journal of Sensor Science and Technology
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    • v.12 no.4
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    • pp.156-163
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    • 2003
  • Polypyrrole microactuators have been fabricated by the standard surface micromachining method combined with the electropolymerization of polypyrrole. The fundamental structure to verify the feasibility of the fabrication process is polypyrrole cantilever. Based on these process, polypyrrole grippers and valves for the manipulation of the cell have been fabricated. Grippers have the structure of bone and muscle which are rigid polymers and polypyrrole, respectively. Valves have the assembled structure of channels with polypyrrole cantilevers. The proposed fabrication process and structures are expected to be used for bio-related applications, for example, the cell manipulation.

A Handheld Probe Based Optical Coherence Tomography System for Diagnosis of Dental Calculus (치석 진단용 소형 프로브 기반 광간섭단층촬영 시스템)

  • Lee, Chang-Ho;Woo, Chai-Kyoung;Jung, Woong-Gyu;Kang, Hyun-Wook;Oh, Jung-Hwan;Kim, Jee-Hyun
    • Journal of Sensor Science and Technology
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    • v.21 no.3
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    • pp.217-222
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    • 2012
  • Optical coherence tomography(OCT) is a noninvasive optical imaging tool for biomedical applications. OCT can provide depth resolved two/three dimensional morphological images on biological samples. In this paper, we integrated an OCT system that was composed of an SLED(Superluminescent Light Emitting Diode, ${\lambda}_0$=1305 nm bandwith= 141 nm), a reference arm adopting a rapid scanning optical delay line(RSOD) to get high speed imaging, and a sample arm that used a micro electro mechanical systems(MEMS) scanning mirror. The sample arm contained a compact probe for imaging dental structures. The performance of the system was evaluated by imaging in-vivo human teeth with dental calculus, and the results indicated distinct appearance of dental calculus from enamel, gum or decayed teeth. The developed probe and system could successfully confirm the presence of dental calculus with a very high spatial resolution($6{\mu}m$).

Ohmic contact characteristics of polycrystalline 3C-SiC for high-temperature MEMS applications (초고온 MEMS용 다결정 3C-SiC의 Ohmic Contact 특성)

  • Chung, Gwiy-Sang;Ohn, Chang-Min
    • Journal of Sensor Science and Technology
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    • v.15 no.6
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    • pp.386-390
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    • 2006
  • This paper describes the ohmic contact formation of polycrystalline 3C-SiC films deposited on thermally grown Si wafers. In this work, a TiW (titanium tungsten) film as a contact material was deposited by RF magnetron sputter and annealed with the vacuum process. The specific contact resistance (${\rho}_{c}$) of the TiW contact was measured by using the C-TLM (circular transmission line method). The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature as also analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscope). All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30 min., the lowest contact resistivity of $2.90{\times}10{\Omega}cm^{2}$ was obtained due to the improved interfacial adhesion. Therefore, the good ohmic contact of polycrystalline 3C-SiC films using the TiW film is very suitable for high-temperature MEMS applications.

A Study on the Fabrication of the Lateral Accelerometer using SOG(Silicon On Glass) Process (SOG(Silicon On Glass)공정을 이용한 수평형 미소가속도계의 제작에 관한 연구)

  • Choi, Bum-Kyoo;Chang, Tae-Ha;Lee, Chang-Kil;Jung, Kyu-Dong;Kim, Jong-Pal
    • Journal of Sensor Science and Technology
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    • v.13 no.6
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    • pp.430-435
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    • 2004
  • The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

Kinematic and Image Stabilization of a Two-axis Surveillance System on Ship (선상 2축 감시장비의 기구 및 영상 안정화)

  • Lee, Kyung-Min;Cho, Jae-Hyun;Kim, Ho-Bum;Lyou, Joon
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.49 no.4
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    • pp.55-60
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    • 2012
  • When operating a surveillance system in the maritime environment, its stabilization performance is degraded due to undesirable disturbance motions. For accurate target pointing of a 2-axes surveillance system on shipboard, the kinematic stabilization is first applied, which compensates a deviated motion via coordinate transformations of attitude information. Resultantly, the stabilization error is no longer reduced due to less accuracy of a MEMS sensor and kinematic constraint, leading to introduction of the image stabilization as a complementary function. And for real-time execution of the present dual stabilization scheme, a HILS (Hardware In the Loop Simulation) test bed including 6-dof motion simulator has been constructed, and through the obtained HILS data, it has been confirmed that the stabilization is successfully.

Development of the Compact Smart Device for Industrial IoT (산업용 IoT를 위한 초소형 스마트 디바이스의 개발)

  • Ryu, Dae-Hyun;Choi, Tae-Wan
    • The Journal of the Korea institute of electronic communication sciences
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    • v.13 no.4
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    • pp.751-756
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    • 2018
  • In smart factories and industrial IoT, all facilities in a factory are monitored over the Internet, thereby facility can reduce the downtime and increase the availiability by preventive maintenance before it breaks down. The abnormal conditions of the major facilities in the plant are caused by abnormal temperature rise, vibration, and variations in noise. Consequently, it is critical to develop a very small smart device that is easily installed in a small space to enable real-time monitoring of the vibration status of the facility. In this study, smart devices were developed for smart factory fault prediction and robustness management using ultra small micro-controllers with WiFi capabilities and MEMS acceleration sensors.

