• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.441-443
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• 2005

According as CCFL(Cold Cathode Fluorescent lamp) of light source in Backlight unit for Note PC (Personal computer) is presently needed to low power consumption and long life time, the development focus of CCFL is going on the discharge gas, phosphor and electrode material. First of all, discharge voltage characteristic of CCFL is closely connected with electrode material For low discharge voltage, the characteristic of electrode material is needed to low work function, low sputtering ratio and superior manufacturing property. We developed new CCFL with Nb/Ni Clad electrode superior to conventional CCFL. Because Nb/Ni Clad electrode with Ni material and Nb material, the electrical characteristic is superior to other electrode materials. The electrode of Nb/Ni Clad is composed that Ni of outside material has superior manufacturing property and Nb of inside material has low work function. Nb/Ni Clad of new electrode material is made by process of Rolling mill at high pressure and heat treatment. We compared electrical characteristic of Nb/Ni clad electrode with conventional Mo electrode by measurement. Mo electrode and Nb/Ni Clad electrode of cup type with diameter 1.1 mm and length 3.0mm are used to this experiment. Material content of Mo electrode is Mo 100%. But, Nb/Ni Clad electrode is composed by content of Nb 40% and Ni 60%. The result of comparison measurement between new CCFL with Nb/Ni Clad electrode and conventional CCFL was appeared that CCFL with Nb/Ni Clad electrode had superior characteristic than conventional CCFL. As a result of experiment, we completed Note PC with low power consumption and long life time by application of new CCFL with Nb/Ni Clad electrode.

• Structural Engineering and Mechanics
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• 제53권4호
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• pp.645-659
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• 2015

This research investigates the thermoelastic transient behavior of a thermally loaded slab made of a thermal diode-like material which has two directional thermal conductivity values (low and high). Finite difference analysis is used to obtain the elastic response of the slab based on the temperature solutions. It is found that the rate of heat transfer through the thickness of the slab decreases with reducing the ratio between the low and high thermal conductivity values (R). In addition, reducing R makes the slab less responsive to the thermal load when heated from the direction associated with the low thermal conductivity value.

• Structural Engineering and Mechanics
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• 제38권1호
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• pp.125-140
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• 2011

This study presents an innovative method to estimate the reliability sensitivity based on the low-discrepancy sampling which is a new technique for structural reliability analysis. Two advantages are contributed to the method: one is that, by developing a general importance sampling procedure for reliability sensitivity analysis, the partial derivative of the failure probability with respect to the distribution parameter can be directly obtained with typically insignificant additional computations on the basis of structural reliability analysis; and the other is that, by combining various low-discrepancy sequences with the above importance sampling procedure, the proposed method is far more efficient than that based on the classical Monte Carlo method in estimating reliability sensitivity, especially for problems of small failure probability or problems that require a large number of costly finite element analyses. Examples involving both numerical and structural problems illustrate the application and effectiveness of the method developed, which indicate that the proposed method can provide accurate and computationally efficient estimates of reliability sensitivity.

• Journal of Mechanical Science and Technology
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• 제14권4호
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• pp.426-432
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• 2000

The development of a low-pollution burner is important for saving energy and preserving the environment. A low-pollution burner can be produced by lean-mixture combustion and general combustion technology. The flammable limit of premixed flame is narrower than that of diffusion flame. Producing a lean mixture of fuel results in an effective combustion condition, which in turn produces high load and low pollution. In this study, it was found that the influx of $Q_2$ had an effect on extending the lean flammable limits and flame stabilization in a doubled jet burner. And the flame, consisting of small eddies, can be stabilized by the nozzle neck phenomena.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1995년도 추계학술발표회논문집(1)
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• pp.315-320
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• 1995

The CHF phenomenon has been investigated for water flow under forced and natural circulation modes with vertical round tubes at low pressure and low flow condition. Experiments have been performed by using three different test sections for mass fluxes below 400 kg/㎡s under near atmospheric pressure. The experimental data for forced and natural circulation are compared with each other. To predict the flow rate at the two-phase region our test condition has been analyzed by RELAP5/MOD3 because the local two-phase condition inside the stainless steel tube cannot be directly measured. To predict the CHF with accuracy we have to consider the parameters at the single-phase region as well as the flow behavior at the two-phase region.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권2호
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• pp.75-79
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• 2009

A system-on-a-chip communication architecture has a significant impact on the performance and power consumption of modern multi-processors system-on-chips (MPSoCs). However, customization of such architecture for a specific application requires the exploration of a large design space. Thus, system designers need tools to rapidly explore and evaluate communication architectures. In this paper we present the method for application-specific low-power bus architecture synthesis at system-level. Our paper has two contributions. First, we build a bus power model of AMBA AXI bus communication architecture. Second, we incorporate this power model into a low-power architecture exploration algorithm that enables system designers to rapidly explore the target bus architecture. The proposed exploration algorithm reduces power consumption by 20.1% compared to a maximally connected reduced matrix, and the area is also reduced by 20.2% compared to the maximally connected reduced matrix.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• Applied Science and Convergence Technology
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• 제24권6호
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• pp.245-249
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• 2015

Vertically coupled low density InGaAs quantum dots (QDs) buried in GaAs matrix were grown with migration enhanced molecular beam epitaxy method as a candidate for quantum information processing devices. We performed excitation power-dependent photoluminescence measurements at cryogenic temperature to analyze the effects of vertical coupling according to the variation in thickness of spacer layer. The more intense coupling effects were observed with the thinner spacer layer, which modified emission properties of QDs significantly. The low surface density of QDs was observed by atomic force microscopy, and scanning transmission electron microscopy verified the successful vertical coupling between low density QDs.

• ETRI Journal
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• 제35권2호
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• pp.226-233
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• 2013

This paper presents a two-stage power-efficient class-AB operational transconductance amplifier (OTA) based on an adaptive biasing circuit suited to low-power dissipation and low-voltage operation. The OTA shows significant improvements in driving capability and power dissipation owing to the novel adaptive biasing circuit. The OTA dissipates only $0.4{\mu}W$ from a supply voltage of ${\pm}0.6V$ and exhibits excellent high driving, which results in a slew rate improvement of more than 250 times that of the conventional class-AB amplifier. The design is fabricated using $0.18-{\mu}m$ CMOS technology.

• ETRI Journal
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• 제35권2호
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.