• 한국생산제조학회지
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• 제24권1호
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• pp.75-80
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• 2015

This paper proposes a selective electrodeposition process that uses laser masking and a DC voltage. Selective electrodeposition using laser masking and a DC voltage is more efficient than that using laser masking and a pulse voltage. In other words, electrodeposition with a DC voltage allows for precise selective deposition without the limitation of the deposition region. Also, a selective electrodeposition method that uses laser masking and DC voltage can reduce the electrodeposition time. The characteristics of a copper layer deposited by laser masking and DC voltage were examined under various conditions. A selective copper layer with various micro patterns of $2{\mu}m$ thickness was successfully fabricated.

• 한국생산제조학회지
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• 제25권1호
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• pp.36-41
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• 2016

A method is proposed for the improvement of deposition reproducibility in the selective electrodeposition process using laser masking and DC voltage. Selective electrodeposition using laser masking and DC voltage can achieve a deposited layer with micro patterns. However, selective electrodeposition using laser masking and DC voltage have a critical problem: the lack of reproducibility in selective deposition. The reproducibility of selective electrodeposition can be improved by a new process that consists of laser masking, two-step electro-deposition, laser scribing, and ultrasonic cleaning. The experiments in this study show that the reproducibility of selective deposition can be successfully improved by the combination of two-step electrodeposition and laser scribing.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.177-178
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• 2012

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• 한국전기전자재료학회논문지
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• 제28권11호
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• pp.748-751
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• 2015

Sound Masking System technology as by sound the same on all bands and artificially generates a constant sound shield People want to hear or recognize the people with the noise generated from the interior of the way. Prevent hearing or prevent recognition by using the technology to control the audible frequency band Continue to emit constant and uniform shielding sound audible frequency band Even the security content of speech (20 Hz~20 KHz). That interception laser eavesdropping, internal solicitations, during recording Or delay the decoding was a result of the effect of interference calculated Experience noise disturbance index is applied around the Stress Index is the average index is 10.16 was a luxury for the average index is then applied to the index 3.07 Noise is significantly lower stress level has improved noise conditions.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.364-364
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• 2009

The solar cell is in the spotlight as a future green energy source. In the solar cells based on silicon wafer, the improvement of efficiency is one of crucial issues. One of techniques for high efficiency is texturing on the surface of solar cells. We studied the laser texturing on the surface of multi-crystalline silicon solar cells. The laser texturing followed by chemical etching is adequate for the multi-crystalline structure which have random crystallographic directions. We used the fiber laser for texturing and the SiNx as a masking layer for etching process. We investigated the shapes of holes for texturing in the various laser power conditions and analyzed the holes after removal of thermal damages caused by laser ablation through a 3D profiler.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1633-1635
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• 1997

For AMLCD pixel switching device, poly-Si TFT has the advantage of high field effect mobility over a-Si TFT. However, it also has some disadvantage such as large leakage current and more masking steps. We propose a new Inverse Staggered poly-Si TFT with a-Si offset. We have fabricated the new device and verified high ON/OFF current ratio. The device has lower leakage current level than the conventional Inverse Staggered poly-Si TFT and the same number of masking steps compared with conventional a-Si TFT's.

• 대한기계학회논문집B
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• 제36권11호
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• pp.1135-1140
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• 2012

마스크를 이용하여 니켈 시드층의 형성 후 실버 도금을 통해 태양전지 상부전극을 형성하는 2 단계 전극형성 공정이 태양전지의 고효율화 방안으로 제안되었다. 본 연구에서는, 자외선 경화형 혹은 상변화 잉크를 고비용의 인쇄공정을 통해 마스크를 형성하는 방법을 대신하여, 코팅과 레이저의 복합공정을 통해 마스크를 형성하는 방법에 대해 제안하도록 한다. 마스크를 형성하는 물질로서 저비용의 저융점 왁스 혹은 플루오르카본 용액을 태양전지 웨이퍼 상에 코팅 후 레이저로 선택적으로 제거하여 전극패턴을 형성하였으며, 플루오르카본 용액 코팅이 왁스 코팅보다 패턴 균일도 측면에서 우수할 뿐만 아니라 통계적으로 0.16% 태양전지 효율증대를 유발한다는 점이 발견되었다.

• 한국전자파학회논문지
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• 제19권2호
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• pp.257-262
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• 2008

본 논문에서는 열전도도가 우수한 AIN 기판에 $CO_2$ Laser 장비 를 이용하여 Thru-hole과 scribing line을 형성하기 위해 $CO_2$ laser의 파라미터(촛점 거리, 공기량, 레이저 빔 시간, 펄스 개수)를 실험하고, 자체 정렬 마스킹 기법을 이용한 5 um 두께의 Cu 도금으로 AIN 기판에 전송 선로와 나선형 평면 인덕터를 제작하였다. AIN 기판에서의 마이크로스트립 라인의 전송 손실은 10 GHz에서 0.1 dB/mm, 6 nH 나선형 평면 인덕터는 1 GHz에서 56의 품질 계수를 얻었고, 이를 통해 열전도도가 우수한 AIN 기판의 고전력 RF 응용이 가능할 것으로 기대한다.

• Annals of Laboratory Medicine
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• 제38권6호
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• pp.545-554
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• 2018

Background: The increasing morbidity and mortality rates associated with Acinetobacter baumannii are due to the emergence of drug resistance and the limited treatment options. We compared characteristics of colistin-resistant Acinetobacter baumannii (CR-AB) clinical isolates recovered from patients with and without prior colistin treatment. We assessed whether prior colistin treatment affects the resistance mechanism of CR-AB isolates, mortality rates, and clinical characteristics. Additionally, a proper method for identifying CR-AB was determined. Methods: We collected 36 non-duplicate CR-AB clinical isolates resistant to colistin. Antimicrobial susceptibility testing, Sanger sequencing analysis, molecular typing, lipid A structure analysis, and in vitro synergy testing were performed. Eleven colistin-susceptible AB isolates were used as controls. Results: Despite no differences in clinical characteristics between patients with and without prior colistin treatment, resistance-causing genetic mutations were more frequent in isolates from colistin-treated patients. Distinct mutations were overlooked via the Sanger sequencing method, perhaps because of a masking effect by the colistin-susceptible AB subpopulation of CR-AB isolates lacking genetic mutations. However, modified lipid A analysis revealed colistin resistance peaks, despite the population heterogeneity, and peak levels were significantly different between the groups. Conclusions: Although prior colistin use did not induce clinical or susceptibility differences, we demonstrated that identification of CR-AB by sequencing is insufficient. We propose that population heterogeneity has a masking effect, especially in colistin non-treated patients; therefore, accurate testing methods reflecting physiological alterations of the bacteria, such as phosphoethanolamine-modified lipid A identification by matrix-assisted laser desorption ionization-time of flight, should be employed.