The Fabrication of Micro-Heaters with Low-Power Consumption Using SOI and Trench Structures

  • Chung, Gwiy-Sang;Hong, Seok-Woo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05a
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    • pp.197-201
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    • 2002
  • This paper presents optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SOI and trench structures. The micro-heaters are based on a thermal measurement principle and contains thermal isolation regions of 10 ${\mu}m$-thick Si membranes consisting of oxide-filled trenches in the SOI membrane rim. The micro-heaters were fabricated with Pt-RTD on the same substrate via MgO buff layer between Pt thin-film and $SiO_2$ layer. The thermal characteristics of micro-heater with trench-free SOI membrane structure was $280^{\circ}C$ at input power 0.9 W; in the presence of 10 trenches, it was $580^{\circ}C$ due to reduction of the external thermal loss. Therefore, a micro-heater with trenches in SOI membrane rim structure provides a powerful and versatile alternative technology for enhancing the performance of micro-thermal sensors and actuators.

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Ohmic contact formation of single crystalline 3C-SiC for high temperature MEMS applications (초고온 MEMS용 단결정 3C-SiC의 Ohmic Contact 형성)

  • Chung, Gwiy-Sang;Chung, Su-Yong
    • Journal of Sensor Science and Technology
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    • v.14 no.2
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    • pp.131-135
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    • 2005
  • This paper describes the ohmic contact formation of single crystalline 3C-SiC thin films heteroepitaxially grown on Si(001) wafers. In this work, a TiW (Titanium-tungsten) film as a contact matieral was deposited by RF magnetron sputter and annealed with the vacuum and RTA (rapid thermal anneal) process respectively. Contact resistivities between the TiW film and the n-type 3C-SiC substrate were measured by the C-TLM (circular transmission line model) method. The contact phases and interface the TiW/3C-SiC were evaulated with XRD (X-ray diffraction), SEM (scanning electron microscope) and AES (Auger electron spectroscopy) depth-profiles, respectively. The TiW film annealed at $1000^{\circ}C$ for 45 sec with the RTA play am important role in formation of ohmic contact with the 3C-SiC substrate and the contact resistance is less than $4.62{\times}10^{-4}{\Omega}{\cdot}cm^{2}$. Moreover, the inter-diffusion at TiW/3C-SiC interface was not generated during before and after annealing, and kept stable state. Therefore, the ohmic contact formation technology of single crystalline 3C-SiC using the TiW film is very suitable for high temperature MEMS applications.

Development of a MEMS Resonant Accelerometer Based on Robust Structural Design (강건 구조설계에 기반한 미소 공진형 가속도계의 개발)

  • Park, U-Sung;Boo, Sang-Pil;Park, Soo-Young;Kim, Do-Hyung;Song, Jin-Woo;Jeon, Jong-Up;Kim, Joon-Won
    • Journal of Sensor Science and Technology
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    • v.21 no.2
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    • pp.114-120
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    • 2012
  • This paper describes the design, fabrication and testing of a micromachined resonant accelerometer consisting of a symmetrical pair of proof masses and double-ended tuning fork(DETF) oscillators. Under the external acceleration along the input axis, the proof mass applies forces to the oscillators, which causes a change in their resonant frequency. This frequency change is measured to indicate the applied acceleration. Pivot anchor and leverage mechanisms are adopted in the accelerometer to generate larger force from a proof mass under certain acceleration, which enables increasing its scale factor. Finite element method analyses have been conducted to design the accelerometer and a silicon on insulator(SOI) wafer with a substrate glass wafer was used for fabricating it. The fabricated accelerometer has a scale factor of 188 Hz/g, which is shown to be in agreement with analysis results.

Non-invasive acceleration-based methodology for damage detection and assessment of water distribution system

  • Shinozuka, Masanobu;Chou, Pai H.;Kim, Sehwan;Kim, Hong Rok;Karmakar, Debasis;Fei, Lu
    • Smart Structures and Systems
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    • v.6 no.5_6
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    • pp.545-559
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    • 2010
  • This paper presents the results of a pilot study and verification of a concept of a novel methodology for damage detection and assessment of water distribution system. The unique feature of the proposed noninvasive methodology is the use of accelerometers installed on the pipe surface, instead of pressure sensors that are traditionally installed invasively. Experimental observations show that a sharp change in pressure is always accompanied by a sharp change of pipe surface acceleration at the corresponding locations along the pipe length. Therefore, water pressure-monitoring can be transformed into acceleration-monitoring of the pipe surface. The latter is a significantly more economical alternative due to the use of less expensive sensors such as MEMS (Micro-Electro-Mechanical Systems) or other acceleration sensors. In this scenario, monitoring is made for Maximum Pipe Acceleration Gradient (MPAG) rather than Maximum Water Head Gradient (MWHG). This paper presents the results of a small-scale laboratory experiment that serves as the proof of concept of the proposed technology. The ultimate goal of this study is to improve upon the existing SCADA (Supervisory Control And Data Acquisition) by integrating the proposed non-invasive monitoring techniques to ultimately develop the next generation SCADA system for water distribution systems.