• Title/Summary/Keyword: Laser beam machining

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Effects of Beam Parameters on Excimer Laser Ablation (엑사이머 레이저 어블레이션 가공에서의 빔변수의 영향)

  • Bang Se Yoon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.7 s.172
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    • pp.38-46
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    • 2005
  • In laser machining such as drilling with $CO_2$ or Nd:YAG laser, and etching or ablation with Excimer laser, one of the most important parameters affecting the machining is known to be beam characteristics. In this paper a numerical study is performed to investigate the effects of beam parameters, especially in the process of excimer laser ablation of polymers. Results of different beam conditions reveal that if the ablated depth is small compared to beam size the simple photochemical etching model is suitable to predict the etched shape, and that the importance of precise alignment becomes large as beam quality factor becomes larger.

A Study on the Development of the Rotary and Linear Laser Modules (회전식 및 직선식 레이저 모듈 개발에 관한 연구)

  • Sim, Min-Seop;Hwang, Seong-Ju;Kim, Dong-Hyeon;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.2
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    • pp.119-123
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    • 2014
  • Recently, laser processing technologies have been developed in many different industrial fields. The laser processing technologies are widely being applied such as laser assisted machining, cladding, heat treatment and coating. In the laser modules of the laser assisted machining system, laser lens is very important for accuracy and productivity of product. As the laser beam size, shape and focusing distance change, heat input energy of preheating point can be changed, the laser module of the laser assisted machining system should be equipped with various lenses differing beam size, beam shape and focusing distance. In this study, the rotary and linear laser modules are suggested. The finite element analysis is carried out to certify the static and dynamic stabilities of the developed laser modules. Finally, the rotary and linear laser modules have been fabricated successfully using the analysis results.

Micromachining Using Hybrid of Laser Beam and Electrical Discharge Machining (레이저 빔 가공과 방전 가공을 이용한 복합 미세 가공)

  • Kim, San-Ha;Chung, Do-Kwan;Kim, Bo-Hyun;Oh, Kwang-Hwan;Jeong, Sung-Ho;Chu, Chong-Nam
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.10
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    • pp.108-115
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    • 2009
  • Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

Study of ablation depth control of ITO thin film using a beam shaped femtosecond laser (빔 쉐이핑을 이용한 펨토초 레이저 ITO 박막 가공 깊이 제어에 대한 연구)

  • Kim, Hoon-Young;Yoon, Ji-Wook;Choi, Won-Seok;Stolberg, Klaus;Whang, Kyoung-Hyun;Cho, Sung-Hak
    • Laser Solutions
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    • v.17 no.1
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    • pp.1-6
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    • 2014
  • Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

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Mechanical Properties of Silicon Nitride Laser-Assisted Machined by Laser Power (레이저 출력에 따른 레이저예열선삭된 질화규소의 기계적 특성)

  • Kim, Jong-Do;Lee, Su-Jin;Shin, Ding-Sig;Suh, Jeong;Lee, Jae-Hoon
    • Laser Solutions
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    • v.12 no.4
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    • pp.12-16
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    • 2009
  • The engineering ceramic is one of the materials advantageous in various conditions with high strength, endurance at high temperature, abrasion resistance and corrosion resistance, etc. However, due to high strength and high brittleness, ceramic incurs high costs and long time on finishing process required after sintering. So a process for obtaining wanted measurements of them has been studied using the high temperature which makes ceramics softened and heat affected recently. This study makes an estimate of laser-assisted machining (LAM) if an economically practical process for manufacturing precision silicon nitride ceramic parts using laser beam. In this study, mechanical properties of silicon nitride at high temperature were observed. And during the LAM, it was observed that cutting force and tool wear were reduced and oxidation of machined surface was increased according to a increase of laser power.

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Micromachining of the Si Wafer Surface Using Femtoseocond Laser Pulses (펨토초 레이저를 이용한 실리콘 웨이퍼 표면 미세가공 특성)

  • Kim, Jae-Gu;Chang, Won-Seok;Cho, Sung-Hak;Whang, Kyung-Hyun;Na, Suck-Joo
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.12 s.177
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    • pp.184-189
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    • 2005
  • An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

Laser Micro Machining and Electrochemical Etching After Surface Coating (미세 레이저 가공의 표면코팅 후 전해 에칭)

  • Kim, Tae Pung;Park, Min Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.6
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    • pp.638-643
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    • 2013
  • Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

Micro-groove machining of SUS304 using by femto second laser (펨토초 레이저를 이용한 SUS304 의 마이크로 홈가공)

  • Kwak T.S.;Ohmori H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1179-1180
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    • 2005
  • 3D micro scaled shapes are fabricated with the method of direct writing and superposing grooving in ambient air using femto-second laser pulses and copper, aiming at establishing an industrially useful femto-second laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. For the several advantages, there is no thermally influenced region around the area irradiated by the laser beam and surfaces irradiated laser beam are smooth and substances ablated to form are no attached on the surface of works and so on, the femto-second laser technology is anticipated for advanced micro/nano precision technology.

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