• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.9
• /
• pp.571-576
• /
• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.3
• /
• pp.200-207
• /
• 2011

Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.373-376
• /
• 2008

New glass compositions for lead free, low temperature sealing glass frit was examined in $ZnO-V_2O_5-P_2O_5$ glass system which can be used sealing material for PDP to be made of soda lime glass substrates. Among many glass compositions, KFS-C glass showed low glass transition point (Tg) and good fluidity and adhesion characteristics when it was tested by flow button method at low temperature of $420^{\circ}C$. Its Tg was $317^{\circ}C$ and thermal expansion coefficient (CTE) was $70{\times}10^{-7}/K$. The glass frit was mixed with an organic vehicle to make a paste and it was dispensed and sealed with soda lime glass substrates at $420^{\circ}C$ for 10min. Sealed glass panels also showed good adhesion strength even sealed at low temperature of $420^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.26 no.9
• /
• pp.646-650
• /
• 2013

$(Na,K)NbO_3$-based piezoelectric ceramics were synthesized by a liquid phase sintering method with a selected glass frit. The effects of the content of the glass frit and the sintering temperature on the microstructure and the electrical properties of the samples were investigated. With the 0.1 wt% of glass frit content, $(Na_{0.52}K_{0.44}Li_{0.06})(Nb_{0.84}Ta_{0.10}Sb_{0.06})O_3$ (NKL-NTS) ceramics showed the maximum values of the relative density (99.1%) and the electro-mechanical coupling factor ($k_p$: 0.32) at the sintering temperature of $1,050^{\circ}C$. It might mean that a liquid phase sintering with a suitable glass frit having the lower flow temperature could improve the relative density and the piezoelectric properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.335-335
• /
• 2010

$SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $ZrO_2$, $Bi_2O_3$를 이용하여 성질이 다른 두 종류의 무연계 프릿트를 제조하여 특성을 표준화 하였고, 이들 무연계 프릿트를 이용하여 Ag계 도체 및 $RuO_2$계 저항페이스트롤 제조하여 특성에 미치는 프릿트 조성의 영향을 연구하였다. $B_2O_3$를 첨가하여 퍼짐특성이 큰 프릿트의 경우 더 우수한 페이스트 특성을 나타내었다.

• Korean Journal of Materials Research
• /
• v.31 no.8
• /
• pp.471-479
• /
• 2021

The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95₉ %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.5
• /
• pp.434-439
• /
• 2008

Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of $Bi_2O_3$ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a $Bi_2O_3$ content of 60 wt%, owing to the open microstructure formed at the firing temperature of $600^{\circ}C$. When the $Bi_2O_3$ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.

• Korean Journal of Materials Research
• /
• v.19 no.11
• /
• pp.613-618
• /
• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.28 no.1
• /
• pp.28-37
• /
• 2018

In order to study the NTC thermistor that can be fired at low temperature, the influence of the lead free glass frit and $RuO_2$ addition on the electrical properties of the NTC thermistor of $Mn_{1.85}Ni_{0.25}Co_{0.9}O_4$ basic composition was studied. The sintering characteristics of the specimen sintered at $1000^{\circ}C$ with 10 wt% frit added to the basic NTC composition were similar to those of the specimen sintered at $1200^{\circ}C$ without frit. However, as the amount of frit increased, the electrical resistivity and B constant were increased. In order to reduce the resistance, NTC thermistor was prepared by adding 0, 2, and 5 wt% of $RuO_2$ to the composition containing 10 wt% of frit and sintered at $1000{\sim}1200^{\circ}C$, and sintering and electrical properties were measured. The electrical resistivity and the B constant tended to decrease with increasing $RuO_2$ content. However, the resistivity was the lowest at sintering temperature of $1000^{\circ}C$ and the resistance increased with increasing sintering temperature after 5 wt% $RuO_2$ addition. The NTC thermistor sintered at $1000^{\circ}C$ with 10 wt% frit and 5 wt% $RuO_2$ in the composition of NTC showed similar electrical properties and sintering characteristics when sintered at $1200^{\circ}C$ without added frit.

• Journal of the Korean Ceramic Society
• /
• v.48 no.1
• /
• pp.63-68
• /
• 2011

The investigation is directed to lead free (Pb-free) frits that can be used for organic light emitting diode, plasma display screen devices and other sealing materials. $P_2O_5$-SnO system glasses have been prepared for Pb-free low temperature glass frit. Structure and properties of the glasses with the composition SnO-$xB_2O_3-(60-x)P_2O_5$ (x=0, 5, 10, 15, 20, 25, 30, 35, 40 mol%) were characterized by infrared spectra (IR), X-ray diffraction(XRD), Density, Molar volume, Thermo mechanical analysis(TMA) and weight loss after immersion test. Glass transition temperature($T_g$), dilatometric softening temperature($T_d$) and chemical durability increased, and coefficient of thermal expansion($\alpha$) decrease with the substitution of $B_2O_3$ for $P_2O_5$ in the range of 0~25 mol%.