• Journal of the Korean Society for Heat Treatment
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• v.25 no.2
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• pp.65-73
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• 2012

The Gas Diffusion Layer (GDL) of fuel cell, are required to provide both delivery of reactant gases to the catalyst layer and removal of water in either vapor or liquid form in typical PEMFCs. In this study, the fabrication of GDL containing Micro Porous Layer (MPL) made of the slurry of PVDF mixed with carbon black is investigated in detail. Physical properties of GDL containing MPL, such as electrical resistance, gas permeability and microstructure were examined, and the performance of the cell using developed GDL with MPL was evaluated. The results show that MPL with PVDF binder demonstrated uniformly distributed microstructure without large cracks and pores, which resulted in better electrical conductivity. The fuel cell performance test demonstrates that the developed GDL with MPL has a great potential due to enhanced mass transport property due to its porous structure and small pore size.

• Journal of the Korean Society of Environmental Restoration Technology
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• v.5 no.6
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• pp.30-36
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• 2002

A 0.19 hectare natural-type wetland for stream water treatment demonstration was constructed and planted with cattails from April 2001 to May 2001. Part of its bottom surfaces adjacent to levees have a variety of slope of 1 : 4~1 : 15. Two small open water areas were installed, in which emergent plants could not grow. Removal of nutrients from stream waters was a major objective of the wetland. Waters of Sinyang Stream flowing into Kohung Estuarine Lake were pumped and funneled into the wetland. The lake had been formed by a salt marsh reclamation project and was located southern coastal region of Korean Peninsula. Volumes and water quality of inflow and outflow were analyzed from July 2001 through December 2001. Inflow and outflow averaged $120.4m^3/day$ and $112.1m^3/day$, respectively. Hydraulic retention time was about 3.1 days. Average total phosphorous concentration of influent and effluent was $0.19mg/{\ell}$ and $0.075mg/{\ell}$, respectively. Total phosphorous loading rate of inflow and outflow averaged $12.05mg\;m^{-2}\;day^{-1}$ and $4.44mg\;m^{-2}\;day^{-1}$, respectively. Average total phosphorous removal rate in the wetland was $7.61mg\;m^{-2}\;day^{-1}$. Seasonal changes of phosphorous retention rates were observed. The wetland acted as effective phosphorous sinks in the initial stage of the constructed wetland.

• Journal of Korean Society on Water Environment
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• v.26 no.3
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• pp.454-459
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• 2010

This study investigated the applicability of manganese coated media such as manganese coated sand (MCS), manganese coated sericite (MCSe) and manganese coated starfish material calcined at $550^{\circ}C$ (MCSf) to remove Mn(II) in synthetic wastewater. Manganese coated media prepared at different pH was applied in the treatment of soluble Mn(II) in batch and column experiments at various Mn(II) concentrations. The amount of Mn coated on three different media was approximately 800~1100 mg/kg. From the stability test, negligible dissolution of Mn was observed above pH 3.0. In batch test, more than 40% of Mn(II) was removed by all sand media at various manganese concentrations. In order to see the effect of additional oxidant for the removal of Mn(II), 4 mg/L of hypochlorite was added in Mn(II) solution during column experiment. Breakthrough of Mn(II) was greatly retarded in the presence of hypochlorite in all column reactors packed with different media. Among the manganese coated media, MCSf prepared at pH 4 indicated the highest removal capacity. The removal efficiency of Mn(II) was also increased in the multi-layer system (0.5 g of MCS, MCSe, and MCSf each).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.1
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• pp.24-29
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• 2005

Chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing. Copper has been the candidate metallization material for ultra-large scale integrated circuits (ULSIs), owing to its excellent electro-migration resistance and low electrical resistance. However, it still has various problems in copper CMP process. Thus, it is important to understand the effect of the process variables such as turntable speed, head speed, down force and back pressure are very important parameters that must be carefully formulated in order to achieve desired the removal rates and non-uniformity. Using a design of experiment (DOE) approach, this study was performed investigating the main effect of the variables and the interaction between the various parameters during CMP. A better understanding of the interaction behavior between the various parameters and the effect on removal rate, non-uniformity and ETC (edge to center) is achieved by using the statistical analysis techniques. In the experimental tests, the optimum parameters which were derived from the statistical analysis could be found for higher removal rate and lower non-uniformity through the above DOE results.

• Journal of Korean Society on Water Environment
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• v.20 no.3
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• pp.231-235
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• 2004

To investigate removal effects of nutrients in stormwater runoff by soil of riparian protection zone, soil column experiment was conducted for 20 months. Artificial stormwater runoff containing phosphate and nitrate was applied on the surface of soil column twice a week, and phosphate and nitrate concentrations were measured from the leached water. Soil of riparian protection zone reduced the released amount of infiltrated water to the surrounding water. After infiltration of 1m depth of soil column, average removal rates of phosphate and nitrate were 97.7 % and 74.7 %, respectively. As main mechanisms of phosphate are adsorption to soil particle and utilization by plants, periodical replacement of soil and harvesting of plant at the end of growing season are required. For the removal of nutrients in stormwater runoff by the soil layer, soil of riparian protection zone has higher hydraulic conductivity to infiltrate stormwater. Sandy soil having hydraulic conductivity of about $1{\times}10^{-2}cm/s$ range might be appropriate for this purpose.

