• Journal of the Mineralogical Society of Korea
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• v.10 no.2
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• pp.139-147
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• 1997

The Janghang smelter is the first lead, zinc and copper smelting facility in Korea which was operated for a half century from 1936 to 1989. The clay minerals and their heavy metal association in the soil profile around the smelter have been studied using XRD, EPMA, SEM-EDS, TEM, EPR and sequential extraction techniques. The soils in A horizon are highly acidic showing pH 4.45. The pH is going up with increasing depth. They have residual water contents of 1.18-1.51 wt%, loss on ignition of 6.32-7.79 wt%, and carbon contents of 0.08-0.88 wt%. Soils consist of quartz, feldspar, muscovite, kaolinite, vermiculite, biotite, chlorite, goethite and hematite in the decreasing abundance. The contents of clay minerals, especially vermiculite and chlorite, decrease with increasing depth. Sequential extraction experiments for the profile samples show that heavy metals (Zn, Cu, Pb, Cd) are highly concentrated in the A horizon of the soil profile as water-extractable (mostly amorphous), MgCl2-extractable (exchangeable in clay minerals), and organic phases. The heavy metal contents decrease with increasing depth. It suggests that the heavy metals are mainly associate with clay minerlas in an exchangeable state. It is also noted that heavy metals are highly concentrated in the manganese and iron oxide phases.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.670-675
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• 2004

Glasses in the $Bi_{2}O_3-SiO_2-ZnO$ glasses system were examined as a potential replacement for lead-oxide glass frits with low firing temperature ($500\sim600^{\circ}C$) for the dielectric layer of a plasma display panel (PDP). The glasses were evaluated for glass transition temperature($T_{g}$) and thermal expansion coefficient(${\alpha}$). After forming transparent thick films by a screen-printing method, it was evaluated for the optical properties. The transmittance of thick films fired at $500-600^{\circ}C$ showed above $80\%$, which was not dependent on the firing temperature. As a result, many pores were observed at samples fired at low temperature, while the number of pores from samples prepared at high temperature decreased and the pores size increased.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.1
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• pp.144-151
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• 2010

The shadowing effects lead to the serious power losses of the PV module. The shadowing effects are caused by several factors such as leafs, dust, antenna and clouds. The dye-sensitized solar cells are more economical than the conventional silicon solar cell that's why the dye-sensitized solar cells are recently focused on. We carried out research on the efficiency of the dye-sensitized solar cell depending on the level of shadow changing the formula of the circuit. The research on the efficiency of the large dye-sensitized solar cell depending on the level of shadow focused on commercialization was carried out. As the results, it is known that the series and parallel connection method is the best choice for the least losses of PV module assemblies. It is especially known that one more series connection is the best choice for the least losses about shadowing effects and current losses in the series and parallel connection.

• Advances in Traditional Medicine
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• v.8 no.2
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• pp.135-145
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• 2008

The study was aimed at evaluating the antioxidant and free radical scavenging activities of ethanolic extract and its fractions of Cleome rutidosperma. The antioxidant activity, reducing power, total phenolic content, total flavonoid content, superoxide anion scavenging activity, nitric oxide anion scavenging activity, in vitro antilipid peroxidation activity and in vitro non-enzymatic hemoglobin glycosylation were studied. The results obtained in the study indicate that Cleome rutidosperma is a potential source of natural antioxidant. All the parameters were found to be concentration dependent and increased with increasing amounts of sample. Flavonoids, phenolic compound like tannins, terpenoids may be responsible for the antioxidant activity of the plant. Variation of solubility parameters in various models may be attributed to non-linearity of activity of ethanol extract fractions models. Further investigation on the isolation and identification of antioxidant component(s) in the plant may lead to chemical entities with potential for clinical use.

• Journal of Ocean Engineering and Technology
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• v.28 no.1
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• pp.64-68
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• 2014

This study was conducted to investigate the durability of carbon fiber/epoxy composites (CFRP) in a saline water environment. The carbon fiber/epoxy composites were modified to use nanoparticles such as carbon nanotubes and titanum oxide. These hybrid composites were exposed to a saline water environment for a certain period. The weight gain according to the immersion time, a quasi-static tensile test, and micro-graphic characterization were used to investigate the samples exposed to the saline water environment. The weight gains increased with increasing immersion time. The weight gains of the hybrid composites were lower than that for pure CFRP throughout the entire immersion time. The tensile strengths decreased with increasing immersion time. The tensile strengths of the hybrid composites were higher than that of the pure CFRP throughout the entire immersion time. The pure CFRP was observed to be more degraded than the hybrid composites in the saline water environment. Therefore, it was concluded that the addition of nanoparticles to CFRP could lead to improved durability in a saline water environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Corrosion Science and Technology
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• v.17 no.3
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• pp.116-122
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• 2018

The secondary coolant of a nuclear power plant has small amounts of various impurities (S, Pb, and Cl, etc.) introduced during the initial construction, maintenance, and normal operation. While the concentration of impurities in the feed water is very low, the flow of the cooling water is restricted, so impurities can accumulate on the Top of Tubesheet (TTS). This environment is chemically very complicated and has a very wide range of pH from acidic to alkaline. In this study, the characteristics of the oxide and the mechanism of stress corrosion cracking (SCC) are investigated for Alloy 690 TT in alkaline solution containing Pb, Cl, and S. Reverse U-bend (RUB) specimens were used to evaluate the SCC resistance. The test solution comprises 3m NaCl + 500ppm Pb + 0.31m $Na_2SO_4$ + 0.45m NaOH. Experimental results show that Alloy 690 TT of the crevice environment containing Pb, S, and Cl has significant cracks, indicating that Alloy 690 is vulnerable to stress corrosion cracking under this environment.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.12
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• pp.755-760
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• 1999

Various fluoride films were investigated for a gate insulator of thin film transistor application. Conventional oxide containing materials like $SiO_2\;Ta_2O_5\; and \; Al_2O_3$ exhibited high interface states which lead to an increased threshold voltage and poor stability of TFT. In this paper, we investigated gate insulators using a binary matrix system of fluoride such as $CaF_2,\; SrF_2\; MgF_2,\; and\; BaF_2$. These materials exhibited an improvement in lattice mismatch, interface state and electrical stability. MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 5%, breakdown electric field higher than 1.2MV/cm and leakage current density of $10^{-7}A/cm^2$. MIS diode having $Ca_2$ film as an insulation layer exhibited the interface states as low as $1.58\times10^{11}cm^{-2}eV^{-1}$. This paper probes a possibility of new gate insulator materials for TFT applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.