• Title/Summary/Keyword: Line Scan Camera

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Design of High-Speed Image Processing System for Line-Scan Camera (라인 스캔 카메라를 위한 고속 영상 처리 시스템 설계)

  • 이운근;백광렬;조석빈
    • Journal of Institute of Control, Robotics and Systems
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    • v.10 no.2
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    • pp.178-184
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    • 2004
  • In this paper, we designed an image processing system for the high speed line-scan camera which adopts the new memory model we proposed. As a resolution and a data rate of the line-scan camera are becoming higher, the faster image processing systems are needed. But many conventional systems are not sufficient to process the image data from the line-scan camera during a very short time. We designed the memory controller which eliminates the time for transferring image data from the line-scan camera to the main memory with high-speed SRAM and has a dual-port configuration therefore the DSP can access the main memory even though the memory controller are writing the image data. The memory controller is implemented by VHDL and Xilinx SPARTAN-IIE FPGA.

Development of the Strip Off-center Meter Using Line Scan Camera in FM Line (라인 스캔 카메라를 이용한 압연라인의 판쏠림 측정장치 개발)

  • Yoo Ki-Sung;Lee Min-Choel;Choi Yong-Joon
    • Journal of Institute of Control, Robotics and Systems
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    • v.11 no.6
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    • pp.518-523
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    • 2005
  • Strip off-center is one of the major problems in hot strip mill line. The key to good centering is having good equipment, modern control systems, excellent maintenance and an understanding of milling process. Therefore, this study aims to develop a system that is useful for quantitative analysis of strip off-center. In this study, the measuring method of strip off-center was thoroughly studied and the exclusive control board to line scan camera were designed. Also, the manipulated type housing for line scan camera was developed to adjust initial parameters for strip width and center line. In order to check the accuracy and usefulness of the developed system, FM stand in $\#2$ Hot Strip Factory in Pohang Steel Works was targeted.

Visual Precise Measurement of Pile Rebound and Penetration Movement Using a High-Speed Line-Scan Camera

  • Lim, Mee-Seub;You, Bum-Jae;Oh, Sang-Rok;Han, Song-Soo;Lee, Sang-Hun
    • Transactions on Control, Automation and Systems Engineering
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    • v.4 no.4
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    • pp.341-346
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    • 2002
  • When a construction company builds a high structure. many piles should be driven into the ground by a hammer whose weight is 7,000 kg in order to make the ground under the structure safe and strong. So. it is essential to determine whether a pile is penetrated into the ground enough to support the weight of the structure since ground characteristics at different locations are different each other. This paper proposes a visual measurement system for pile rebound and penetration movement including vibration using a high-speed line-scan camera and a specially designed mark to recognize two-dimensional motion parameters of the mark using only a line-scan camera. A mark stacking white and black right-angled triangles is used for the measurement, and movement information for vertical distance, horizontal distance and rotational angle is determined simultaneously. Especially- by adopting a line-scan CCD camera whose line rate is 20 ㎑. the measurement performance of dynamic characteristics of the pile at impact instant is improved dramatically.

3D Precision Measurement of Scanning Moire Using Line Scan Camera (라인스캔 카메라를 이용한 3차원 정밀 측정)

  • Kim, Hyun-Ju;Yoon, Doo-Hyun;Kim, Hak-Il
    • Korean Journal of Optics and Photonics
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    • v.19 no.5
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    • pp.376-380
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    • 2008
  • This paper presents the Projection Moire method using a line scan camera. The high resolution feature of a line scan camera makes it possible to scan an image quickly, thus enabling a much quicker 3D profile. This method uses a high resolution line scan camera making it possible to scan an image at high speed simultaneously measuring the 3D profile of a large FOV. When using a high resolution scan camera, a full FOV is scanned, thus requiring just one movement of a projection grating. As a result, the number of grating movements is reduced drastically. The end result is a faster and more accurate 3D measurement. Moving the grating too quickly causes vibration in the imaging system, which will normally be required to apply a stitching technique when using an area scan camera. However the technique is not required when using a line scan camera. Compared with the previous techniques, it has the advantages of simple hardware without moving mechanical parts - single exposure for obtaining three-dimensional information. A method using a high resolution line scan camera can be used in mass production to measure the bump height of wafers or the bump height of package substrates.

