• Electronics and Telecommunications Trends
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• v.30 no.6
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• pp.21-30
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• 2015

압력센서란 두 물체 간의 상호 작용하는 힘의 크기를 나타내는 물리적 양을 측정하는 디바이스로서 힘의 전달 크기, 힘의 방향 등을 측정하는 데 매우 광범위하게 사용되고 있는 센서이다. 사용하는 분야는 의료, 자동차, 항공, 공업계측, 가전, 환경제어분야 등의 전반적 산업제품과 산업시설에 응용되고 있으며, 측정원리는 힘의 변화에 따른 재료의 변위, 변형, 진동수, 변화, 열전도율 변화 등을 이용하는 것으로 종전의 기계식 감지방법에서 현재는 센서장치의 소형화를 위하여 반도체소자 제작기술과 Micro Electro Mechanical System(MEMS)기술을 이용하는 초소형, 저전력형 센서개발로 계속 발전하고 있다. 본고에서 멤스(MEMS) 압력센서의 최근 제품 기술 개발과 시장 및 산업동향을 알아보고 향후 더욱더 확장될 압력센서제품 기술의 기초 정보를 제공하고자 한다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.10
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• pp.1017-1025
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• 2008

The air data system(ADS) was developed for unmanned aerial vehicle(UAV) in this paper. Generally, the ADS helps flight control computer(FCC) to control the UAV above the stall speed and to hold the given altitude. The accurate measurement of airspeed and altitude of UAV is important because it indicates a flight performance and assures a safe flight. The ADS consists of MEMS pressure sensors, a lowpass filter, a micro controller unit and a pitot-tube. The ADS errors were reduced by pressure and temperature compensation of MEMS sensors. Finally, the altitude and airspeed data of the ADS was compared with GPS data in the flight test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.1-8
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• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.90-90
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• 2004

반도체 집적회로 제작 기술을 기반으로 하여 각종 물리량 감지를 위한 미세기계구조물과 각종 물리량의 전기신호로의 변화, 증폭, 보정을 위한 전자회로를 동시에 제작하여 하나의 칩 상에 집적화시킬 수 있는 MEMS 기술이 등장하게 됨에 따라 센서의 소형화, 경량화, 다기능화, 고성능화와 함께 비용을 최소화할 수 있는 장점을 가진 반도체 센서가 급격하게 개발되어 자동차 산업에 상용화되고 있다. 특히 반도체 압력센서는 엔진 제어용 MAP센서에서 가장 먼저 상품화되었으며, 현재 타이어압 센서 그리고 탱크 연료압력센서가 상품화되었고, 에어콘 압력 센서등도 실리콘 센서로 대체하기 위한 단계에와 있다.(중략)

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.11
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• pp.63-70
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• 2008

In this paper, a smart sensor system for the MEMS pressure sensor was developed. A compensation algorithm and programmable calibration circuits were presented to eliminate errors caused by temperature drift of piezoresistive pressure sensors in itself. This system consisted of signal conditioning, calibration, temperature detection, microprocessor, and communication parts and these were integrated into a SOC. A RS-232 interface was employed for monitoring and control of a smart sensor system. The area of fabricated IC is $4.38{\times}3.78\;mm^2$ and a $0.35{\mu}m$ high voltage CMOS process was used. Compensation error for temperature drift of 50 KPa pressure sensors was measured into ${\pm}0.48%$ in the range of $-40^{\circ}C{\sim}150^{\circ}C$. Total power consumption was 30.5 mW.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.511-512
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• 2012

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2005.06a
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• pp.1016-1021
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• 2005

A piezoresistive pressure sensor using a silicone rubber membrane has been fabricated on the selectively diffused (100)-oriented n/n+/n silicon substrates by a unique silicon micromachining technique using porous silicon ething. The width, length and thickness of the beam were 120${\mu}m$, 600${\mu}m$ and 7${\mu}m$, respectively and the thickness of the silicone rubber membrane was 40${\mu}m$. By the fusion of silicon beam and silicone rubber membrane, the mechanical strength of the pressure sensor could be highly improved due to smaller shear stress. The effectiveness of the sensor was confirmed through an experiment and FEM simulation in which the pressure sensor was characterized.