• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.603-604
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• 2006

A small size broadband microstrip patch antenna with small ground plane has been fabricated using MEMS. Multiple layer of high and low dielectric substrates are used to realize small size and broadband characteristics. The microstrip patch is divided into 4 pieces and each patch is connected to each other using a metal microstrip line. The fabrication process is very simple and only one mask is needed. Two types of microtrip antennas are fabricated. Type A is the microstrip antenna with metal lines and type B is the microstrip antenna without metal lines. The size of proposed microstip antenna is $8*12*2mm^3$ and the experimental results show that the antenna type A and type B have the bandwidth of 420MHz at 5.3 GHz and 480MHz at 5.66 GHz, respectively.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1617-1620
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• 2007

This paper presents a magnetostrictive transpositioner and its fabrication process. To get a transposition movement without shifting or twisting, it is designed as an array type. To fabricate the suggested design, micromachining and selective DC magnetron sputtering processes are combined. TbDyFe film is sputter-deposited on the back side of the bulk micromachined transpositioner, with the condition as: Ar gas pressure below $1.2{\times}10^{-9}$ torr, DC input power of 180W and heating temperature of up to $250^{\circ}C$ for the wireless control of each array component. After the sputter process, magnetization and magnetostriction of each sample are measured. X-ray diffraction studies are also carried out to determine the film structure and thickness of the sputtered film. For the operation, each component of the actuator has same length and out-of-plane motion. Each component is actuated by externally applied magnetic fields up to 0.5T and motion of the device made upward movement. As a result, deflections of the device due to the movement for the external magnetic fields are observed.

• 센서학회지
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• 제26권5호
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• pp.366-369
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• 2017

This work presents a detailed study of several parameters on the spray coating method for fabricating a flexible cantilever. Conventionally, spin coating method have been widely used in the microelectromechanical system (MEMS) fabrication process. However, the major drawback of this method is the difficulties in protecting various topography with photoresist film, particularly when the device is manufactured in high aspect ratio. It is also a challenging process to form a small pattern in the etched area. On the other hand, the commercial spray coating systems are not advantageous from an economic perspective and the technique is also providing less efficient. In order to solve these issues, we have developed a manual spray coating system which can be efficiently used by combining the accessories available in the laboratory. The developed spray coating system consists of a spin-coater, motorized stage, a spray gun with the capable of controlling centrifugal force, injection amount, injection angle, and spray range. The major advantage of the proposed spray coating system is its reasonable fabrication cost. Secondly, the system can be easily disassembled after finishing the coating experiment. Owing to the mentioned advantages, we sincerely believe that the proposed spray coating system can be effectively used in many related applications.

• 대한기계학회논문집A
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• 제28권8호
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• pp.1065-1074
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• 2004

A robust optimal design considering fabrication influence has been performed for the decoupled vibratory microgyroscope fabricated by the bulk micromachining. For the analysis of the gyroscope, a design tool has been developed, by which user can perform the system level design considering electric signal process and the fabrication influence as well as mechanical characteristics. An initial design of the gyroscope is performed satisfying the performances of scale factor (or sensitivity) and phase delay, which depend on the frequency difference between driving and sensing resonant frequencies. The objective functions are formulated in order to reduce the variances of the frequency difference and the frequency in itself by fabrication error. To certify the results, the standard deviations are calculated through the Monte Caries Simulation (MCS) and compared initial deviation that is measured fabricated gyroscope chip.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 추계학술대회 발표 논문집
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• pp.14-17
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• 2006

This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar Optimum pyrolysis and anneal ins conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excel lent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition.

