• 폴리머
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• 제31권4호
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• pp.302-307
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• 2007

저항형 습도센서를 제조하기 위하여 [2-[(methacryloyloxy)ethyl]dimethyl] propylammonium bromide(MEPAB), [2-[(methacryloyloxy)ethyl]-2-hydroxyethyl]dimethylammonium bromide(MEHDAB), 2-[(methacryloyloxy)ethyl]trimethylammonium chloride(METAC), 그리고 n-butyl methylacrylate(BMA)의 공중합체를 사용하였다. 4가지 종류의 4원 공중합체 MEPAB/BMA/MEHDAB/METAC=4/4/1/1, 3/5/1/1, 2/6/1/1, 1/7/1/1을 blocked-isocyanate가교제를 사용하여 Ag/Pd 전극/알루미나에 도포한 후 좋은 내수성을 보여주었다. 습도센서의 상대습도에 대한 주파수 의존성, 온도 의존성, 히스테리시스, 응답속도 그리고 내수성을 평가하였다. MEPAB/BMA/MEHDAB/METAC=2/6/1/1 공중합체의 경우, $30{\sim}90%RH$에서 $1.4\;M{\Omega}{\sim}2.9\;k{\Omega}$의 저항을 보여주었으며 좋은 직선성과 작은 히스테리시스를 보여주었다.

• 한국주조공학회지
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• 제31권2호
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• pp.66-70
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• 2011

Hot dip aluminizing (HDA) is widely used in industry for improving corrosion resistance of material. The formation of intermetallic compound layers during the contact between dissimilar materials at high temperature is common phenomenon. Generally, intermetallic compound layers of $Fe_2Al_5$ and $FeAl_3$ are formed at the Al alloy and Fe substrate interface. In case of cast iron, high contact angle of graphite existed in the matrix inhibits the formation of intermetallic compound layer, which carry with it the disadvantage of a reduced reaction area and mechanical properties. In present work, the process for the removal of graphite existed on the surface of specimen has been investigated. And also HDA was proceeded at $800^{\circ}C$ for 3 minutes in aluminum alloy melt. The efficiency of graphite removal was increased with the reduction of particle size in sanding process. Graphite appears to be present both in the region of melting followed by re-solidification and in the intermetallic compound layer, which could be attributed to the fact that the surface of cast iron is melted down by the formation of low melting point phase with the diffusion of Al and Si to the cast iron. Intermetallic compound layer consisted of $Fe(Al,Si)_3$ and $Fe_2Al_5Si$, the layer formed at cast iron side contained lower amount of Si.

• 한국정보통신학회논문지
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• 제4권3호
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• pp.705-711
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• 2000

반도체 제조공정과 미세가공 기술을 이용하여 $300^{\circ}C$의 동작온도에서 약 60 mW의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 $0.1\mum\; 두께의\; Si_3N_4와\; 1\mum$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1 wt.% Pd가 도핑된 $SnO_2,\; 6 we.% A1_2O_3$가 도핑된 ZnO, $WO_3$, ZnO를 이용하였으며,4가지 감지물질의 베이스라인 저항은 $300^{\circ}C$ 에서 3일 동안의 에이징을 거친 후 안정됨을 보였다. 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출 시 유용한 저항 변화를 나타내었으며 감도는 감지 물질에 강하게 의존함을 알 수 있었다.

• 대한의용생체공학회:의공학회지
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• 제29권2호
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• pp.132-138
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• 2008

We investigated the biomechanical properties of a newly designed self-expansion type anterior cruciate ligament (ACL) anchor. The ACL anchor consists of the ring section giving the elastic force, the wedge for maintaining in contact with the femur tunnel wall and the link suspending hamstring graft or artificial ligament. The main design parameters that determine the performance of this device were the expansion angle (${\theta}$) and the thickness ($t_R$). The Ti6Al4V anchors were heated after inserting in a jig for 1 hour at $800^{\circ}C$ in a protective argon gas atmosphere and allowed to cool to room temperature in the furnace. In order to investigate the influence of the expansion angle and the thickness of the ring on the biomechanical properties of the anchor, the maximum pull-out load, stiffness and slippage of the ACL anchor were measured using the pull-out tester, and statistical analyses were also executed. The present results showed that the design parameters gave a significant effect on the performance of the self- expansion type of anchor. The pull-out load of the ACL anchors significantly increased as the thickness of the ring section was increased, having a similar trend for both expansion angles. The ACL anchor showed about 2.5 times higher values of the pull-out load than that of the minimum load (500N)required for the "accelerated rehabilitation". The optimum ${\theta}$ and $t_R$ values of this ACL anchor were suggested to have sufficient resistance against the pull-out force, high stiffness and relatively low slippage after ACL reconstruction.

• 한국정보통신학회논문지
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• 제6권2호
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• pp.315-322
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• 2002

반도체 제조공정과 미세가공 기술을 이용하여 30$0^{\circ}C$의 동작온도에서 약 60㎽의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 0.1$\mu\textrm{m}$ 두께의 Si$_3$N$_4$와 1$\mu\textrm{m}$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1wt.%Pd가 도핑된 SnO$_2$, 6wt.% $Al_2$O$_3$가 도핑된 ZnO, WO$_3$, ZnO를 이용하였으며, 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출시 유용한 저항 변화를 나타내었고 감도는 감지 물질에 강하게 의존함을 알 수 있었다. 센서 소자의 공정 수율을 증진시키기 위하여 히터 부위를 함몰하는 공정 방법을 취하였으며, 그 결과 월등한 수율 개선을 도모할 수 있었다.

