• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.12 s.117
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• pp.1272-1278
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• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.553-554
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• 2010

• Journal of Sensor Science and Technology
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• v.23 no.5
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• pp.326-331
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• 2014

In this study, a MEMS microphone that uses $Si_3N_4$ as the vibration membrane was produced for application as an auditory device using a sound visualization technique (sound visualization) for the hearing impaired. Two sheets of 6-inch silicon wafer were each fabricated into a vibration membrane and back plate, after which, wafer bonding was performed. A certain amount of charge was created between the bonded vibration membrane and the back plate electrodes, and a MEMS microphone that functioned through the capacitive method that uses change in such charge was fabricated. In order to evaluate the characteristics of the prepared MEMS microphone, the frequency flatness, frequency response, properties of phase between samples, and directivity according to the direction of sound source were analyzed. The MEMS microphone showed excellent flatness per frequency in the audio frequency (100 Hz-10 kHz) and a high response of at least -42 dB (sound pressure level). Further, a stable differential phase between the samples of within -3 dB was observed between 100 Hz-6 kHz. In particular, excellent omnidirectional properties were demonstrated in the frequency range of 125 Hz-4 kHz.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.12
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• pp.1659-1666
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• 2018

When the input sound is mixed voice and sound, it can be seen that the voice recognition rate is lowered due to the noise, and the speech recognition rate is improved by improving the MEMS device which is the H / W device in order to overcome the S/W processing limit. The MEMS microphone device is a device for inputting voice and is implemented in various shapes and used. Conventional MEMS microphones generally exhibit excellent performance, but in a special environment such as noise, there is a problem that the processing performance is deteriorated due to a mixture of voice and sound. To overcome these problems, we developed a newly designed MEMS device that can detect the voice characteristics of the initial input device.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.20-28
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.177-178
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.381-382
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• 2010

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.04a
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• pp.816-820
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• 2011

A method for increasing the difference of side-lobe level in spherical microphone array is presented. In array signal processing, it is known that narrow interval between sensors can increase the difference between main lobe and side-lobe of array response which eventually increase the source recognition capability. Recent commercial array being used, however, have shown certain limitation in using the number of sensors due to its costs and geometrical size of array. To overcome this problem, we have adapted MEMS sensors into spherical microphone array. To check out the improvement, two different types of spherical microphone array were designed. One array is composed with 32 regular instrument microphones and the other one is 85 MEMS sensors. Simulation and experiments were conducted on a sinusoidal noise source with two arrays. The time history data were analyzed with spherical harmonic decomposition and beamforming technique. 85 MEMS sensors array showed the improved side-lobe level suppression by more than 4 dB above the frequency content of 2 kHz compared to 32-sensor array.

• Journal of Sensor Science and Technology
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• v.16 no.1
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.4
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• pp.405-411
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• 2020

In this paper, we designed the COS MEMS system for sensing the falling detection and explosive noise of fuse link in COS (Cut Out Switch) installing on the power distribution. This system analyzed the failure characteristics and an instantaneous breakdown of power distribution. Therefore, our system strengths the industrial competence and guaranties the stable power supply. In this paper, we applied BLE (Bluetooth Low Energy) technology which is suitable protocol for low data rate, low power consumption and low-cost sensor applications. We experimented with LSM6DSOX which is system-in-module featuring 3 axis digital accelerometer and gyroscope boosting in high-performance mode and enabling always-on low-power features for an optimal motion for the COS fuse holder. Also, we used the MP34DT05-A for gathering an ultra-compact, low power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The proposed COS MEMS system is developed based on nRF52 SoC (System on Chip), and contained a 3-axis digital accelerometer, a digital microphone, and a SD card. In this paper of experiment steps, we analyzed the performance of COS MEMS system with gathering the accelerometer raw data and the PDM (Pulse Data Modulation) data of MEMS microphone for broadcasting the failure of COS status.