• Journal of Dairy Science and Biotechnology
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• 제36권1호
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• pp.49-71
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• 2018

Heat treatment is the most popular processing technique in the dairy industry. Its main purpose is to destroy the pathogenic and spoilage bacteria in order to ensure that the milk is safe throughout its shelf life. The protease and lipase that are present in raw milk might reduce the quality of milk. Plasmin and protease, which are produced by psychrotrophic bacteria, are recognized as the main causes of the deterioration in milk flavor and taste during storage. The enzymes in raw milk can be inactivated by heat treatment. However, the temperature of inactivation varies according to the type of enzyme. For example, some Pseudomonas spp. produce heat-resistant proteolytic and lipolytic enzymes that may not be fully inactivated by the low temperature and long time (LTLT) treatment. These types of enzymes are inhibited only by the high temperature and short time (HTST) or ultra-high temperature (UHT) treatment of milk.

• 열처리공학회지
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• 제7권1호
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• pp.11-16
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• 1994

Anatase $TiO_2$ particles prepared by experiment were used to study the change of crystal structure by calcination temperature. The results were as follows. Crystallite size of anatase $TiO_2$ particles increased with calcination temperature. The rate of increasing the crystallite size of anatase $TiO_2$ particles was decreased below $700^{\circ}C$ and was markedly increased above $700^{\circ}C$. Unit cell volume of $TiO_2$ was expanded at low temperature and was contracted at high temperature. This result means that the growth of crystallite size was occured in the direction.

• Journal of Welding and Joining
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• 제20권4호
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 열처리공학회지
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• 제36권2호
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• 한국작물학회:학술대회논문집
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• 한국작물학회 1994년도 춘계 학술대회지
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• pp.66-67
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• 1994

• 열처리공학회지
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• 제31권3호
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• pp.104-110
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• 2018

The effects of heat treatment time and cooling method on microstructure and mechanical property of Cu-22wt%Sn alloy were discussed. ${\alpha}+{\delta}$ mixed phase structure was obtained in air-cooled specimens after heat treatment at 775, 750, and $700^{\circ}C$ for 1 hour. On the other hand, in water-cooled specimens, ${\alpha}+{\beta}^{\prime}$ martensite mixed phase was obtained. In the case of water-cooled specimens, the hardness value decreased with decreasing heat treatment temperature because the volume fraction of ${\alpha}$ phase with low hardness value increased as the heat treatment temperature decreased. In water-cooled specimen after heat treatment at $600^{\circ}C$, ${\gamma}^{\prime}$ martensite was formed instead of ${\beta}^{\prime}$ martensite. The hardness value of ${\gamma}^{\prime}$ martensite was lower than those of ${\beta}^{\prime}$ and ${\delta}$ phases.

• 한국결정성장학회지
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• 제30권2호
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• pp.61-65
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• 2020

The depletion of fossil fuels and the increase in environmental awareness have led to greater interest in renewable energy. In particular, solar cells have attracted attention because they can convert an infinite amount of solar energy into electricity. Dye-sensitize solar cells (DSSCs) are low cost third generation solar cells that can be manufactured using environmentally friendly materials. However, DSSC photoelectrodes are generally produced by screen printing, which requires high temperature heat treatment, and low temperature processes that can be used to produce flexible DSSCs are limited. To overcome these temperature limitations, this study fabricated photoelectrodes using room-temperature aerosol deposition. The resulting DSSCs had an energy conversion efficiency of 4.07 %. This shows that it is possible to produce DSSCs and flexible devices using room-temperature processes.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.475-475
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• 2014

Dye sensitized solar cells (DSSCs) are regarded as potential inexpensive alternatives to conventional solid-state devices. The flexible version, employing conductive-plastic-film substrates, is appealing for commercialization of DSSCs because it not only reduces the weight and cost of the device but also extends their applications. However, the need for high temperature does not permit the use of plastic-film substrate. So, development of low-temperature methods is therefore realization of flexible DSSCs. In this work, the electrophoretic deposition combined with hydrothermal treatment was employed to prepare nanocrystalline $TiO_2$ thin film at low temperature. We confirmed the prepared $TiO_2$ thin films with different voltages and deposition times in the electrophoretic deposition process. Properties of the $TiO_2$ films were investigated by various analysis method such as X-ray diffraction, field emission scanning electron microscopy (FESEM) and UV-visible spectrophotometer.

• 한국포장학회지
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• 제14권1호
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• pp.31-33
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• 2008

The effects of packaging conditions on freshness extension of green pepper were investigated during 30days of storage at $10^{\circ}C$ and $18^{\circ}C$ Corrugated cardboard and EPS box used as packaging materials. The rate of weigh loss, vitamin C and chlorophyll contents, and hunter color of green paper were changed last significantly in the samples stored in the EPS box at low temperature storage condition($10^{\circ}C$) among treatments. The combination of EPS box and low temperature was the most effective treatment to extend the storability of green pepper.

• Bulletin of the Korean Chemical Society
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• 제34권2호
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• pp.505-509
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• 2013

A low temperature ($65^{\circ}C$) thermal deposition process was developed for depositing a silver coating on thermally sensitive polymeric substrates. This low temperature deposition was achieved by chemical reduction of a silver alkylcarbamate complex with latent reducing agent. The effects of acetol as a latent reducing agent for the silver 2-ethylhexylcarbamate (Ag-EHCB) complex and their blend solutions were investigated in terms of reducing mechanism, and the size and shape of silver nanoparticles (Ag-NPs) as a function of reduced temperature and time, and PVP stabilizer concentration were determined. Low temperature deposition was achieved by combining chemical reduction with thermal heating at $65^{\circ}C$. A range of polymer film, sheet and molding product was coated with silver at thicknesses of 100 nm. The effect of process parameters and heat treatment on the properties of silver coatings was investigated.