Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Lead-free Solder Technology and Reliability for Automotive Electronics

자동차 전장용 무연 솔더 기술

  • Lee, Soon-Jae (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
  • 이순재 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2015.09.03
  • Accepted : 2015.09.23
  • Published : 2015.09.30
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Abstract

In this study, properties of Pb-free solders for automotive electronics parts were discussed. Lead-free solders for electronics became important after RoHS (Restriction of the use of certain Hazardous Substances) to avoid environmental pollution. Also the growing electronic rate in automotive parts and ELV (End-of Life Vehicles) make Pb-free solder for automotive electronics to be inevitable trend. Definitely, Pb-free solder for automotive electronics should have good wettability, basic strength, but need more reliability than other solders, since it has harsh condition like high temperature, humidity and engine vibration. Thus, shear strength test, thermal shock, drop test and many others are needed to ensure the high reliability. This study describes the properties and requirements of Pb-free solders for automotive electronics.

Keywords

References

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