• Journal of Sensor Science and Technology
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• v.26 no.5
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• pp.366-369
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• 2017

This work presents a detailed study of several parameters on the spray coating method for fabricating a flexible cantilever. Conventionally, spin coating method have been widely used in the microelectromechanical system (MEMS) fabrication process. However, the major drawback of this method is the difficulties in protecting various topography with photoresist film, particularly when the device is manufactured in high aspect ratio. It is also a challenging process to form a small pattern in the etched area. On the other hand, the commercial spray coating systems are not advantageous from an economic perspective and the technique is also providing less efficient. In order to solve these issues, we have developed a manual spray coating system which can be efficiently used by combining the accessories available in the laboratory. The developed spray coating system consists of a spin-coater, motorized stage, a spray gun with the capable of controlling centrifugal force, injection amount, injection angle, and spray range. The major advantage of the proposed spray coating system is its reasonable fabrication cost. Secondly, the system can be easily disassembled after finishing the coating experiment. Owing to the mentioned advantages, we sincerely believe that the proposed spray coating system can be effectively used in many related applications.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1115-1117
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• 2005

This paper describes the three dimension model and simulation results of a thermal actuator based on polyMUMPs process, known as thermal multimorph actuator. The device has potential application in micro-transducers such as atomic force microscope (AFM) tip and scanning tunneling microscope (STM) tip. This device made of a multi-layer materials stack together with consisted of polysilicon, $SiO_2$ and gold. A mask layout design, three dimension model and simulation results are reported and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.143-145
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• 1996

A new method of fabricating 3-dimensional patterns on single crystal silicon is presented in this paper. The method utlizes both chemical and mechanical reactions to make patterns with dimensions of few microns in width and submicron in height. The primaryadvantage ofthis new method over conventional methods of making patterns on silicon lies in its cost effectiveness and speed. The process introduced in this paper is a maskless process and does not reauire expensive capital investment. It is expected that this method can be employed for flexible and cost effective fabrication of micro-machine components in MEMS application.

• Polymer(Korea)
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• v.29 no.4
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• pp.418-421
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• 2005

Three-dimensional (3D) microfabrication process using two-photon polymerization (TPP) is developed to fabricate the curved microstructures in a layer, which can be applied potentially to optical MEMS, nano/micro-devices, etc. A 3D curved structure can be expressed using the same height-contours that are defined by symbolic colors which consist of 14 colors. Then, the designed bitmap figure is transformed into a multi-exposure voxel matrix (MVM). In this work a multi-exposure voxel matrix scanning method is used to generate various heights of voxels according to each laser exposure time that is assigned to the symbolic colors. An objective lens with a numerical aperture of 1.25 is employed to enlarge the variation of a voxel height in the range of 1.2 to 6.4 um which can be controlled easily using the various exposure time. Though this work some 3D curved micro-shapes are fabricated directly to demonstrate the usefulness of the process without a laminating process that is generally required in a micro-stereolithography process.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.192-196
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.49-53
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• 2018

Recently, technologies for integrating various devices such as a flexible device, a transparent device, and a MEMS device have been developed. The key processes of heterogeneous device manufacturing technology are chip or wafer-level bonding process, substrate grinding process, and thin substrate handling process. In this study, the effect of Si substrate grinding process on the electrical properties of tin oxide thin films applied as transparent thin film transistor or flexible electrode material was investigated. As the Si substrate thickness became thinner, the Si d-spacing decreased and strains occurred in the Si lattice. Also, as the Si substrate thickness became thinner, the electric conductivity of tin oxide thin film decreased due to the lower carrier concentration. In the case of the thinner tin oxide thin film, the electrical conductivity was lower than that of the thicker tin oxide thin film and did not change much by the thickness of Si substrate.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.174-178
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• 2006

Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.45 no.1
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• pp.41-49
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• 2008

Many machineries and equipments are being changing to various and complicated by development of recent technology and arrival of convergence age in distant future. These various and complicate equipments need more precise outcomes and low-power consumption sensors to get close and exact results. In this paper, we proposed fault tolerance and feedback theorem for sensor network and MEMS circuit which has a benefit of energy efficiency through wireless sensor network. The system is provided with independent sensor communication if possible as unused action, using idle condition of system and is proposed the least number of circuits. These technologies compared system efficiency after examining product of each Moving Distance by developed sensor which gives effects to execution of system witch is reduced things like control of management side and requirement for hardware, time, and interaction problems. This system is designed for practical application; however, it can be applied to a normal life and production environment such as "Ubiquitous City", "Factory Automata ion Process", and "Real-time Operating System", etc.