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과학기술학회마을
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2 |
JEDEC standard JESD22-B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products (2006).
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MINITAB14 program.
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W. H. Zhu, L. X. Pang, J. H. L. Zhang, X. R. Poh, E. Sun, Y. F. Sun, A. Y. S. Wang and C. K. Tan, "Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.1667-1672 (2008).
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7 |
이레테크 Minitab시험팀, "일원 분산분석", 새Minitab 실무완성(in Korean), 5, pp.483-489 (2004).
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8 |
B. G. Milad and M. orduz, "Surface Finishes in a Lead-Free World", J. circuit world, 34(4), 4 (2008).
DOI
ScienceOn
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Y. S. Park, Y. M. Kwon, H. Y. Son, J. T. Moon, B. W. Jeong, K. I. Kang and K. W. Paik, "A Study of the Interfacial Reaction between Various Sn-Ag-Cu Solder Balls and ENIG (Electroless Ni Immersion Gold) and Cu-OSP (Organic Solderability Preservative) Metal Pad Finish", J. Microelectron. Packag. Soc., 14(4), 45 (2007).
과학기술학회마을
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X. X. Lei and W. T. Lee, "Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish", Electronic Packaging Technology, 7th International Conference, Shanghai, China, 1-4 (2006).
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M. George and G. Don, "Getting the Lead Out of Surface Finishing", Metal Finishing, 104(1), pp.33-36 (2006).
DOI
ScienceOn
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12 |
J. M. Koo, C. Y. Lee and S. B. Jung, "Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints", J. Microelectron. Packag. Soc., 14(4), 71 (2007).
과학기술학회마을
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13 |
R. Darveaux and A. Syed, "Reliability of area array solder joints in bending", SMTA International Proc. of the technical program, Rosemont, pp.313-324 (2000).
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14 |
T. Huang and D. Lai, "Reliability and failure analysis of CSP under bending cycle test", Microelectronics Reliability, 47(12), 2197 (2007).
DOI
ScienceOn
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