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http://dx.doi.org/10.7731/KIFSE.2018.32.6.108

Development of Grinding/Polishing Process for Microstructure Observation of Copper melted Beads  

Park, Jin-Young (Korea Safety Research Institute)
Bang, Sun-Bae (Korea Safety Research Institute)
Publication Information
Fire Science and Engineering / v.32, no.6, 2018 , pp. 108-116 More about this Journal
Abstract
A melted bead microstructure can be divided into a deformed and undeformed layer. Measurement errors occur in the presence of a deformed layer, which should be removed through grinding/polishing whilst preserving the original structure. This paper proposes a grinding/polishing process to analyze the microstructure of copper melted beads. For the removal of the deformed layer, the correlation between the abrasive type/size, the polishing time and polishing rate was analyzed and the thickness of the deformed layer was less than $1{\mu}m$. The results suggest a new grinding/polishing procedure: silicon carbide abrasive $15{\mu}m$ (SiC P1200) 2 min, and $10{\mu}m$ (SiC P2400) 1 min; and diamond abrasive $6{\mu}m$ 8 min, $3{\mu}m$ 6 min, $1{\mu}m$ 10 min, and $0.25{\mu}m$ 8 min. In addition, a method of increasing the sharpness of the microstructure by chemical polishing with $0.04{\mu}m$ colloidal silica for 3 min at the final stage is also proposed. The overall grinding/polishing time is 38 min, which is shorter than that of the conventional procedure.
Keywords
Copper beads; Deformed layer; Removal rate; Damaged layer; Polishing; Grinding;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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