1 |
F. Al-Turjman, A. Radwan, S. Mumtaz and J. Rodriguez, "Mobile traffic modelling for wireless multimedia sensor networks in IoT", Computer Comm. 112 (2017) 109.
|
2 |
J. Yuan, J. Zhang, S. Ding and X. Dong, "Cooperative localization for disconnected sensor networks and a mobile robot in friendly environments", Information Fusion 37 (2017) 22.
|
3 |
T.G. Nenov and S.P. Yordanov, "Ceramic sensors : Technology and applications", CRC Press (1996) p. 1.
|
4 |
H. Takuoki, K. Takayuki and M. Yoshihiro, "New thermistor materials", National Technical Report (1982) p. 1123.
|
5 |
T.G. Nenov and S.P. Yordanov, "Ceramic sensors : Technology and applications", CRC Press (1996) p. 296.
|
6 |
S. Jagtap, S. Rane, S. Gosavi and D. Amalnerkar, "Study of microstructure, impedance and dc electrical properties of -spinel based screen printed 'green' NTC thermistor", Curr. Appl. Phys. 10 (2010) 1156.
|
7 |
E. Elbadraoui, J.I. Baudour, B. Gillot, S. Fritsch and A. Rousset, "Cation distribution and mechanism of electrical conduction in Nikel-copper manganite spinels", Solid State Ion. 93 (1997) 219.
|
8 |
J.I. Leem T.W. Kim, J.Y. Shin and J.H. Ryu, "Preparation and characterization of Mn-Co-Ni NTC thermistor", J. Korean Cryst. Growth Cryst. Technol. 25 (2015) 80.
|
9 |
S. Jagtap, S. Rane, S. Gosavi and D. Amalnerkar, "Preparation, characterization and electrical properties of spinel-type environment frindly thick film NTC thermistors", J. Eur. Ceram. Soc. 28 (2008) 2501.
|
10 |
S. Jagtap, S. Rane and S. Gosavi, "Synthesis, characterization and fabrication of NTC thick film thermistor using lead free glass frit", J. Mater. Sci. Eng. A 6 (2016) 301.
|
11 |
M. Hrovat, D. Belavic, J. Kita, J. Hole, J. Cilensek and S. Drnovsek, "Thick film NTC thermistor and LTCC materials: The dependence of the electrical and microstructure characteristics on the firing temperature", J. Eur. Ceram. Soc. 29 (2009) 3265.
|
12 |
B.K. Koo, "Effect of lead free glass frit compositions on properties of Ag system conductor and based resistor pastes" J. Korean Electr. Electron. Mater. Eng. 24 (2011) 200.
|
13 |
W. Vogel, "Chemistry of Glass", Am. Ceram. Soc. Inc. Columbus, (1979) p. 298.
|
14 |
K. Bobran, A. Kusy, A. Witold and G. Wilczynski, "Conduction in -based thick film", International J. Electronics 78 (1996) 113.
|
15 |
M.N. Muralidharan, P.R. Rohini, E.K. Sunny, K.R. Dayas and A. Seema, "Effect of Cu and Fe addition on electrical properties of Ni-Mn-Co-O NTC thermistor composition", Ceramics International 38 (2012) 6481.
|
16 |
P.J. Holmes and R.G. Loasby, "Handbook of thick film technology" (Electrochemical Pub. Limited 1976) p. 97.
|
17 |
R.W. Vest, "Materials science and thick film technology", J. Am. Ceram. Bull. 65 (1986) 631.
|
18 |
B.K. Koo and H.G. Kim, "Microstructure and electrical properties of system thick film resistors", J. Kor. Ceram. Soc. 27 (1990) 337.
|
19 |
B.K. Koo, "Effect of lead free glass frit compositions on properties of Ag system conductor and based resistor paste", J. Korean Electr. Electron. Mater. Eng. 24 (2011) 200.
|
20 |
W.D. Ryden and A.W. Lawson, "Temperature dependence of the resitivity of and ", Phys. Letters 26A (1968) 209.
|
21 |
R.G. Johnston, "Oxides containing ruthenium in nuclear waste disposal", Ph.D. Thesis, Pennsylvania State University (1980).
|
22 |
F. Garisto, "Thermodynamic behaviour of ruthenium at high temperatures" (Atomic Energy of Canada Ltd., Pinawa, 1988) p. 4.
|