• Korean Journal of Optics and Photonics
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• v.4 no.1
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• pp.1-8
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• 1993

A design of four-mirror optical system with reduction magnification 5X for deep UV ($\lambda$=248 nm of KrF excimer laser) submicron lithography is presented. Initially by using the paraxial quantities, the domain of solution for $t=d_1+d_2+d_3$<0 (d;: distance between the mirror $c_i$ and $c_{i+1}$ is found for the system which is free from the four off-axial Seidel first order aberrations that are coma, astigmatism, field curvature, and distortion. The solution with $d_5$=2.95 (normalized with respect to $c_i$= -1) is choosen and the aspherization is carried out to the spherical mirror surfaces ($c_3$ and $c_4$ in order to reduce the axial and residual off-axial higher order aberrations. The numerical aperture of the final system is as large as 0.4, which gives Rayleigh resolution of 0.38 $\mu\textrm{m}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1637-1642
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• 2010

In this paper, we present the fabrication of a high-quality diffractive-lens mold having submicron patterns, which is suitable for an ultra-slim optical system. In order to fabricate high-quality diffractive lens with a variety of submicron patterns, the multi-alignment method was used; high-resolution electron-beam lithography and FAB plasma etching were carried out to obtain the patterns. The most important key technology in the multi-alignment method is to reduce alignment error, lithography error, and etching error. In this paper, these major fabrication errors were minimized, and a high-quality diffractive lens with a diameter of $267\;{\mu}m$ (NA = 0.25), minimum pattern width of 226 nm, and thickness of 819 nm was successfully fabricated.

• Korean Journal of Optics and Photonics
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• v.6 no.3
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• pp.188-200
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• 1995

A design of unit magnification 2-mirror system with high resolution is presented. It is for soft X-ray(wavelength of 13 nm) projection imaging and suitable for preparation of high density semiconductor chip. In general, a holosymmetric system with unit magnification has the advantage that both coma and distortion are completely eliminated. In our holosymmetric 2-mirror system, spherical aberration is addtionally removed by using two identical paraboloidal mirror surfaces and field curvature aberration is also corrected by balancing Petzval sum and astigmatism which depends on the distance between two mirrors, so that the system is a aplanatic flat-field paraboloidal 2-mirror holosymmetric system. This 2-mirror system is small in size, and has a simple configuration with rotational symmetry about optical axis, and has also small central obscuration. Residual finite aberrations, spot diagrams, and diffraction-based MTF's are analyzed for the check of performances as soft X-ray lithography projection system. As a result, the image sizes for the resolutions of$0.25\mum$and $0.18\mum$are 4.0 mm, 2.5 mm respectively, and depths of focus for those are $2.5\mum$, $2.4\mum$respectively. This system should be useful in the fabrication of 256 Mega DRAM or 1 Giga DRAM. DRAM.

• Korean Journal of Optics and Photonics
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• v.5 no.3
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• pp.349-355
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• 1994

Superrsolution of an optical imaging system, which resolves $\epsilon_O$ (half width of the square top amplitude impulse function) less than the Rayleigh's resolution limit $\epsilon_R$, is theoretically treated by using the diffraction theory, and an experimental system is proposed. Initially superresolution is stated as an inverse problem, and an integral equation is derived as a function of parameter $\beta$, which is positive. The integration is numerically carried out for the given aperture and those given values of $\beta$, which is 1, 5, 10, 15, and 20. 1/2$\times$FWHM's of the amplitude impulse functions are meassured for the cases of diffrent value of {J and in the case of $\beta=5$, the half-width already approaches to $\epsilon_O=0.1$,urn, which is, in the case of the present work, one fifth of the Rayleigh's resolution limit. It is found both the pupil function and the phase of the Huygens wave are to be modified, and theories of the pupil function modulation plate and the phase modulation hologram plate are also presented. The result obtained may be useful in ultrafine optical lithography.graphy.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.245-250
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• 2005

