• Progress in Medical Physics
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• v.21 no.2
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• pp.232-237
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• 2010

The shielding materials designed for replacement of lead equivalent materials for lighter apron than that of lead in diagnostic photon beams. The absorption characteristics of elements were applied to investigate the lead free material for design the shielding materials through the 50 kVp to 110 kVp x-ray energy in interval of 20 kVp respectively. The idea focused to the effect of K-edge absorption of variable elements excluding the lead material for weight reduction. The designed shielding materials composited of Tin 34.1%, Antimon 33.8% and Iodine 26.8% and Polyisoprene 5.3% gram weight account for 84 percent of weight of lead equivalent of 0.5 mm thickness. The size of lead-free shielder was $200{\times}200{\times}1.5\;mm^3$ and $3.2\;g/cm^3$ of density which is equivalent to 0.42 mm of Pb. The lead equivalent of 0.5 mm thickness generally used for shielding apron of diagnostic X rays which is transmitted 0.1% for 50 kVp, 0.9% for 70 kVp and 3.2% for 90 kVp and 4.8% for 110 kVp in experimental measurements. The experiment of transmittance for lead-free shielder has showed 0.3% for 50 kVp, 0.6% for 70 kVp, 2.0% for 90 kVp and 4.2% for 110 kVp within ${\pm}0.1%$. respectively. Using the attenuation coefficient of experiments for 0.5 mm Pb equivalent of lead-free materials showed 0.1%. 0.3%, 1.0% and 2.4%, respectively. Furthermore, the transmittance of lead-free shielder for scatter rays has showed the 2.4% in operation energy of 50 kVp and 5.9% in energy of 110 kVp against 2.4% and 5.1% for standard lead thickness within ${\pm}0.2%$ discrepancy, respectively. In this experiment shows the designed lead-free shielder is very effective for reduction the apron weight in diagnostic radiation fields.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.39-43
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• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.33.1-33.1
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• 2009

Lead-free (1-x)$(Na_{0.5}K_{0.5})NbO_3$-xBa($Ti_{0.9}Sn_{0.1})O_3$ [NKN-BTS-100x] ceramics doped with 1 mol% $MnO_2$ have been prepared by the conventional solid state method and their structural and piezoelectric properties were investigated. The NKN-BTS-100x ceramics exhibited a dense and homogeneous microstructure when they were sintered at $1030-1150^{\circ}C$. Grain growth was observed for the specimen sintered at relatively low temperature of $1050^{\circ}C$. A tetragonal/orthorhombic morphotropic phase boundary (MPB) in the perovskite structure was also appeared for the NKN-BTS-100x ceramics (0.04$1050^{\circ}C$. The enhanced piezoelectric properties in the NKN-BTS ceramics with a MPB composition were obtained. Especially, for the NKN-BTS-6 ceramics, a high dielectric constant (${\varepsilon}^T_3/\varepsilon_0=1,400$), piezoelectric constant ($d_{33}=237$) and electromechanical coupling factor ($k_p=0.42$) were obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.276-276
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• 2007

As a candidate for lead-free piezoelectric materials, dense $(Na_xK_{0.94-x}Li_{0.06})NbO_3$ ceramics were developed by conventional sintering process. Sintering temperature was lowered by adding 1 mol% $Li_2O$ as a sintering aid. The electrical properties of $(Na_xK_{0.94-x}Li_{0.06})NbO_3$ ceramics were investigated as a function of Na/K ratio. When the sample sintered at $950^{\circ}C$ for 4 h with the compositions of morphotropic phase boundary, 0.47 < x < 0.51, electro-mechanical coupling factor ($k_p$) and piezoelectric coefficient ($d_{33}$) were found to reach the highest values of 0.42 and 190 pC/N, respectively. These excellent piezoelectric and electro-mechanical properties indicate that this system is potentially good candidate for lead-free material for a wide range of electro-mechanical transducer applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.200-207
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• 2011

Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.1-7
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• 2015

In this study, properties of Pb-free solders for automotive electronics parts were discussed. Lead-free solders for electronics became important after RoHS (Restriction of the use of certain Hazardous Substances) to avoid environmental pollution. Also the growing electronic rate in automotive parts and ELV (End-of Life Vehicles) make Pb-free solder for automotive electronics to be inevitable trend. Definitely, Pb-free solder for automotive electronics should have good wettability, basic strength, but need more reliability than other solders, since it has harsh condition like high temperature, humidity and engine vibration. Thus, shear strength test, thermal shock, drop test and many others are needed to ensure the high reliability. This study describes the properties and requirements of Pb-free solders for automotive electronics.

• Korean Journal of Digital Imaging in Medicine
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• v.12 no.1
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• pp.15-18
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• 2010

Main component of radiography barrier aprons is lead. To manufacture a lead-free barrier sheath, barium sulfate and organic iodine-based chemicals should be mixed with rubber. Barrier capacity was tested in the medical field. To improve adaptation of rubber with the mixture, raw materials went through milling, agitation, and extruding processes. Three sheaths were manufactured with 30%, 80%, and 120% sulfate barium, respectively. This study found 10% lower barrier capacity of lead-free barrier than the traditional lead-containing rubber sheath. Problems, however, were confronted during the agitation and extruding processes. Mixing with rubber was a technically demanding job. Inconsistent depth, problems with thermal processing and dissipation were encountered as well.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.37-42
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• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.

• Journal of Plant Biology
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• v.19 no.1
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• pp.1-6
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• 1976

This study was carried out to investigate the formation of precipitates between lead ion and the essential anions of plants, the effects of lead concentration on seed germination and plant growth in water and soil culture, and the germinating and growing recovery of inhibited seed germination and plant growth by lead. Four kinds of the seeds (Glycine max M., Triticum vulgare V., Setaria viridis (L) P. De Beauvois, and Digitoria sanguinalis (L) Scopoli var) were germinated and growth in water and soil culture included the different concentrations of lead for five days. The seeds and plants inhibited germination and growth by lead were transferred to lead free Hoagland solution and the growing recovery was observed. The precipitates of lead ion were observed in the solution of both acidity and alkalinity included each anion of $H_2PO_4^-, HPO_4^{2-}, PO_4^{3-}, SO_4^{2-} and MoO_4^{2-}$ in a room temperature, whereas the precipitates between lead ion and other anions were observed largely in the solution of alkalinity, so that it seemed that lead could be remained in the state of non-soluble in plant and soil. The inhibition of germination and growth in the water culture was observed in 100ppm of lead, whereas the inhibition in the case of the soil culture was observed in 10000ppm of lead. The difference of the effected concentration between water and soil culture in germination and the growth was 100 times. When the seed and plant inhibited the growth in 5000ppm or 10000ppm of lead for five days were transferred to lead free Hoagland solution, the recovery of germination and growth was observed in three days. This growing recovery was different according to the kinds of plant and concentrations of lead. It seemed that plant growth could be inhibited by the inhibition of the metabolism concerned with the precipitates between lead iion and other anions.