• 제목/요약/키워드: MEMS Process

검색결과 441건 처리시간 0.027초

정전형 마이크로 액추에이터를 이용한 초고밀도 HDD용 Dual-Stage 서보 시스템 (Dual-Stage Servo System using Electrostatic Microactuator for Super-High Density HDD)

  • 김승한;성우경;이효정;이종원;최정훈;안영재;전국진;김봉환
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권2호
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    • pp.153-160
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    • 1999
  • Dual-stage servo system for super-high density HDD has the chances of being composed of the coarse actuator(VCM) for track-seeking control and the fine actuator(microactuator) for-following control in near future. This paper presents the concept design of dual-stage servo system and the track-following control using an electrostatic microactuator for super-high density HDD. The electrostatic microactuator is designed and fabricated by MEMS(micro-electro-mechanical system) process. Both the nonlinear plant(voltage/displacement-to-electrostatic force) and the linear plant(electrostatic force-to-displacement) of the microactuator are established. Inverse function of the nonlinear plant is employed for a feedforward nonlinear compensator design. And feedforward control effect of this compensator is shown by time-domain experiments. A track-following feedback controller is designed using the feedback nonlinear compensator which is derived from the feedforward nonlinear compensator. The track-following control experiment is done to show the control efficiency of the proposed control system. And, excellent track-following control performance(2.21kHz servo-bandwidth, 7.51dB gain margin, $50.98^{\circ}$phase margin) is achieved by the proposed control system.

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Hysteresis Compensating of PZT Actuator in Micro Tensile Tester Using Inverse Compensation Method

  • Lee, Hye-Jin;Kim, Seung-Soo;Lee, Nak-Kyu;Lee, Hyoung-Wook;Hwang, Jai-Hyuk;Han, Chang-Soo
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.502-505
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    • 2005
  • Researches about micro technology travel lively in these days. Such many researches are concentrated in the field of materials and a process field. But properties of micro materials should be known to give results of research developed into still more. In these various material properties, mechanical property such as tensile strength, elastic modulus, etc is the basic property. To measure mechanical properties in micro or nano scale, actuating must be very precise. PZT is a famous actuator which becomes a lot of use to measure very precise mechanical properties in micro research field. But PZT has a nonlinearity which is called as hysteresis. Not precision result is caused because of this hysteresis property in PZT actuator. Therefore feedback control method is used in many researches to prevent this hysteresis of PZT actuator. Feedback control method produce a good result in processing view, but cause a loss in a resolution view. In this paper, hysteresis is compensated by open loop control method. Hysteresis property is modeled in Mathematical function and compensated control input is constructed using inverse function of original data. Reliability of this control method can be confirmed by testing nickel thin film that is used in MEMS material broadly.

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멤스기술을 이용한 가상밸브가 있는 새로운 잉크젯 헤드 개발 (Development of a new thermal inkjet head with the virtual valve fabricated by MEMS technology)

  • 배기덕;백석순;신종우;임형택;신수호;오용수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1892-1897
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    • 2003
  • A new thermal inkjet printer head on SOI wafer with virtual valve was proposed. It was composed of two rectangular heaters with same size. So we could call it T-jet(Twin jet). T-jet has a lot of merits. It has the advantage of being fabricated with one wafer and is easy to change the size of chamber, nozzle, restrictor and so on. However, above all, It is the best point that T-jet has a virtual valve. And it was manufactured on SOI wafer. The chamber was formed in its upper silicon whose thickness was 40um. The chamber's bottom layer was silicon dioxide of SOI wafer and two heaters were located underneath the chamber's ceiling. And the restirctor was made beside the chamber. Nozzle was molded by process of Ni plating. Ni was 30um thick. Nozzle ejection test was performed by printer head having 56 nozzles in 2 columns with 600NPI(nozzle per inch) and black ink. It measured a drop velocity of 12m/s, a drop volume of 30pl, and a maximum firing frequency of 12KHz for single nozzle ejection. Throwing out the ink drop in whole nozzles at the same time, it was observed that the uniformity of the drop velocity and volume was less than 4%.

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프리즘을 이용한 소형 단백질칩 분석 형광측정 시스템 개발 (Miniature Fluorescence Detection System for Protein Chips by Prism)

  • 최재호;김호성;이국녕;김은미;김용권;김병기
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 하계학술대회 논문집 C
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    • pp.2040-2042
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    • 2004
  • This paper presents a miniature optical system for the fluorescence detection of the patterned protein chip. The patterned protein chip was fabricated using MEMS process. The fluorescence from the patterned protein chip was measured while varying the concentration of the BSA. The fluorescence light is separated spatially from the excitation beam using mini-size prism to increase SNR (Signal-to-Noise Ratio). The combination of prism and mirrors can convert the excitation light from the laser diode to uniform illumination on the specimen. We believe that the proposed system for fluorescence detection can be applied to rea1ization of point-of-care.