Development of a Low-cost Lighting System for Line-acan Camera (라인 스캔 카메라를 위한 저가형 시 균일 조명장치 구현)

  • Kim, Hong-Gap;Kim, Hyeong-Seok
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.49 no.5
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    • pp.235-240
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    • 2000
  • A low cost lighting system for line-scan cameras has been developed with 3-phase power. When exposure time of line-scan camera is shorter than fluctuation period of illumination, the average gray value of each acquired 1-D image varies. Detecting defects on the objects's surface under such illuminating environment is very difficult. The proposed lighting system is composed of low-cost fluorescent lights based on 3-phase power. The specially designed lighting pack and the properly selected lighting position enable to get the rippleless lighting. The principle of the proposed lighting system has been explained analytically. The lighting system has been tested for fabric inspection with line-scan camera and it's efficacy has been proved.

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Real-Time PCB Inspection System using the Line Scan Camera (Line Scan Camera를 이용한 실시간 PCB 검사 시스템)

  • 하종수;이영아;이영동;최강선;고성제
    • Proceedings of the IEEK Conference
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    • 2002.06d
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    • pp.81-84
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    • 2002
  • This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

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Effective De-blurring Algorithm for the Vibration Blur of the Interlaced Scan Type Digital Camera (인터레이스 스캔 방식 디지털 카메라 떨림 블러에 대한 효과적 제거 알고리즘)

  • Chon, Jae-Choon;Kim, Hyong-Suk
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.54 no.9
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    • pp.559-566
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    • 2005
  • An effective do-blurring algorithm is proposed to remove the blur of the even and the odd line images of the interlaced scan type camera. n the object or the camera moves fast while the interlaced scan type digital camera is acquiring images, blur is often created due to the misalignment between two images of even and odd lines. In this paper, the blurred original image is separated into the even and the odd line images of the half size. Two full sized images are generated using interpolation technique based on these two in ages. Again, these images are signed and combined through the processes of feature extraction, matching, sub-pixel matching, outlier removal, and mosaicking. De-blurring simulations about the images of different camera motions have been done.

A Path Planning Method for Automatic Optical Inspection Machines with Line Scan Camera (라인스캔 카메라 형 광학검사기틀 위한 경로계획 방법)

  • Chae, Ho-Byeong;Kim, Hwan-Yong;Park, Tae-Hyoung
    • Proceedings of the KIEE Conference
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    • 2007.10a
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    • pp.333-334
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    • 2007
  • We propose a path planning method to decrease a inspection lead time of line scan camera in SMT(surface mount technology) in-line system. The inspection window area of printed circuit board should be minimized to consider the FOV(field of view) of line scan camera so that line scan inspector is going to find a optimal solution of path planning. We propose one of the hierarchical clustrering algorithm for a given board. Comparative simulation results are presented to verify the usefulness of proposed method.

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Bare Glass Inspection System using Line Scan Camera

  • Baek, Gyeoung-Hun;Cho, Seog-Bin;Jung, Sung-Yoon;Baek, Kwang-Ryul
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.1565-1567
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    • 2004
  • Various defects are found in FPD (Flat Panel Display) manufacturing process. So detecting these defects early and reprocessing them is an important factor that reduces the cost of production. In this paper, the bare glass inspection system for the FPD which is the early process inspection system in the FPD manufacturing process is designed and implemented using the high performance and accuracy CCD line scan camera. For the preprocessing of the high speed line image data, the Image Processing Part (IPP) is designed and implemented using high performance DSP (Digital signal Processor), FIFO (First in First out), FPGA (Field Programmable Gate Array) and the Data Management and System Control part are implemented using ARM (Advanced RISC Machine) processor to control many IPP and cameras and to provide remote users with processed data. For evaluating implemented system, experiment environment which has an area camera for reviewing and moving shelf is made.

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