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http://dx.doi.org/10.5762/KAIS.2018.19.10.31

Study on the solution for the overflow of molten solder during the soldering of fuse cap through CFD analysis  

Jeong, Nam-Gyun (Division of Mechanical Engineering, Inha Technical College)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.19, no.10, 2018 , pp. 31-36 More about this Journal
Abstract
Fuses are used to protect electric circuits or devices from excess current. Glass-tube fuses are typically used, but problems have arisen due to the mandated switch from conventional solder to lead-free solder. This study used CFD to simulate the phenomenon of molten solder being poured out of a fuse during the soldering process for a fuse cap and fuse element. In addition, a method is proposed to prevent solder from overflowing, and its effectiveness was verified based on the analysis results. The results show that a sufficient increase of the temperature inside the glass tube before soldering and gravity can help to prevent the solder from overflowing.
Keywords
Fuse; Lead free solder; Reflow soldering; Glass tube fuse; CFD;
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  • Reference
1 C. H. Lee, S. K. Kim, K. J. Ok, " A Study on the Causal Analysis of Electricl Fire by Using Fuse", J. of Korean Institute of Fire Sci. & Eng., Vol.22, No.1, pp. 24-28, 2008. http://ww.dbpia.co.kr/Article/NODE 01464366
2 J. H. Lee, N. H. Kang, C. W. Lee, J. H. Kim, " Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys", Journal of KWS, Vol.24, No.2, pp. 17-28, 2006. http://e-jwj.org/upload/PDF/0/71/22/0712255.pdf
3 W. S. Hong, C. M. Oh, "Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics", Journal of KWJS, Vol.31, No.3, pp. 22-30, 2013. DOI: http://dx.doi.org/10.5781/KWJS.2013.31.3.22
4 S. H. Kim, B. R. Lee, G. T. Park, J. M. Kim, S. H. Yoo, Y. B. Park, "Effects of PCB surface finishes on the Mechanical and Electrical Reliabilities of Sn-0.7Cu Pb-free Solder Bump", Korean J. Met. Mater., Vol.53, No.10, pp. 735-744, 2015. DOI: http://dx.doi.org/10.3365/KJMM.2015.53.10.735   DOI
5 E. Y. Yoon, S. W. Kim, Y. S. Yang, S. J. Lee, G. H. Lee, "A study on PCB Failure prediction of forced convection reflow soldering process with Thermal-Structure coupled simulation", The Korean Society of Mechanical Engineer Conference, Nov., 2009. http://www.dbpia.co.kr/Article/NODE01291669
6 ANSYS Inc., "ANSYS FLUENT User's Guide"
7 I. Kaban, S. Mhiaoui, W. Hoyer, J. G. Gasser, "Surface tension and density of binary lead and lead-free Sn-based solders", J. Phys.:Condens Matte, Vol.17, pp. 7867-7873, 2005. DOI: http://dx.doi.org/10.1088/0953-8984/17/50/007   DOI