• Title/Summary/Keyword: MEMS (micro-electro mechanical system )

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A Study on Attitude Heading Reference System Based Micro Machined Electro Mechanical System for Small Military Unmanned Underwater Vehicle

  • Hwang, A-Rom;Yoon, Seon-Il
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.5
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    • pp.522-526
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    • 2015
  • Generally, underwater unmanned vehicle have adopted an inertial navigation system (INS), dead reckoning (DR), acoustic navigation and geophysical navigation techniques as the navigation method because GPS does not work in deep underwater environment. Even if the tactical inertial sensor can provide very detail measurement during long operation time, it is not suitable to use the tactical inertial sensor for small size and low cost UUV because the tactical inertial sensor is expensive and large. One alternative to INS is attitude heading reference system (AHRS) with the micro-machined electro mechanical system (MEMS) inertial sensor because of MEMS inertial sensor's small size and low power requirement. A cost effective and small size attitude heading reference system (AHRS) which incorporates measurements from 3-axis micro-machined electro mechanical system (MEMS) gyroscopes, accelerometers, and 3-axis magnetometers has been developed to provide a complete attitude solution for UUV. The AHRS based MEMS overcome many problems that have inhibited the adoption of inertial system for small UUV such as cost, size and power consumption. Several evaluation experiments were carried out for the validation of the developed AHRS's function and these experiments results are presented. Experiments results prove the fact that the developed MEMS AHRS satisfied the required specification.

MEMS Packaging Technology and Micro Sensors (MEMS Packaging 기술 및 마이크로센서)

  • 최상언
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.09a
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    • pp.55-85
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    • 2000
  • MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

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Deposition of Piezoelectric PZT(53/47) Film by Metalorganic Decomposition for Micro electro mechanical Device (Microelectromechnical system 소자 제작을 위한 유기금속분해법에 의한 압전성 PZT(53/47)박막의 증착)

  • 윤영수;정형진;신영화
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.6
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    • pp.458-464
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    • 1998
  • This paper gives characterization of substrate and PZT(53/47) thin film deposited by metalorganic decomposition, which is concerned in deposition process and device fabrication process, to fabricate micro electro mechanical system (MEMS) device with piezoelectric material. The PZT thin films deposited by MOD at 700^{\circ}C$ for 30 minutes had a polycrystallinity, that is, no substrate dependence, while different interface were developed depending on the bottom electrodes. Such a structural variation could influence on not only the properties of the PZT film but also etching process for fabricating MEMS devices. Therefore the electrode structure is a very important factor in the deposition of the PZT film during etching process by HF acid for MEMS device with piezoelectric material. Piezoelectric coefficients of the PZT films on the different substrates were 40 and 80 pm/V at an applied voltage of 4V. Based in these results, it was possible for deposition of the PZT film by MOD to apply MEMS device fabrication process based on piezoelectricity after selection of proper bottom electrode.

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Three Dimensional Molecular Dynamics Simulation of Nano-Lithography Process for Fabrication of Nanocomponents in Micro Electro Mechanical Systems (MEMS) Applications (MEMS 부품 제조를 위한 나노 리소그래피 공정의 3차원 분자동력학 해석)

  • Kim, Young-Suk;Lee, Seung-Sub;Na, Kyoung-Hoan;Son, Hyun-Sung;Kim, Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.10
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    • pp.1754-1761
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    • 2003
  • The atomic force microscopy (AFM) based lithographic technique has been used directly to machine material surface and fabricate nano components in MEMS (micro electro mechanical system). In this paper, three-dimensional molecular dynamics (MD) simulations have been conducted to evaluate the characteristic of deformation process at atomistic scale for nano-lithography process. Effects of specific combinations of crystal orientations and cutting directions on the nature of atomistic deformation were investigated. The interatomic force between diamond tool and workpiece of copper material was assumed to be derived from the Morse potential function. The variation of tool geometry and cutting depth was also evaluated and the effect on machinability was investigated. The result of the simulation shows that crystal plane and cutting direction significantly influenced the variation of the cutting forces and the nature of deformation ahead of the tool as well as the surface deformation of the machined surface.

A Study on Gamma TiAl Micro-structural Fracture with EBSD Technique (EBSD 기법을 이용한 Gamma TiAl의 마이크로 조직파괴에 관한 연구)

  • Kim, Yun-Hae;Woo, Byung-Hoon;Bae, Chang-Won;Bae, Sung-Yeol;Higo, Yakichi;Moon, Kyung-Man
    • Journal of Advanced Marine Engineering and Technology
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    • v.31 no.4
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    • pp.377-384
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    • 2007
  • A backscatter Kikuchi diffraction attachment to an SEM enables the convenient investigation of grain orientations on bulk or micro surface. Their relation to micro structural features gives insight into many aspects of anisotropic materials properties. In micro area such as Micro Electro Mechanical Systems(MEMS) devices is required in order to improve understanding of how they may be expected to perform upon the micro scale. Electro Back Scatter Diffraction (EBSD) helps us to find uniform area as MEMS material. The ${\gamma}-TiAl$ has two different lamellar structures ${\gamma}/{\alpha}2-Ti_3Al$ phase which have shows $\{111\}{\gamma}//\{0001\}{\alpha}2$ plane indexing. The micro size testing specimen was successfully made by this structural relation. Interlamellar structure specimen averagely show $20{\sim}25%$ lower fracture toughness value compare with translamellar specimens Moreover micro fracture surface and micro crack progress were observed.

HAR-MEMS 공정과 그를 이용한 미세 열유체 응용 연구

  • 이승섭
    • Ceramist
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    • v.7 no.3
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    • pp.28-33
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    • 2004
  • 1987년 미국 버클리 대학의 연구진은 반도체 미세공정 기술을 이용해 머릿카락 굵기의 초소형 모터를 발표하였다(Fig. 1).1) 이는 MEMS(Micro Electro Mechanical System, 혹은 MST , Micro System Technology)라는 새로운 학문 분야의 실질적 효시로, 명실공히 마이크론 단위의 기계-전자 시스템의 구현이라는 새로운 장을 열게되었다. (중략)

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Reliable design and characterization of MEMS probe tip (신뢰성을 갖는 MEMS 프로브 팁의 설계 및 특성평가)

  • Lee, Seung-Hun;Chu, Sung-Il;Kim, Jin-Hyuk;Seo, Ho-Won;Han, Dong-Chul;Moon, Sung
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1718-1723
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    • 2007
  • The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

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Design of a micro fluid actuator driven by electromagnetic force (전자기력을 이용한 마이크로 유체구동기의 설계)

  • Kim D.H.;Kim K.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1988-1991
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    • 2005
  • A micro fluid actuator driven by electromagnetic force at MEMS(Micro Electro Mechanical System) level has been designed. The operation of the actuator was simulated in three steps. First, fluid flow analysis has been performed to determine the actuator load. With the load, dynamic behavior of the actuator structure has been analysed. Finally, fluid-structure interaction analysis has been performed to predict the performance of the actuator. To avoid excessive amount of computation, axisymmetric and plane strain 2-D models were used.

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