Recently, micro machining technology for high precision mold becomes more interested for mass production of high performance optical parts micro-grooved on the surface, which is under very active development due to its effectiveness in the view point of optical performance. Mechanical micro machining technology now has more competitiveness on lithography, MEMS or LIGA processes which have some problems to fabricate especially cylinder type of groove in such as lenticular lens for illumination angle modulation system. In this study. a lenticular lens mold with U-type micro groove is fabricated making utilizing of the benefit of the mechanical micro machining technology. A shaping machining process is adapted using 3 axis degree of freedom micro machining system and single crystal natural diamond tool. A brass and a electroless nickel materials are used for mold fabrication. Machining force, chip shape and machined surface are investigated from the experiment and an optimal machining condition is found based on the examined problems from the micro cutting process.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.209-212
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher doc to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method Is applied with the rule based optical\ulcorner proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design rule is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

• Proceedings of the Korean Information Science Society Conference
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• 2007.10c
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• pp.367-370
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• 2007

In this paper, we concentrate on the mask design problem for optical micro-lithography. The pre-distorted mask is obtained by minimizing the error between the designed output image and the projected output image. We use the particle swarm optimization(PSO) and fuzzy system to insure that the resulting images are identical to the desired image. Our method has good performance for the iteration number by an experiment.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.380-386
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• 2006

In this study, we had designed and fabricated the plasma focus device which can generate the light source for EUV(Extreme Ultra Violet) lithography. And we also have investigated the basic electrical characteristics of currents, voltages, resistance and inductance of this system. Voltage and current signals were measured by C-dot and B-dot probe, respectively. We applied various voltages of 1.5, 2, 2.5 and 3 kV to the anode electrode and observed voltages and current signals in accordance with various Ar pressures of 1 mTorr to 100 Torr in diode chamber. It is observed that the peak values of voltage and current signals were measured at 300 mTorr, where the inductance and impedance were also estimated to be 73 nH and $35 m{\Omega}$ respectively. The electron temperature has been shown to be 13000 K at the diode voltage of 2.5 kV and this gas pressure of 300 mTorr. It is also found that the ion density Ni and ionization rate 0 have been shown to be $N_i = 8.25{\times}10^{15}/cc$ and ${\delta}$= 77.8%, respectively by optical emission spectroscopy from assumption of local thermodynamic equilibrium(LTE) plasma.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.697-702
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• 2011

Two-dimensional (2D) nano patterns including a two-dimensional Bravais lattice were fabricated by laser interference lithography using a two step exposure process. After the first exposure, the substrate itself was rotated by a certain angle, $90^{\circ}$ for a square or rectangular lattice, $75^{\circ}$ for an oblique lattice, and $60^{\circ}$ for a hexagonal lattice, and the $90^{\circ}$ and laser incident angle changed for rectangular and the $45^{\circ}$ and laser incident angle changed for a centered rectangular; we then carried out a second exposure process to form 2D bravais lattices. The band structure of five different 2D nano patterns was simulated by a beam propagation program. The presence of the band-gap effect was shown in an oblique and hexagonal structure. The oblique latticed ZnO nano-photonic crystal array had a pseudo-bandgap at a frequency of 0.337-0.375, 0.575-0.596 and 0.858-0.870. The hexagonal latticed ZnO nano-crystallite array had a pseudo-bandgap at a frequency of 0.335-0.384 and 0.585-0.645. The ZnO nano structure with an oblique and hexagonal structure was grown through the patterned opening window area by a hydrothermal method. The morphology of 2D nano patterns and ZnO nano structures were investigated by atomic force microscopy and scanning electron microscopy. The diameter of the opening window was approximately 250 nm. The height and width of ZnO nano-photonic crystals were 380 nm and 250 nm, respectively.

• Journal of the Korean Magnetics Society
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• v.25 no.5
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• pp.149-155
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• 2015

The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.