• Title/Summary/Keyword: Laser Diode(LD)

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Fabrication of Er/Yb co-doped phosphate glass waveguides by potassium ion exchange (Er과 Yb이 첨가된 인산염 유리의 K 이온교환 공정을 통한 증폭용 광도파로 제조)

  • 김덕준;신장욱;박상호;김태흥;심재기;성희경
    • Korean Journal of Optics and Photonics
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    • v.11 no.3
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    • pp.202-205
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    • 2000
  • One step thermal potassium ion exchange process was carried out to form optical channel waveguides in an ErNb co-doped phosphate glass. Flowing oxygen gas into KN03 melt during ion exchange was effective to prevent glass surface damage that causes an increase of waveguide propagation loss. Amplification characteristics of the waveguides were evaluated at $1.5{\mu}m$ signal wavelength with 980 om laser diode pump. A 45 mm long waveguide whose processing parameters had been optimized exhibited a small signal net gain of 7.5 dB at the launched pump power of 160 mW.160 mW.

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누설전류가 작은 $1.3\mum$ GaInAsP/InP 평면매립형 레이저 다이오드

  • Lee, Jung-Gi;Cho, Ho-Sung;Park, Kyung-Hyun;Park, Chan-Yong;Lee, Yong-Tak
    • ETRI Journal
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    • v.13 no.4
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    • pp.2-9
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    • 1991
  • Buried-heterostructure lasers are more difficult to fabricate than weakly index guided or gain guided lasers. However, these strongly index guided structures are most suitable for a source of lightwave transmission systems. But, for conventional etched mesa buried heterostructure lasers, the regrowth of InP blocking layer is difficult and irreproducible. So, there are inevitable leakage currents flowing outside the active region resulting poor performance. To eliminate these problems, we used a planar buried heterostructure. As a results, the average threshold current was 28mA and the differential quantum efficiency was about 20% per facet for $1.3\mum$ GaInAsP/InP PBH-LD. The initial forward leakage current was not exceeding $1\muA$ and the reverse voltage for $-10\muA$ was -3V~-5V, these are improved figure of 1mA~10mA and -1V~-3V for EMBH laser diode. The chip modulation bandwidth was more than 2.4GHz for $1.5I_th$.

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Selective regrowth of InP current blocking layer by chloride vapor phase epitaxy on mesa structures (Chloride VPE 법에 의한 메사 구조위에 InP 전류 차단막의 선택적 재성장)

  • 장영근;김현수;최훈상;오대곤;최인훈
    • Journal of the Korean Vacuum Society
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    • v.8 no.3A
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    • pp.207-212
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    • 1999
  • Undoped InP epilayers with high purity were grown by using $In/PCl_3/H_2$ chloride vapor phase epitaxy. It was found that the growth of InP homoepitaxial layer is optimized at the growth temperature of $630^{\circ}C$ and at the $PCl_3$ molar fraction of $1.2\times10^{-2}$. The carrier concentration of InP epilayer was less than $10^{14} {cm}^{-3}$ from the low temperature (11K) photoluminescence measurement. Growth behavior of undoped InP current blocking layer on reactive ion-etched (RIE) mesas has been investigated for the realization of 1.55 $\mu \textrm m$buried-heterostructure laser diode (BH LD), using chloride vapor phase epitaxy. On the base of InP homoepitaxy, InP current blocking layers were grown at the growth temperatures ranging from $620^{\circ}C$ to $640^{\circ}C$. Almost planar grown surfaces without edge overgrowth were achieved as the growth temperature increased. It implied that higher temperature enhanced the surface diffusion of the growth species on the {111} B planes and suppressed edge overgrowth.

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Design of a Single Chip CMOS Transceiver for the Fiber Optic Modules (광통신 모듈용 단일칩 CMOS 트랜시버의 설계)

  • 채상훈;김태련;권광호
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.2
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    • pp.1-8
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    • 2004
  • This paper describes the design of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been designed in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3 metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$ and the estimated power dissipation is less than 900 ㎽ with a single 5 V supply.

Implementation of a Single Chip CMOS Transceiver for the Fiber Optic Modules (광통신 모듈용 단일 칩 CMOS트랜시버의 구현)

  • 채상훈;김태련
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.9
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    • pp.11-17
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    • 2004
  • This paper describes the implementation of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been fabricated in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3-metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$, and it has 32.3 ps rms and 335.9 ps peak to peak jitter on loopback testing. the measured power dissipation of whole chip is 1.15 W(230 mW) with a single 5 V supply.

Ridge Formation by Dry-Etching of Pd and AlGaN/GaN Superlattice for the Fabrication of GaN Blue Laser Diodes

  • Kim, Jae-Gwan;Lee, Dong-Min;Park, Min-Ju;Hwang, Seong-Ju;Lee, Seong-Nam;Gwak, Jun-Seop;Lee, Ji-Myeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.391-392
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    • 2012
  • In these days, the desire for the precise and tiny displays in mobile application has been increased strongly. Currently, laser displays ranging from large-size laser TV to mobile projectors, are commercially available or due to appear on the market [1]. In order to achieve a mobile projectors, the semiconductor laser diodes should be used as a laser source due to their size and weight. In this presentation, the continuous etch characteristics of Pd and AlGaN/GaN superlattice for the fabrication of blue laser diodes were investigated by using inductively coupled $CHF_3$ and $Cl_2$ -based plasma. The GaN laser diode samples were grown on the sapphire (0001) substrate using a metal organic chemical vapor deposition system. A Si-doped GaN layer was grown on the substrate, followed by growth of LD structures, including the active layers of InGaN/GaN quantum well and barriers layer, as shown in other literature [2], and the palladium was used as a p-type ohmic contact metal. The etch rate of AlGaN/GaN superlattice (2.5/2.5 nm for 100 periods) and n-GaN by using $Cl_2$ (90%)/Ar (10%) and $Cl_2$ (50%)/$CHF_3$ (50%) plasma chemistry, respectively. While when the $Cl_2$/Ar plasma were used, the etch rate of AlGaN/GaN superlattice shows a similar etch rate as that of n-GaN, the $Cl_2/CHF_3$ plasma shows decreased etch rate, compared with that of $Cl_2$/Ar plasma, especially for AlGaN/GaN superlattice. Furthermore, it was also found that the Pd which is deposited on top of the superlattice couldn't be etched with $Cl_2$/Ar plasma. It was indicating that the etching step should be separated into 2 steps for the Pd etching and the superlattice etching, respectively. The etched surface of stacked Pd/superlattice as a result of 2-step etching process including Pd etching ($Cl_2/CHF_3$) and SLs ($Cl_2$/Ar) etching, respectively. EDX results shows that the etched surface is a GaN waveguide free from the Al, indicating the SLs were fully removed by etching. Furthermore, the optical and electrical properties will be also investigated in this presentation. In summary, Pd/AlGaN/GaN SLs were successfully etched exploiting noble 2-step etching processes.

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MOCVD를 이용한 자발성장 InAs 양자점의 적층 성장 시 발생하는 파장변화량 제어

  • Choe, Jang-Hui;An, Seong-Su;Yu, Su-Gyeong;Lee, Jong-Min;Park, Jae-Gyu;Lee, Dong-Han;Jo, Byeong-Gu;Han, Won-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.150-151
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    • 2011
  • 양자점 Laser Diode(LD)는 낮은 문턱전류, 높은 미분 이득을 갖으며 또한 온도변화에도 안정적이기 때문에 광통신분야에서 광원으로 양자점 LD를 사용하기 위한 연구가 계속되고 있다. 양자점은 fill factor가 낮기 때문에 양자점의 밀도를 높이거나 양자점을 적층 성장하여 fill factor를 높인다. 그러나 양자점을 적층 성장하면 각 층간의 응력, 수직적 결합, 전기적인 결합이 생기며 이는 양자점의 전기적, 광학적 특성에 영향을 미친다. 본 연구에서는 metal organic chemical vapor deposition (MOCVD)을 이용하여 InP기판 위에 자발성장 법으로 InAs 양자점을 다주기 성장하였으며 photoluminescence (PL)을 이용하여 광학적 특성을 분석하였다. precursor는 trimethylindium (TMI), trimethylgalium (TMGa), $PH_3$, $AsH_3$를 사용하였으며 carrier gas는 $H_2$를 사용하였다. InAs 양자점은 1100 nm의 파장을 갖는 InGaAsP barrier 위에 성장하였고, InAs와 InGaAsP의 성장온도는 $520^{\circ}C$이며 InAs 양자점 성장시 V/III 비는 3.66으로 일정하게 유지하였다. 그림 1은 양자점 성장시간을 0.11분으로 고정하여 3주기(A), 5주기(B), 8주기(C) 성장한 구조이며 그림 2는 양자점 성장시간을 3주기마다 0.01분씩 줄여가며 3주기는 0.11분${\times}$3(D), 6주기는 0.11분${\times}$3+0.10분${\times}$3(E), 9주기는 0.11분${\times}$3+0.10분${\times}$3+0.09분${\times}$3(F) 으로 성장한 성장구조이다. 각 성장한 시료는 PL을 이용하여 파장과 반치폭을 측정하였다. 그림 3은 양자점 성장시간을 고정한 시료 A, B, C의 PL파장과 PL반치폭 데이터이다. PL파장은 A, B, C 시료 각각 1504 nm, 1571 nm, 1702 nm이며 반치폭은 각각 140 meV, 140 meV, 150 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 67 nm, 0 meV 6주기에서 9주기로 증가할 때는 131 nm, 10 meV 증가하였다. 다음 그림4는 양자점 성장시간을 조절하여 성장한 양자점 시료 D, E, F의 PL파장과 PL반치폭 데이터이다. PL파장은 D, E, F 시료 각각 1509 nm, 1556 nm, 1535 nm이며 반치폭은 각각 137 meV, 138 meV, 144 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 47 nm, 1 meV 증가하였고, 6주기에서 9주기로 증가할 때는 21 nm 감소, 6 meV 증가하였다. 양자점 성장시간을 고정하여 다주기를 성장하였고 또 3주기마다 양자점 성장시간을 달리하여 다주기를 성장하였으며 PL을 이용해 광학적 특성을 연구하였다. 성장된 양자점의 PL 파장과 PL 반치폭 변화를 통해 적층구조에서 성장 주기가 늘어날수록 양자점의 크기가 증가하는 것을 확인하였고 또한 적층성장을 할 때 양자점 성장시간을 줄임으로써 양자점의 크기 변화를 제어 할 수 있었다.

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