• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.59-78
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.09a
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• pp.1-30
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• 2000

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.1-19
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.28.1-28.1
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• 2007

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.269-271
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• 2002

• 전자공학회논문지 IE
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• v.47 no.1
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• pp.6-11
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• 2010

This research is the result for studding about the IR Rework station which is using a multi-wave IR-heater for soldering and de-soldering on the substrate such as PCB. This IR repair and reflow system is increasing the temperature on the target area under stable temperature control following setting point melting point of solder and lead free solder using IR-heater. So this system is not giving any therrna1 damage on the target PCB and components even closed components. The soldering and de-soldering quality is evaluated through the actual test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.31-36
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• 2018

Fuses are used to protect electric circuits or devices from excess current. Glass-tube fuses are typically used, but problems have arisen due to the mandated switch from conventional solder to lead-free solder. This study used CFD to simulate the phenomenon of molten solder being poured out of a fuse during the soldering process for a fuse cap and fuse element. In addition, a method is proposed to prevent solder from overflowing, and its effectiveness was verified based on the analysis results. The results show that a sufficient increase of the temperature inside the glass tube before soldering and gravity can help to prevent the solder from overflowing.

• Journal of Welding and Joining
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• v.23 no.3
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.