• Journal of Sensor Science and Technology
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• v.26 no.5
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• pp.366-369
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• 2017

This work presents a detailed study of several parameters on the spray coating method for fabricating a flexible cantilever. Conventionally, spin coating method have been widely used in the microelectromechanical system (MEMS) fabrication process. However, the major drawback of this method is the difficulties in protecting various topography with photoresist film, particularly when the device is manufactured in high aspect ratio. It is also a challenging process to form a small pattern in the etched area. On the other hand, the commercial spray coating systems are not advantageous from an economic perspective and the technique is also providing less efficient. In order to solve these issues, we have developed a manual spray coating system which can be efficiently used by combining the accessories available in the laboratory. The developed spray coating system consists of a spin-coater, motorized stage, a spray gun with the capable of controlling centrifugal force, injection amount, injection angle, and spray range. The major advantage of the proposed spray coating system is its reasonable fabrication cost. Secondly, the system can be easily disassembled after finishing the coating experiment. Owing to the mentioned advantages, we sincerely believe that the proposed spray coating system can be effectively used in many related applications.

• Journal of Sensor Science and Technology
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• v.12 no.4
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• pp.156-163
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• 2003

Polypyrrole microactuators have been fabricated by the standard surface micromachining method combined with the electropolymerization of polypyrrole. The fundamental structure to verify the feasibility of the fabrication process is polypyrrole cantilever. Based on these process, polypyrrole grippers and valves for the manipulation of the cell have been fabricated. Grippers have the structure of bone and muscle which are rigid polymers and polypyrrole, respectively. Valves have the assembled structure of channels with polypyrrole cantilevers. The proposed fabrication process and structures are expected to be used for bio-related applications, for example, the cell manipulation.

• Journal of Sensor Science and Technology
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• v.21 no.3
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• pp.217-222
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• 2012

Optical coherence tomography(OCT) is a noninvasive optical imaging tool for biomedical applications. OCT can provide depth resolved two/three dimensional morphological images on biological samples. In this paper, we integrated an OCT system that was composed of an SLED(Superluminescent Light Emitting Diode, ${\lambda}_0$=1305 nm bandwith= 141 nm), a reference arm adopting a rapid scanning optical delay line(RSOD) to get high speed imaging, and a sample arm that used a micro electro mechanical systems(MEMS) scanning mirror. The sample arm contained a compact probe for imaging dental structures. The performance of the system was evaluated by imaging in-vivo human teeth with dental calculus, and the results indicated distinct appearance of dental calculus from enamel, gum or decayed teeth. The developed probe and system could successfully confirm the presence of dental calculus with a very high spatial resolution($6{\mu}m$).

• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.386-390
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• 2006

This paper describes the ohmic contact formation of polycrystalline 3C-SiC films deposited on thermally grown Si wafers. In this work, a TiW (titanium tungsten) film as a contact material was deposited by RF magnetron sputter and annealed with the vacuum process. The specific contact resistance (${\rho}_{c}$) of the TiW contact was measured by using the C-TLM (circular transmission line method). The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature as also analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscope). All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30 min., the lowest contact resistivity of $2.90{\times}10{\Omega}cm^{2}$ was obtained due to the improved interfacial adhesion. Therefore, the good ohmic contact of polycrystalline 3C-SiC films using the TiW film is very suitable for high-temperature MEMS applications.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.49 no.4
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• pp.55-60
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• 2012

When operating a surveillance system in the maritime environment, its stabilization performance is degraded due to undesirable disturbance motions. For accurate target pointing of a 2-axes surveillance system on shipboard, the kinematic stabilization is first applied, which compensates a deviated motion via coordinate transformations of attitude information. Resultantly, the stabilization error is no longer reduced due to less accuracy of a MEMS sensor and kinematic constraint, leading to introduction of the image stabilization as a complementary function. And for real-time execution of the present dual stabilization scheme, a HILS (Hardware In the Loop Simulation) test bed including 6-dof motion simulator has been constructed, and through the obtained HILS data, it has been confirmed that the stabilization is successfully.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.4
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• pp.751-756
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• 2018

In smart factories and industrial IoT, all facilities in a factory are monitored over the Internet, thereby facility can reduce the downtime and increase the availiability by preventive maintenance before it breaks down. The abnormal conditions of the major facilities in the plant are caused by abnormal temperature rise, vibration, and variations in noise. Consequently, it is critical to develop a very small smart device that is easily installed in a small space to enable real-time monitoring of the vibration status of the facility. In this study, smart devices were developed for smart factory fault prediction and robustness management using ultra small micro-controllers with WiFi capabilities and MEMS acceleration sensors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05a
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• pp.197-201
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• 2002

This paper presents optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro electro mechanical system) applications using SOI and trench structures. The micro-heaters are based on a thermal measurement principle and contains thermal isolation regions of 10 ${\mu}m$-thick Si membranes consisting of oxide-filled trenches in the SOI membrane rim. The micro-heaters were fabricated with Pt-RTD on the same substrate via MgO buff layer between Pt thin-film and $SiO_2$ layer. The thermal characteristics of micro-heater with trench-free SOI membrane structure was $280^{\circ}C$ at input power 0.9 W; in the presence of 10 trenches, it was $580^{\circ}C$ due to reduction of the external thermal loss. Therefore, a micro-heater with trenches in SOI membrane rim structure provides a powerful and versatile alternative technology for enhancing the performance of micro-thermal sensors and actuators.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.131-135
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• 2005

This paper describes the ohmic contact formation of single crystalline 3C-SiC thin films heteroepitaxially grown on Si(001) wafers. In this work, a TiW (Titanium-tungsten) film as a contact matieral was deposited by RF magnetron sputter and annealed with the vacuum and RTA (rapid thermal anneal) process respectively. Contact resistivities between the TiW film and the n-type 3C-SiC substrate were measured by the C-TLM (circular transmission line model) method. The contact phases and interface the TiW/3C-SiC were evaulated with XRD (X-ray diffraction), SEM (scanning electron microscope) and AES (Auger electron spectroscopy) depth-profiles, respectively. The TiW film annealed at $1000^{\circ}C$ for 45 sec with the RTA play am important role in formation of ohmic contact with the 3C-SiC substrate and the contact resistance is less than $4.62{\times}10^{-4}{\Omega}{\cdot}cm^{2}$. Moreover, the inter-diffusion at TiW/3C-SiC interface was not generated during before and after annealing, and kept stable state. Therefore, the ohmic contact formation technology of single crystalline 3C-SiC using the TiW film is very suitable for high temperature MEMS applications.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.114-120
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• 2012

This paper describes the design, fabrication and testing of a micromachined resonant accelerometer consisting of a symmetrical pair of proof masses and double-ended tuning fork(DETF) oscillators. Under the external acceleration along the input axis, the proof mass applies forces to the oscillators, which causes a change in their resonant frequency. This frequency change is measured to indicate the applied acceleration. Pivot anchor and leverage mechanisms are adopted in the accelerometer to generate larger force from a proof mass under certain acceleration, which enables increasing its scale factor. Finite element method analyses have been conducted to design the accelerometer and a silicon on insulator(SOI) wafer with a substrate glass wafer was used for fabricating it. The fabricated accelerometer has a scale factor of 188 Hz/g, which is shown to be in agreement with analysis results.