• Journal of the Korean Wood Science and Technology
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• 제46권3호
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• pp.213-220
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• 2018

리기다소나무를 구조용 집성재의 재료로 이용하기 위해 판면의 옹이와 대패가공 후 방치시간에 따른 수지 삼출량이 레조르시놀수지로 접착한 판재의 접착성능에 미치는 영향을 검토하였다. 고온($120{\sim}95^{\circ}C$) 및 저온($65{\sim}50^{\circ}C$)에서 건조한 리기다소나무의 수지 삼출량은 판목면이 정목면 보다 저온건조재가 고온건조재보다 많았다. 방치시간별로는 저온건조재는 3일째 고온건조재는 7일째에 최고함량을 보였고, 이후부터는 서서히 감소하여 15~90일에는 거의 차이가 없었다. 접착성능은 수지의 삼출이 많은 2~3일까지는 낮았으나 15일 이후에는 큰 차이가 없었으며, 고온 및 저온 건조재 모두 방치시간에 관계없이 KS 기준의 접착성능을 만족하였다. 옹이부가 포함된 적층 구성에서의 접착강도는 KS의 접착강도 기준 이상이었으나 목파율은 기준인 65% 이상을 만족하지 못하였다. 적층 단면구성(정목+정목, 판목+판목, 정목+판목)에 따른 접착성능은 고온 및 저온건조재 모두 모든 적층구성에서 KS의 기준을 크게 상회하였다.

• 한국정밀공학회지
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• 제27권7호
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• 한국콘텐츠학회논문지
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• 제10권11호
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• pp.243-250
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• 2010

티타늄의 표면처리방법과 저온용융도재의 글레이징 온도 변화에 따른 티타늄-세라믹 보철물의 결합강도와 색조재현성에 관해 분석하고자 하였다. 표면처리방법에 따른 결합강도를 비교한 결과, TiN 코팅 처리한 STB1시편이 가장 높게 나타났으며, 전용결합재를 사용한 SB1시편, gold 코팅 처리한 SGB1시편 순으로 나타났다. 글레이징 온도에 따른 결합강도는 글레이징 온도가 $770^{\circ}C$인 시편들이 $720^{\circ}C$에서 글레이징을 실시한 시편들에 비하여 결합강도가 증가하였으며, $810^{\circ}C$에서 글레이징을 실시한 시편들에서는 결합강도가 감소하는 것으로 관찰되었다. 색조관찰 결과 글레이징 온도가 높아질수록 명도(${\Delta}L$)가 높아졌으며, 티타늄의 표면처리에 의한 색조가 티타늄-세라믹의 색조에 영향을 주었으며, 그 결과 SB1과 SGB3이 색조재현성이 가장 우수한 것으로 평가되었다.

• ETRI Journal
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• 제37권2호
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• 치위생과학회지
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• 제14권1호
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• pp.29-34
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• 2014

본 연구는 최근 심미보철물 제작에 널리 사용되는 지르코니아의 저온열화가 수복물의 안정성 및 내구성에 영향을 미치는 여부를 확인하기 위하여 전단결합강도를 측정하였다. 디스크 형태의 시편을 각각 7개씩 제작한 후 전장도재를 축성하여, ISO 13356 규격에 의거한 조건으로 고압증기 멸균기에 저온열화의 정도를 조절하기 위하여 3, 5, 10시간 동안 수열처리를 진행하였다. 제한된 조건하에 시행된 실험을 통해 전단결합강도를 확인하였으며, 측정 후 파절양상을 관찰 하였다. 저온열화 처리 전후의 시편에 대한 전단결합강도의 변화는 각 실험군별 유의한 차이가 있었다(p<0.05). 10시간을 저온열화 처리한 시편이 가장 낮은 전단결합강도로 나타났으며, 처리시간이 길어질수록 전단결합강도가 낮아지는 경향을 보였다. 파절 양상으로 저온열화 처리를 하지 않은 시편에서 응집성 파절을 보였으며, 저온열화 처리가 길어질수록 혼합형 파절 경향으로 전환되었다. 결론적으로 본 연구는 저온열화 현상이 진행될수록 지르코니아 코어와 전장도재 간의 결합강도가 낮아지는 경향을 확인하였다. 본 실험결과를 토대로 치과용 지르코니아를 이용한 보철물 제작과정과 환자에게 장착 후 안정적인 사용을 위하여 저온열화 현상에 대한 주의가 필요할 것으로 생각된다.

• 한국재료학회지
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• 제16권9호
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• pp.592-597
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• 2006

A deoxidized low-phosphorous (DLP) copper was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two copper sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles (${\varepsilon}{\sim}6.3$). TEM observation revealed that ultrafine grains were developed after the 4th cycle, and their size decreased at higher cycles. Tensile strength of the copper increased with the equivalent strain, and it reached 547 MPa which was 3 times higher than that of the initial material. It is concluded that the ARB process is an effective method for high strengthening of the DLP copper.

• 한국염색가공학회지
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• 제25권2호
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• pp.110-117
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• 2013

The purpose of this study is to fabricate the flame retardant polyester fabric by thermal bonding with low melting component of flame retardant bicomponent filament(LMFRPC) and to describe the characteristics of thermal bonded fabrics. The fabrics were prepared with flame retardant polyester filaments(FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core wherein the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester of low-melting point. In this study, we investigated the physical properties, melting behavior of filament, the effect of the component of FRP and LMFRPC on the thermal bonding, mechanical properties. Melting peak of LMFRPC showed the double melting peak. The thermal bonding of the fabric formed at lower melting peak temperature of bicomponent filament of LMFRPC. The optimum thermal bonding conditions for fabrics was applied at about $170^{\circ}C$ for 60 seconds by pin tenter. On the other hand, the tensile strength, elongation, and LOI of the fabric increased with an increasing component of FRP of weft.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.295-301
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• 2002

In this paper, solenoid-type 3-D passives (inductors and transformers) have been designed, fabricated, and characterized by using electroplating techniques, wire bonding techniques, multi-layer thick photoresist, and low temperature processes which are compatible with semiconductor circuitry fabrication. Two different fabrication approaches are performed to develop the solenoid-type 3-D passives and relationship of performance characteristics and geometry is also deeply investigated such as windings, cross-sectional area of core, spacing between windings, and turn ratio. Fully integrated inductor has a quality factor of 31 at 6 GHz, an inductance of 2.7 nH, and a self resonant frequency of 15.8 GHz. Bonded wire inductor has a quality factor of 120, an inductance of 20 nH, and a self resonant frequency of 8 GHz. Integrated transformers with turn ratios of 1:1 and n:l have the minimum insertion loss of about 0.6 dB and the wide bandwidth of a few GHz.

• Journal of the Korean Wood Science and Technology
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• 제38권2호
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• pp.117-123
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• 2010

The objective of this research was executed to investigate the effect of molar ratio of formaldehyde to urea and melamine (F/(U+M)) of urea-melamine-formaldehyde (UMF) resin on bonding high and low moisture content veneers. For that purpose, UMF resin types with 5 different F/(U+M) molar ratios (1.45, 1.65, 1.85, 2.05, and 2.25) synthesized were used in present study. First, their curing behavior was evaluated by differential scanning calorimetry. Second, their adhesion performance in bonding high and low moisture content veneers was evaluated by probe tack and dry and wet shear strength tests. Curing temperature and reaction enthalpy decreased with the increase of F/(U+M) molar ratio. And the dry and wet shear strengthsof plywood manufactured from low moisture content veneers were higher than thoseof plywood manufactured from high moisture content veneers. Also, the maximum initial tack force on the low moisture content veneer was higher than that on the high moisture content veneer.