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A Programmable Compensation Circuit for System-on-Chip Application

  • Choi, Woo-Chang;Ryu, Jee-Youl
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제11권3호
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    • pp.198-206
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    • 2011
  • This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.

미세변위 측정을 위한 턴널링소자의 제조 (fabrication of the tunneling devices for the minimal displacement sensing)

  • 심대근;양영신;마대영
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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    • pp.107-110
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    • 2000
  • In this experiment, we fabricated pyramid-type silicon tunneling devices in which a tunneling current flow between a micro-tip and Si$_3$N$_4$ thin film membrane. A MEMS process was used for the fabrication of the tunneling devices. The micro-tips were formed on Si wafers by undercutting a differently oriented square of SiO$_2$ with KOH. The stiffness of the Si$_3$N$_4$ films were observed and the model for the stiffness calculation, which is useful in predicting the stiffness even when the stiffness ranges beyond the scope of the normal experimental condition, was suggested.

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마이크로 파워 시스템의 개발 (Development of Micro Power System)

  • 방정환;김세준;전병선;민홍석;민경덕;송성진;주영창
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2002년도 유체기계 연구개발 발표회 논문집
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    • pp.477-481
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    • 2002
  • This paper reports on the development of micro power system component under way at Seoul National University. The need of micro power system is explained and components of micro power system are described. The developments of hydrogen-air micro combustor, micro igniter based poly-silicon heater and micro thruster are described. To manufacture 3-D micro structure the process that manufactures high aspect ratio structures has been developed and optimized. Design, fabrication, and experiment processes are introduced and technical challenges in each phase are described.

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Influence of Carbonization Conditions in Hydrogen Poor Ambient Conditions on the Growth of 3C-SiC Thin Films by Chemical Vapor Deposition with a Single-Source Precursor of Hexamethyldisilane

  • Kim, Kang-San;Chung, Gwiy-Sang
    • 센서학회지
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    • 제22권3호
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    • pp.175-180
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    • 2013
  • This paper describes the characteristics of cubic silicon carbide (3C-SiC) films grown on a carbonized Si(100) substrate, using hexamethyldisilane (HMDS, $Si_2(CH_3)_6$) as a safe organosilane single precursor in a nonflammable $H_2$/Ar ($H_2$ in Ar) mixture carrier gas by atmospheric pressure chemical vapor deposition (APCVD) at $1280^{\circ}C$. The growth process was performed under various conditions to determine the optimized growth and carbonization condition. Under the optimized condition, grown film has a single crystalline 3C-SiC with well crystallinity, small voids, low residual stress, low carrier concentration, and low RMS. Therefore, the 3C-SiC film on the carbonized Si (100) substrate is suitable to power device and MEMS fields.

열 기포에 의한 고체 박막의 변형 해석 (Deflection of a Thin Solid Structure by a Thermal Bubble)

  • 김호영;이윤표
    • 대한기계학회논문집B
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    • 제27권2호
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    • pp.236-242
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    • 2003
  • Thermal bubbles find their diverse application areas in the MEMS (MicroElectroMechanial Systems) technology, including bubble jet printers, microactuators, micropumps, etc.. Especially, microactuators and micropumps, which use a microbubble growing by a controlled heat input, frequently involve mechanical and thermal interaction of the bubble with a solid structure, such as a cantilever beam and a membrane. Although the concept is experimentally verified that an internal pressure of the bubble can build up high enough to deflect a thin solid plate or a beam, the physics of the entire process have not yet been thoroughly explored. This work reports the experimental study of the growth of a thermal bubble while deflecting a thin cantilever beam. A physical model is presented to predict the elastic response of the cantilever beam based on the experimental measurements. The scaling law constructed through this work can provide a design guide for micro- and nano-systems that employ a thermal bubble for their actuation/pumping mechanism.

FIB 밀링을 이용한 나노스텐실 제작 및 나노패터닝 (Fabrication of nanostencil using FIB milling for nanopatterning)

  • 정성일;오현석;김규만
    • 한국정밀공학회지
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    • 제23권3호
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    • pp.56-60
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    • 2006
  • A high-resolution shadow mask, or called a nanostencil was fabricated for high resolution lithography. This high-resolution shadowmask was fabricated by a combination or MEMS processes and focused ion beam (FIB) milling. 500 nm thick and $2{\times}2mm$ large membranes wore made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane. By local deposition through the apertures of nanostencil, nanoscale patterns down to 70 nm could be achieved.