• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.976-980
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• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.558-561
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• 2001

Vanadium oxide ($VO_x$) thin films are very good candidate material for uncooled infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_x$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than $1000{\AA}$. This paper presents a new fabrication process of $VO_x$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}(100{\AA})/V(80{\AA})/VO_{x}(500{\AA})$ by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than $-2%/^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.558-561
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• 2001

Vanadium oxide ($VO_{x}$) thin films are very good candidate material for uncooked infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_{x}$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than 1000${\AA}$. This paper presents a new fabrication process of $VO_{x}$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}$(100${\AA}$)/V(80${\AA}$)/$VO_{x}$(500${\AA}$) by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than -2%/$^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.381-381
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• 2011

In this study, a TiO2 colloidal sol was synthesized by sol-gel process, which was used as a "glue" agent to enhance interconnection of TiO2 particles in low temperature process for plastic dye sensitized solar cell. The crystalline phase of this TiO2 glue is pure anatase with average particles size of 5 nm, which was characterized by powder X-ray diffraction and high revolution-TEM. The viscous alcoholic paste without any organic binder was prepared from the mixture of commercial P25 powder and glue. Paste composition and sintering process parameters were optimized for high photovoltaic performance based on low temperature process. The electrochemical impedance spectroscopy and photocurrent-photovoltage transient spectroscopy were also employed to investigate the mechanism of electron transport in this binder free TiO2 film system.

• 산업기술연구
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• 제21권A호
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• pp.279-284
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• 2001

In this study, we analyzed the $NO_X$ removal effiency by the low temperature plasma process and investigated the effect of several process variables. Most of NO is converted into $NO_2$ and, later, into $HNO_3$ which reacts with $NH_3$ to form $NH_4NO_3$ particles. As the frequency of appling voltage increases, as the applied voltage increases or as the residential time increases, removal efficiency of the NO supplied initially increase. The removal efficiency of $NO_X$ also increases with the increase of $NH_3$ supplied.

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2001년도 추계학술발표회 논문집
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• pp.3-11
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• 2001

Fundamental studies at the CSIRO division of Wool technology and ICI on the diffusion of dyes into wool〔1,2〕have let to development of a new approach to wool dyeing. In this method, the cell membrane complex of wool is modified before dyeing by treatment under mildly alkaline conditions with a special chemicals. Wool pretreated with ethoxylated quaternary ammonium salt has an increased rate of dyebath exhaustion and dye penetration early in the dyeing cycle. This enables the treated material to be dyed below the boil for a similar time to the conventional cycle. This technique can be used on untreated and shrinkresist-treated wool and wool/nylon blends. In addition to good macro-levelness and excellent coverage of tippiness, the low temperature dyeing process give higher exhaustion levels of dyestuffs and insect-resist agent and hence cleaner effluent liquors, compared with conventional dyeing process. Low Temperature Dyeing process cause significantly less fiber damage than conventional way. The reduction in damage is reflected in improved processing performance of the dyed wool.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• ETRI Journal
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• 제38권6호
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• Journal of Advanced Marine Engineering and Technology
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• 제24권4호
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• pp.427-434
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• 2000

In tradition, there have been two kinds of drying methods, which are sun drying and artificial drying. The sun drying method which has been adopted traditionally has been replaced by the hot-air drying method which is one of the most general methods of artificial drying, with its simple drying system, low initial cost of drying plant, and easy operating method. But the hot-air drying method has some defects; (1) much energy loss happens due to the discharge of hot air during the drying process, (2) control of drying rate is not easy on account of changing relative humidity of inlet air for uniform hot air temperature, (3) high temperature of foods in drying process brings about the production of low-grade drying products. Vacuum drying takes advantage of energy saving and mass production because it reduces the drying time by increasing the drying rate under low temperature condition. The aim of this paper is to develop the low temperature vacum dryer, with low initial investments and operating costs, easy operating method and trouble-free operation.

• 한국응용과학기술학회지
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• 제35권1호
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• pp.80-88
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• 2018

본 연구에서는 투명도와 기계적 특성을 향상시키기 위해 저온 공정의 졸-겔 법을 이용하여 하이브리드 복합체의 코팅 박막을 제조하였다. 하이브리드 복합체로는 $ZrO_2/TiO_2/organosilane$을 사용하였으며, 그 중 organosilane은 3-(trimethoxysilyl)propyl methacrylate을 사용하였고 이는 저온 공정의 광경화 반응을 위해 도입되었다. 다양한 조성비로 합성된 복합체를 폴리 카보네이트 기판 위에 저온 공정의 졸-겔 법을 이용하여 광경화와 열처리 공정을 거처 코팅 박막을 제조하였고 이 코팅 박막의 광학 특성 및 기계적 강도를 확인하였다. 코팅 박막은 가시광선 영역에서 97.5 % 이상의 투과도를 가짐을 확인하였고 기계적 강도는 9H 이상의 연필 경도를 가진 것을 확인하였다. 특히 ZTS-2-1 코팅 박막의 나노 압입 경도는 1.14 GPa로 가장 높게 측정되었다.