• Proceedings of the KWS Conference
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• 2004.05a
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• pp.71-72
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• 2004

솔더접합부의 신뢰성을 평가하기위해서는 접합부에 대한 기본적인 기계적 특성 평가 및 온도, 수분, 진동, 응력 및 전압 둥 각종 환경하에서의 접합부에 대한 장단기 신뢰성시험이 요구된다. (중략)

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.21 no.1
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• pp.127-135
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• 1991

This study purports to make in consideration of the recent xeroradiographic development an exact analysis, by comparison, of conventional cephalometry and xeroradiographic cephalometry that are indispensably utilized in the field of orthodontics as a means of cephalometric measuring For that purpose attached to ten landmarks on a dry skull was a lead ball, a radio-opaque substance, and projected X-ray beam one time each by means of the two methods, and then ten times each without change of locations of the skull, in the state in which the lead ball was removed. These data were committed to ten dentists for tracing to determine a difference between the same kind of cephalometries. A computerized statistic analysis of the data shows findings, as follows: 1. Conventional cephalometry shows higher accuracy in Nasion, as compared with xeroradiographic cephalometry. 2. Xeroradiographic cephalometry is found more accurate in Anterior Nasal Spine, 'A' Point, Pogonion, Gonion, Porion, Prosthion and Orbitale than conventional cephalometry. 3. There is no difference between both methods in Basion. 4. At test between the two methods by all the dentists reveals that xeroradiographic cephalometry is more accurate than conventional cephalometry.

• Journal of Mechanical Science and Technology
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• v.16 no.7
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.55-61
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• 2010

An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.

• Journal of the Korean Chemical Society
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• v.24 no.1
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• pp.53-62
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• 1980

The present work is concerned with the studies on the production of PZT ceramics by newly developed mixing process, which tentatively named "precipitation mixing method", consists of precipitating lead carbontate in the presence of $TiO_2$ and/or $ZrO_2$. Mixtures of $PbCO_3$ and $TiO_2$ or $ZrO_2$ were compared with those obtained by ball-milling with special emphasis on the rate and mechanism of formation of lead titanate and lead zirconate. A possiblity for obtaining PZT ceramics by "precipitation mixing method" was established.

• Korean Journal of Microbiology
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• v.31 no.4
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• pp.300-305
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• 1993

Neurospora crassa accumulated cadmium. iron, manganese and lead in the mycelium. The growth of N. crassa was inhibited in the presence of cadmium but not in the presence of iron or manganese. In the presence of lead. the growth of N. crassa was accelerated. In the presence of cadmium. mycelium became thick and a conidiospore grew into a mycelial ball instead of normal threadlike gro~1h. Each metal wa'i accumulated in different subcellular organelles bound to protein and induced different proteins.

• Korean Journal of Applied Biomechanics
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• v.18 no.2
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• pp.125-139
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• 2008

The purpose of this study is to compare and analyze a kinematic characteristics of throwing performance among born visually impaired, postnatal visually impaired and visually correct people through their kinematic characteristics. Another purpose of this study is to prevent injury and improve blind's exercise leadership and physical abilities. Three video cameras were used and each camera's shooting velocity was 60field/sec. Then the longest thrown pose was collected and analyzed by using Kwon 3D ver. 3.1 program. The results obtained from this study were followings; 1. During release, the fastest speed of ball was visually corrected followed by postnatal visually impaired and then born visually impaired. 2. Visually corrected used wrist joint well and had wide body round range with similar motion patterns, however born visually impaired couldn't do this at all. 3. Visually corrected used waist to lead shoulder at Phase 2 while throwing ball, but some of born visually impaired and postnatal visually impaired couldn't use waist to lead shoulder. 4. Visually corrected looked at the way where ball would go, but blinds couldn't look where ball would go. 5. Not like visually corrected who show similar patterns, born visually impaired showed each different patterns and some postnatal visually impaired showed similar patterns with visually corrected. 6. While throwing ball, visually corrected showed flexible weight-movement, postnatal visually impaired were not good as visually corrected, and born visually impaired couldn't do weight-movement at all. Synthetically, this result showed that throwing motions are affected a lot by the time when people became blind.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.71-77
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• 2007

In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.

• Tribology and Lubricants
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• v.39 no.1
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• pp.1-7
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• 2023

Fluid pumps in chemical processes are typically driven by electric motors. Even if the motor is separated from the pump with seals, wear resulting from friction and misalignment can lead to leakage of chemical fluid, causing corrosion in the bearing supporting the motor, and, eventually, failure of the motor. It is thus a standard procedure to replace bearings at regular intervals. In this article, we propose 3D-printed plastic ball bearings for use as an alternative to commercial stainless-steel ball bearings. The plastic bearings are easy to manufacture, require less time to replace, and are chemically resistant. To validate the applicability of the plastic bearings, we first conducted chemical resistance tests. Bearings were immersed in 30 caustic acid and 30 nitric acid for 30 min and 24 h, respectively. The test results showed no corrosive damage to the bearings. A test rig was set up to compare the performance of the plastic bearings with that of the commercially equivalent deep-groove ball bearings. Loading test results showed that the plastic bearings performed as well as the commercial bearing in terms of vibration level and load-handling capability. Finally, a plastic bearing was subjected to a clean-in-place process for three months. It actually outperformed the commercial bearing in terms of chemical resistance. Thus, 3D-printed plastic bearings are a viable alternative to stainless-steel ball bearings.