• Fire Science and Engineering
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• v.32 no.6
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• pp.108-116
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• 2018

A melted bead microstructure can be divided into a deformed and undeformed layer. Measurement errors occur in the presence of a deformed layer, which should be removed through grinding/polishing whilst preserving the original structure. This paper proposes a grinding/polishing process to analyze the microstructure of copper melted beads. For the removal of the deformed layer, the correlation between the abrasive type/size, the polishing time and polishing rate was analyzed and the thickness of the deformed layer was less than $1{\mu}m$. The results suggest a new grinding/polishing procedure: silicon carbide abrasive $15{\mu}m$ (SiC P1200) 2 min, and $10{\mu}m$ (SiC P2400) 1 min; and diamond abrasive $6{\mu}m$ 8 min, $3{\mu}m$ 6 min, $1{\mu}m$ 10 min, and $0.25{\mu}m$ 8 min. In addition, a method of increasing the sharpness of the microstructure by chemical polishing with $0.04{\mu}m$ colloidal silica for 3 min at the final stage is also proposed. The overall grinding/polishing time is 38 min, which is shorter than that of the conventional procedure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.889-893
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• 2006

Chemical mechanical polishing (CMP) achieves surface planrity through combined mechanical and chemical means. The role of slurry is very important in metal CMP. Slurry used in metal CMP normally consists of oxidizers, complexing agents, corrosion inhibitors and abrasives. This paper investigates the effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$. In order to study chemical effects of citric acid, X-ray photoelectron spectroscopy (XPS) was peformed on Cu sample after etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but $CU/CU_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu surface decrease. According to decrease of wear resistance on Cu surface removal rate increases from $285\;{\AA}/min\;to\;8645\;{\AA}/min$ in Cu CMP.

• The Korean Journal of Rheology
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• v.8 no.1
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• pp.58-68
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• 1996

고분자 가공에서 가장널리 사용되고 있는 사출공정은 비등온의 싸이클 공정이므로 사출조건에 따라 성형품은 다양한 형태의 열이력과 변형이력을 받게 되고 그 결과 최종성형 품의 기계적 물성이 현저히 달라지게 된다. 그러므로 우수한 물성을 갖는 성형품을 얻기위 해서는 열이력과 변형이력에 연관되어 나타나는 미세구조의 변화와 잔류응력을 최소화할수 있는 최적 성형조건의 선정이 대단히 중요하게 된다. 본 연구에서는 수치모사실험을 기초로 설정한 성형조건의 범위에서 다양한 사출성형실험을 수행하여 얻은 시편을 대상으로 미세구 조의 변화와 잔류응력에 미치는 성형조건의 영향을 조사함으로써 최적성형조건을 선정하기 위한 방안을 찾고자 하였다. 편광현미경을 사용하여 관찰한 결정성 고분자수지 시편의 내부 구조는 전형적인 skin-core 구조를 보일뿐만아니라 충전속도, 사출온도, 금형온도, 및 gate로 부터의 위치 변화에 따라 미세구조가 현저히 변함을 알수 있었으며 광탄성법과 layer removal method를 이용하여 조사한 무정형 고분지수 시편의 잔류응력은 금형온도와 사출압 에 가장 영향을 많이 받으며 두께 방향으로 parabola한 분포를 가짐을 알수 있었다. 이상의 결과로부터 사출조건의 변화에 따라 잔류응력과 내부구조가 현저히 변하게 되며 이는 성형 품의 물성에 직접적인 영향을 미치고 있음을 알수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Fibers and Polymers
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• v.2 no.4
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• pp.203-211
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• 2001

Residual stresses were predicted by a flow analysis in the mold cavity and residual stress distribution in the injection molded product was measured. Flow field was analyzed by the hybrid FEM/FDM method, using the Hele Shaw approximation. The Modified Cross model was used to determine the dependence of the viscosity on the temperature and the shear rate. The specific volume of the polymer melt which varies with the pressure and temperature fields was calculated by the Tait\`s state equation. Flow analysis results such as pressure, temperature, and the location of the liquid-solid interface were used as the input of the stress analysis. In order to calculate more accurate gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise direction was predicted in two cases, the free quenching, under the assumption that the shrinkage of the injection molded product occurs within the mold cavity and that the solid polymer is elastic. Effects of the initial flow rate, packing pressure, and mold temperature on the residual stress distribution was discussed. Experimental results were also obtained by the layer removal method for molded polypropylene.