• 한국초전도저온공학회지:초전도와저온공학
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• 제20권2호
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• pp.15-22
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• 2018

The present article briefly overviews the plan for a new project on joint technology for HTS wires/cables and describes the development plan for the world's highest field NMR magnet, which is a major development item in the project. For full-fledged social implementation of superconducting devices, high temperature superconducting (HTS) wire is a key technology since they can be cooled by liquid nitrogen and they can generate a super-high magnetic field of >>24 T at liquid helium temperatures. However, one of the major drawbacks of the HTS wires is their availability only in short lengths of a single piece of wire. This necessitates a number of joints being installed in superconducting devices, resulting in a difficult manufacturing process and a large joint resistance. In Japan, a large-scale project has commenced, including two technical demonstration items: (i) Development of superconducting joints between HTS wires, which are used in the world's highest field 1.3 GHz (30.5 T) NMR magnet in persistent current mode; the joints performance is evaluated based on NMR spectra for proteins. (ii) Development of ultra-low resistive joints between DC superconducting feeder cables for railway systems. The project starts a new initiative of next generation super-high field NMR development as well as that of realization of better superconducting power cables.

• 전자공학회논문지A
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• 제31A권12호
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• pp.80-90
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• 1994

To develop VLSI of higher packing density with 0.5.mu.m gate length of less, semiconductor devices require shallow junction with higher doping concentration. the most common method to form the shallow junction is ion implantation, but in order to remove the implantation induced defect and activate the implanted impurities electrically, ion-implanted Si should be annealed at high temperature. In this annealing, impurities are diffused out and redistributed, creating deep PN junction. These make it more difficult to form the shallow junction. Accordingly, to miimize impurity redistribution, the thermal-budget should be kept minimum, that is. RTA needs to be used. This paper reports results of the diffusion characteristics of PSG film by varying Phosphorus weitht %/ Times and temperatures of RTA. From the SIMS.ASR.4-point probe analysis, it was found that low sheet resistance below 100 .OMEGA./ㅁand shallow junction depths below 0.2.mu.m can be obtained and the surface concentrations are measured by SIMS analysis was shown to range from 2.5*10$^{17}$ aroms/cm$^{3}$~3*10$^{20}$ aroms/cm$^{3}$. By depending on the RTA process of PSG film on Si, LDD-structured nMOSFET was fabricated. The junction depths andthe concentration of n-region were about 0.06.mu.m. 2.5*10$^{17}$ atom/cm$^{-3}$ , 4*10$^{17}$ atoms/cm$^{-3}$ and 8*10$^{17}$ atoms/cm$^{3}$, respectively. As for the electrical characteristics of nMOS with phosphorus junction for n- region formed by RTA, it was found that the characteristics of device were improved. It was shown that the results were mainly due to the reduction of electric field which decreases hot carriers.

• Parasites, Hosts and Diseases
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• 제54권4호
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• pp.415-421
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• 2016

The drug-resistance of malaria parasites is the main problem in the disease control. The huge Brazilian biodiversity promotes the search for new compounds, where the animal kingdom is proving to be a promising source of bioactive compounds. The main objective of this study was to evaluate the antiplasmodial and cytotoxic activity of the compounds obtained from the toad venoms of Brazilian Amazon. Toad venoms were collected from the secretion of Rhinella marina and Rhaebo guttatus in Mato Grosso State, Brazil. The powder was extracted at room temperature, yielding 2 extracts (RG and RM) and a substance ('1') identified as a bufadienolide, named telocinobufagin. Growth inhibition, intraerythrocytic development, and parasite morphology were evaluated in culture by microscopic observations of Giemsa-stained thin blood films. Cytotoxicity was determined against HepG2 and BGM cells by MTT and neutral red assays. The 2 extracts and the pure substance ('1') tested were active against chloroquine-resistant Plasmodium falciparum strain, demonstrating lower $IC_{50}$ values. In cytotoxic tests, the 2 extracts and substance '1' showed pronounced lethal effects on chloroquine-resistant P. faciparum strain and low cytotoxic effect, highlighting toad parotoid gland secretions as a promising source of novel lead antiplasmodial compounds.

• 한국정밀공학회지
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• 제30권3호
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• pp.254-259
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• 2013

Ball screw system is widely used as a precision mechanical linear actuator that translates rotational motion to linear motion for its high efficiency, great stiffness and long life. Recently, according to the requirements of high accuracy and stiffness, the pre-load on the ball screw which means of remove the backlash in the ball screw is usually used. Because of the preload which means the frictional resistance between the screw and nut, becomes a dominating heat source and it generates thermal deformation of ball screw which is the reason for low accuracy of the positioning decision. There are several methods to solve the problem that includes temperature control, thermal stable design and error compensation. In the past years, researchers focused on the error compensation technique for its ability to correct ball screw error effectively rather than the capabilities of careful machine design and manufacturing. Significant amounts of researches have been done to real-time error compensation. But in this paper, we developed a series of cooling methods to get thermal equilibrium in the ball screw system. So we find the optimum cooling type for improving positioning error which caused by thermal deformation in the ball screw system.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.35-41
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• 2016

고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.