• 제목/요약/키워드: MEMS fabrication

검색결과 415건 처리시간 0.031초

유독물질 질량분율 실시간 측정용 정전용량센서 제작 (Fabrication of capacitance sensor for real time harmful substance mass fraction mesurement)

  • 김영수;오정석
    • 한국연소학회:학술대회논문집
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    • 한국연소학회 2014년도 제49회 KOSCO SYMPOSIUM 초록집
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    • pp.337-338
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    • 2014
  • In this study, a method of using a capacitance sensor was investigated as a means to measure the mass fraction of a type of harmful substance. Using MEMS process, we developed a capacitance sensor and studied the real time mass fraction with harmful substance mixture liquid.

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THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION

  • Kim, Go-Eun;Lee, Jae-Ho
    • 한국표면공학회지
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    • 제32권3호
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    • pp.214-218
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    • 1999
  • The effect of additives in nickel and copper electroplating were investigated for MEMS applications. Saccharin and gelatin were used as additives in nickel and copper electroplating bath respectively. The morphology and surface hardness of electroplated coating were investigated with additive concentration. Microstructures were fabricated with optimum conditions.

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ELECTROLESS PLATING OF NICKEL FOR MICRO-STRUCTURE FABRICATION

  • Jin, Huh;Lee, Jae-Ho
    • 한국표면공학회지
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    • 제32권3호
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    • pp.331-335
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    • 1999
  • Electroless plating nickel has superior mechanical property to electroplated nickel. Furthermore nickel can be coated on nonconducting substrate. In this research, electroless plating of nickel were conducted in different bath condition to find optimum conditions of electroless nickel plating for MEMS applications. The selectivity of activation method on several substrates was investigated. The effects of nickel concentration, reducing agent concentration and inhibitor on deposition rate were investigated. The effect of pH on deposition rate and content of phosphorous in deposited nickel was also investigated.

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구배 지수에 근거한 MEMS 구조물의 강건 최적 설계 기법 (Gradient Index Based Robust Optimal Design Method for MEMS Structures)

  • 한정삼;곽병만
    • 대한기계학회논문집A
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    • 제27권7호
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    • pp.1234-1242
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    • 2003
  • In this paper we present a simple and efficient robust optimal design formulation for MEMS structures and its application to a resonant-type micro probe. The basic idea is to use the gradient index (GI) to improve robustness of the objective and constraint functions. In the robust optimal design procedure, a deterministic optimization for performance of MEMS structures is followed by design sensitivity analysis with respect to uncertainties such as fabrication errors and change of operating conditions. During the process of deterministic optimization and sensitivity analysis, dominant performance and uncertain variables are identified to define GI. The GI is incorporated as a term of objective and constraint functions in the robust optimal design formulation to make both performance and robustness improved. While most previous approaches for robust optimal design require statistical information on design variations, the proposed GI based method needs no such information and therefore is cost-effective and easily applicable to early design stages. For the micro probe example, robust optimums are obtained to satisfy the targets for the measurement sensitivity and they are compared in terms of robustness and production yield with the deterministic optimums through the Monte Carlo simulation. This method, although shown for MEMS structures, may as well be easily applied to conventional mechanical structures where information on uncertainties is lacking but robustness is highly important.

MEMS 공정 제작방법에 의한 솔레노이드형 여자 코일과 검출코일을 사용한 마이크로 플럭스게이트 센서 (MEMS-BASED MICRO FLUXGATE SENSOR USING SOLENOID EXCITATION AND PICK-UP COILS)

  • 나경원;박해석;심동식;최원열;황준식;최상인
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.172-176
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    • 2002
  • This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structured solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20um width and 3um thickness is electroplated on Cr(300${\AA}$)/Au(1500${\AA}$) films for the pick-up(42turn) and the excitation(24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3 $\mu\textrm{m}$ is obtained under 2000Gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ∼1,100 and coercive field of -0.1Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150V/T at the excitation frequency of 2MHz and the excitation voltage of 4.4Vp-p. The power consumption is estimated to be 50mW.

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대면적 플랫폼을 갖는 Probe-based Storage Device(PSD)용 정전형 2축 MEMS 스테이지 (Electrostatic 2-axis MEMS Stage with a Large Area Platform for Probe-based Storage Devices)

  • 정일진;전종업
    • 한국정밀공학회지
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    • 제23권9호
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    • pp.179-189
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    • 2006
  • Recently the electrostatic 2-axis MEMS stages have been fabricated f3r the purpose of an application to PSD (Probe-based Storage Device). However, all of the components (platform, comb electrodes, springs, anchors, etc.) in those stages are placed in-plane so that they have low areal efficiencies such as a few percentage, which is undesirable as data storage devices. In this paper, we present a novel structure of an electrostatic 2-axis MEMS stage that is characterized by having a large areal efficiency of about 25%. For obtaining large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. The structure and operational principle of the MEMS stage are described, followed by a design and analysis, the fabrication and measurement results. Experimental results show that the driving ranges of the fabricated stage along the x and y axis were 27$\mu$m, 38$\mu$m at the supplied voltages of 65V, 70V, respectively and the natural frequencies along x and y axis were 180Hz, 310Hz, respectively. The total size of the stage is about 5.9$\times$6.8mm$^2$ and the platform size is about 2.7$\times$3.6mm$^2$.

MEMS 공정을 이용한 단결정 실리콘 미세 인장시편과 미세 변형 측정용 알루미늄 Marker의 제조 (Fabrication of Single Crystal Silicon Micro-Tensile Test Specimens and Thin Film Aluminum Markers for Measuring Tensile Strain Using MEMS Processes)

  • 박준식;전창성;박광범;윤대원;이형욱;이낙규;이상목;나경환;최현석
    • 소성∙가공
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    • 제13권3호
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    • pp.285-289
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    • 2004
  • Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

RF MEMS Switches and Integrated Switching Circuits

  • Liu, A.Q.;Yu, A.B.;Karim, M.F.;Tang, M.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권3호
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    • pp.166-176
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    • 2007
  • Radio frequency (RF) microelectromechanical systems (MEMS) have been pursued for more than a decade as a solution of high-performance on-chip fixed, tunable and reconfigurable circuits. This paper reviews our research work on RF MEMS switches and switching circuits in the past five years. The research work first concentrates on the development of lateral DC-contact switches and capacitive shunt switches. Low insertion loss, high isolation and wide frequency band have been achieved for the two types of switches; then the switches have been integrated with transmission lines to achieve different switching circuits, such as single-pole-multi-throw (SPMT) switching circuits, tunable band-pass filter, tunable band-stop filter and reconfigurable filter circuits. Substrate transfer process and surface planarization process are used to fabricate the above mentioned devices and circuits. The advantages of these two fabrication processes provide great flexibility in developing different types of RF MEMS switches and circuits. The ultimate target is to produce more powerful and sophisticated wireless appliances operating in handsets, base stations, and satellites with low power consumption and cost.