• 청정기술
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• 제9권3호
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• pp.101-105
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• 2003

MEMS(Micro Electro Mechanical System) 기술에서 실리콘 식각기술의 중요성으로 플라즈마 식각기술의 개발이 꾸준히 진행되고 있다. 본 연구에서는 ICP(Inductive Coupled Plasma)를 이용하여 플라즈마를 발생시켜, 이온에너지를 증가시키지 않고도 이온밀도를 높이고 이온입자들에 의한 식각의 방향성을 가할 수 있는 새로운 플라즈마 기술을 이용하였다. 이같이 플라즈마를 이용하여 실리콘웨이퍼를 식각하여 제조하는 MEMS 응용분야는 다양하나, 본 연구에서는 미생물배양에 응용할 수 있는 PCR(Polymerase Chain Reaction)장치 제작을 위한 식각에 이용하였다. Platen power, Coil power 및 Process pressure에 다양한 변화를 주어 각 변수에 따른 식각속도를 관찰하였다. 각 공정별 변수를 변화시킨 결과 Platen 12W, Coil power 500W, 식각/Passivation Cycle 6/7sec 일 경우 식각속도는 $1.2{\mu}m/min$ 이었고, sidewall profile은 $90{\pm}0.7^{\circ}$로 나타나 매우 우수한 결과를 보였다. 분 연구에 SF6를 식각에 이용하였으며 공정의 최적화를 통하여 사용량을 최소화하여환경영향이 최소가 될 수 있는 가능성이 있었다.

• 정보저장시스템학회논문집
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• 제2권3호
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• Transactions on Electrical and Electronic Materials
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• 제17권3호
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• pp.150-154
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• 2016

Contact electrodes pose threats like inflammation, metal poisoning, and allergic reaction to the user during long term ECG procedure. Therefore, we present a novel noncontact electrocardiographic electrode designed through microelectromechanical systems (MEMS) process. The proposed ECG electrode consists of small inner and large outer circular copper plates separated by thin insulator. The inner plate enables capacitive transduction of bio-potential variations on a subject’s chest into a voltage that can be processed by a signal processing board, whereas the outer plate shields the inner plate from environmental electromagnetic noise. The electrode lead wires are also coaxially designed to prevent cables from coupling to ground or electronic devices. A prototype ECG electrode has an area of about 2.324 cm², is very flexible and does not require power to operate. The prototype ECG electrode could measure ECG at about 500 um distance from the subject’s chest.

• 한국의학물리학회지:의학물리
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• 제25권2호
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• pp.116-121
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• 2014

본 본문은 Bio-MEMS 공정으로 제작한 마이크로 세포 분석 바이오칩을 사용하여 적혈구의 광학적 특성을 전압으로 측정한 실험이다. Bio-MEMS 공정을 이용하여 세포의 원활한 이동과 측정 분석에 사용되는 글라스에 채널 패턴 에칭을 위하여 포토리소그래피(photolithography)와 산화완충식각(BOE: buffered oxide etchant) 공정 조건, 세포 분석과 정보 전달에 사용되는 광섬유의 에칭을 위하여 산화완충식각 공정 조건, 세포나 유체를 칩과 외부의 전달 등에 사용되는 글라스의 홀을 위하여 전기화학방전(ECD: electro chemical discharge) 공정 조건, 글라스 접합을 위한 자외선반응접합(UVSA: ultraviolet sensitive adhesives) 공정 조건을 정립하였다. 또한 유체나 세포의 흐름 제어를 위한 라미나 흐름 조건, 적혈구세포에 대한 산란빔 파형을 측정하였다. 적혈구 실험을 통하여 출력 광섬유의 각도에 따른 산란빔이 출력측의 광섬유각도가 $0^{\circ}$일 때 약 17 V, 각도가 $5^{\circ}$일 때 약 10 V, 각도가 $10^{\circ}$일 때 약 6 V, 각도가 $15^{\circ}$일 때 약 4 V의 전압(Vpp)으로 측정되었다. 따라서 마이크로 세포 분석 바이오칩 제작의 소형화, 단순화, 공정신간 단축, 정량화하였고 적혈구의 광학적 특성을 측정을 측정함으로써 의공학(biomedical), 바이오칩공학(biochip), 반도체공학(semiconductor), 생물정보학(bioinformatics) 등의 응용과학 분야 발전에 기여할 것으로 기대한다.