• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.223.2-223.2
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• 2015

Polyurethane acrylate (PUA) has been introduced to utilize as a mold material for sub-100 nm lithography as it provides advantages of stiffness for nanostructure formation, short curing time, flexibility for large area replication and transparency for relevant biomedical applications. Due to the ability to fabricate nanostructures on PUA, there have been many efforts to mimic extracellular matrix (ECM) using PUA especially in a field of tissue engineering. It has been demonstrated that PUA is useful for investigating the nanoscale-topographical effects on cell behavior in vitro such as cell attachment, spreading on a substrate, proliferation, and stem cell fate with various types of nanostructures. In this study, we have conducted surface modification of PUA films with micro/nanostructures on their surfaces using plasma treatment. In general, it is widely known that the plasma treated surface increases cell attachment as well as adsorption of ECM materials such as fibronectin, collagen and gelatin. Effect of plasma treatment on PUA especially with surface of micro/nanostructures needs to be understood further for its biomedical applications. We have evaluated the modified PUA film as a culture platform using adipose derived stem cells. Then, the behavior of stem cells and the level of adsorbed protein have been analyzed.

• Applied Microscopy
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• v.26 no.2
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• pp.235-241
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• 1996

Amophization and decomposition behaviour in $Mg_{62}Cu_{26}Y_{12}$ alloy prepared by melt spinning method and wedge type metal mold casting method have been investigated by a detailed transmission electron microscopy. Amorphous phase has formed in melt-spun ribbon. In the case of the wedge type specimen, however, the amorphous phase has formed only around the tip area within about 2 mm thickness. The remaining part of the wedge type specimen consists of crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$. The supercooling for crystallization behaviour of the amorphous $Mg_{62}Cu_{26}Y_{12}$ alloy, ${\Delta}T_x$ has been measured to be about 60 K. Such a large undercooling of the crystallization bahaviour enables formation of the amorphous phase in the $Mg_{62}Cu_{26}Y_{12}$ alloy under the cooling rate of $10^{2}K/s$. The amorphous $Mg_{62}Cu_{26}Y_{12}$ has decomposed into crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$ after heat treatment at $170^{\circ}C\;and\;250^{\circ}C$.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.2 s.95
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• pp.123-129
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• 1999

Ball-end milling process is widely used in the die and mold manufacturing because of suitable one for the machining of free-form surface. During the process, the pencil cutting operation can be adopted before finish cut to eliminate overload in uncut area caused by large diameter of ball-end mill. The ball-end mill cutter for the pencil cutting is easily deflected by cutting force due to the long and thin shape, and the tool deflection in pencil cutting is one of the main reason of the machining errors in a free-form surface. The purpose of this study is to find the characteristics of deflected cutter trajectory by constructing measurement system with eddy-current sensor. It was found that the severe reduction of corner radius produced the overcut during the plane cutting. Up cutting method induced the overcut both plane and slope cutting, but down cutting one induced the undercut. From the experiments, down cutting with upward cutting path can generate the small undercut surface.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.76-82
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• 2003

The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.697-701
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• 2009

A simple method for the fabrication of porous nano-master for the anti-reflection effect on the transparent substrates is presented. In the conventional fabrication methods for antireflective surface, coating method using materials with low refractive index has usually been used. However, it is required to have a high cost and long processing time for mass production. In this paper, we developed a porous nano-master with anti-reflective surface for the molding stamper of the injection mold, hot embossing and UV imprinting by using the aluminum anodizing process. Through two-step anodizing and etching processes, a porous nano-master with anti-reflective surface was fabricated at the large area. Pattern size Pore diameter and inter-pore distance are about 130nm and 200nm, respectively. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.61-66
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• 2015

Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.

• Transactions of Materials Processing
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• v.12 no.7
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• pp.640-646
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• 2003

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as potential application to fabricate the surface nanostructures because of its operational versatility and simplicity. The objective of the work is to suggest new mastless pattern fabrication technique using the combination of machining by nanoindenter and KOH wet etching. The scratch option of the nanoindenter is a very promising method for obtaining nanometer scale features on a large size specimen because it has a very wide working area and load range. Sample line patterns were machined on a silicon surface, which has a native oxide on it, by constant load scratch (CLS) of the Nanoindenter with a Berkovich diamond tip, and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structure was made because of masking effect of the affected layer generated by nano-scratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved patterns can be used as a mold that will be used for mass production processes such as nanoimprint or PDMS molding process. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Journal of Sensor Science and Technology
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• v.30 no.3
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• pp.170-174
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• 2021

As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.235-240
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• 2018

ICT converged smart factory started from German Industry 4.0 has been the driving force for the $4^{th}$ Industrial Revolution and the center of manufacturing innovation for major industrial countries. It will be developed according to industry characteristics of each country. Korea is relatively later than other competing countries in the smart factory area. So, the government is establishing related policy and tendering all sorts of supports for smart factory mainly to the small and medium-sized enterprises to spread over the manufacturing industry. It is necessary for government to categorize among similar manufacturing industry and make them share digitalized production information mutually. It will be more effective method for securing global competitiveness than the uniform support. Also, large companies need to establish cloud based production forecasting system over similar industry and share it with other companies rather than expansion of individual smart factory. Mutual development in the manufacturing industry will be realized when the small and medium-sized enterprises and large companies take part in the cooperating ground of smart factory.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding