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Standardization of Bending Impact Test Methods of Sn-Ag-Cu Lead Free Solder Ball  

Jang, Im-Nam (Dept. of Materials Sci. & Eng., Pukyong National University)
Park, Jai-Hyun (Research Institute of Industrial Science & Technology)
Ahn, Yong-Sik (Dept. of Materials Sci. & Eng., Pukyong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 55-61 More about this Journal
Abstract
An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.
Keywords
Impact bending test; standardization; solder ball joint;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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1 I. N. Jang, J. H. Park and Y. S. Ahn, "Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-Free Solder Bump", J. Microelectron. Packag. Soc., 16(3), 11 (2009).   과학기술학회마을
2 JEDEC standard JESD22-B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products (2006).
3 MINITAB14 program.
4 서순근, "Weibull distribution", MINITAB 신뢰성분석(in Korean), 박준선, 9, pp.52-54, (주)이레테크, (2002).
5 B. A. Robert, "Failure Distribution", in The New Weibull Handbook, R. B. Abernethy, 4, pp.3-15, RAC, North Palm Beach, Florida (1976).
6 W. H. Zhu, L. X. Pang, J. H. L. Zhang, X. R. Poh, E. Sun, Y. F. Sun, A. Y. S. Wang and C. K. Tan, "Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish", Proc. 58th Electronic Components and Technology Conference (ECTC), pp.1667-1672 (2008).
7 이레테크 Minitab시험팀, "일원 분산분석", 새Minitab 실무완성(in Korean), 5, pp.483-489 (2004).
8 B. G. Milad and M. orduz, "Surface Finishes in a Lead-Free World", J. circuit world, 34(4), 4 (2008).   DOI   ScienceOn
9 Y. S. Park, Y. M. Kwon, H. Y. Son, J. T. Moon, B. W. Jeong, K. I. Kang and K. W. Paik, "A Study of the Interfacial Reaction between Various Sn-Ag-Cu Solder Balls and ENIG (Electroless Ni Immersion Gold) and Cu-OSP (Organic Solderability Preservative) Metal Pad Finish", J. Microelectron. Packag. Soc., 14(4), 45 (2007).   과학기술학회마을
10 X. X. Lei and W. T. Lee, "Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish", Electronic Packaging Technology, 7th International Conference, Shanghai, China, 1-4 (2006).
11 M. George and G. Don, "Getting the Lead Out of Surface Finishing", Metal Finishing, 104(1), pp.33-36 (2006).   DOI   ScienceOn
12 J. M. Koo, C. Y. Lee and S. B. Jung, "Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints", J. Microelectron. Packag. Soc., 14(4), 71 (2007).   과학기술학회마을
13 R. Darveaux and A. Syed, "Reliability of area array solder joints in bending", SMTA International Proc. of the technical program, Rosemont, pp.313-324 (2000).
14 T. Huang and D. Lai, "Reliability and failure analysis of CSP under bending cycle test", Microelectronics Reliability, 47(12), 2197 (2007).   DOI   ScienceOn