• Journal of Welding and Joining
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• v.29 no.1
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• pp.41-45
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• 2011

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.

• Journal of Nutrition and Health
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• v.20 no.4
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• pp.225-236
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• 1987

This study was performed to investigate the effects of lead poisoning and different levels of dietary lipid on lead and lipid metabolism in the rats. Forty eight male weanling rats of Sprague-Dawley strain weighing 73.1$\pm$11.1g were blocked into 6 groups according to body weight. Dietary lipid were given at the lev딘 of 5, 20 and 40% of total caloric intake and lead were either administered or not. The results obtained are summerized as follows ; 1) Food intake, weight gain, F.E.R. liver and epididymal. fat pad weights, weight and length of bone, hematocrit and hemoglobin content in Pb-adminstered groups were lower than these in Pb-free groups. 2) Plasma lipid and cholesterol levels were tended to be higher in Pb-administered groups than in Pb-free groups, while liver lipid and cholesterol levels were tended to be lower in Pb-adminstered groups. 3) Fecal dry matter excretion was tended to be higher in Pb-adminstered groups than in Pb-free groups, and were increased with increasing dietary lipid level. Daily fecal excretions of lipid and cholesterol were higher in high lipid groups than in low lipid groups and these levels were even higher in the animals exposed to Pb than in Pb-free groups. 4) Pb contents in blood, liver, kidney and bone were significantly higher in Pb administered groups than in Pb-free groups. Pb levels of blood, liver and bone did not show any significant difference among groups with different levels of dietary lipid, but Pb concentration in kidney of Pb-adminstered groups increased with increasing dietary lipid level.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.21-27
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• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.

• Journal of Korean Society for Quality Management
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• v.43 no.3
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• pp.239-252
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• 2015

Purpose: Lead has been widely used in radiation shielding for its low price and high workability. Recently in several europe countries, use of lead was banned for environmental issues. Also lead can cause health problems like alergies. Alternative materials for lead are highly required. The purpose of this study was to propose lead free radiation shielding material. Methods: Research of radiation shielding in Korea is not easy for certain limits such as radiation materials, experimental facilities and places. The collected data through the research were simulated using MCNPX. The simulation tools used for this study were utilized Monte Carlo method. Results: we suggest new design of lead free radiation shielding material using MCNPX code comparing shielding performance of new composite materials to lead. Conclusion: This newly introduced nano-scale composite of metal and polymer makes new chance for highly lightened radiation protective garments with endurable shielding performance.

• Journal of Korea Foundry Society
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• v.20 no.1
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• pp.3-12
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• 2000

The lead content of drinking water has been restricted to less than 15 ppb by Environmental Protection Agency (EPA) in USA. This has led to extensive research and development work at the Materials Technology Laboratory (MTL) of CANMET, a Canadian Government research laboratory, on the development of low-lead and lead-free copper alloys for plumbing applications. Attentionhas also been focused on the environmentally friendly and energy efficient permanent mold casting process to minimize the disposal of foundry sand contaminated by lead due to the use of leaded alloys in the non-ferrous foundries. A new series of alloys called SeBiLOY contaning Bi and Se been introduced to replace lead in the leaded alloys. This paper addresses some important casting characteristics such as fluidity, hot tear resistance, mechanical properties and microstructure of lead-free alloys such as SeBiLOY III and low-lead alloys such as silicon brass, silicon bronze and yellow brass in gravity permanent mold casting.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.9
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• pp.692-701
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• 2012

Recently, many lead-free piezoelectric materials have been investigated for the replacement of existing Pb-based piezoelectric ceramics because of globally increasing environmental interest. There has been remarkable improvement in piezoelectric properties of some lead-free ceramics such as $(Bi,Na)TiO_3-(Bi,K)TiO_3-BaTiO_3$, $(Na,K)NbO_3-LiSbO_3$, and so on. However, no one still has comparable piezoelectric properties to lead-based materials. Therefore, new lead-free piezoelectric ceramics are required. $BiFeO_3$ has a rhombohedrally distorted perovskite structure at room temperature and a very high Curie temperature ($T_C$= 1,100 K). And a very large electric polarization of 50 ~ 60 ${\mu}C/cm^2$ has been reported both in epitaxial thin film and single crystal $BiFeO_3$. Therefore, a high piezoelectric effect is expected also in a $BiFeO_3$ ceramics. The recent research activities on $BiFeO_3$ or $BiFeO_3$-based solid solutions are reviewed in this article.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.453-454
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• 2005

PDP에 사용되는 유전체, 격벽재, 봉착재 등의 glass들은 모두 PbO를 다량 함유하는 저융점 유리조성계로 되어있다. 최근 환경규제에 따라 Pb 대체 재료의 개발이 필요하게 되었으며, 그에 대한 많은 연구들이 진행되고 있다. 본 연구에서는 투명 유전체를 겨냥한 저융점 이면서 무해한 3성분계 Pb-free 유리를 제조하였다. 또한 SnO 계 유리와의 혼합 용융에 의한 영향을 고찰하였으며, 유리로서의 고유물성과 응용용도별 특성을 함께 고찰하였다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.437-438
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• 2010