• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.18-22
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by grinding, lapping and polishing. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. This mechanical stress and strain can be cured by thermal anneal ing process. The sapphire crystalline wafers were annealed at $1100~1400^{\circ}C$ and then characterized by double crystal X-ray diffraction. The sample showed good quality of crystalline wafer surface wi th full width at hal f maximum of 16 arcsec for the 4-hour heat-treatment at $1300^{\circ}C$.

• Nuclear Engineering and Technology
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• v.54 no.12
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• pp.4620-4624
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• 2022

Several cadmium zinc telluride (CZT) crystals were fabricated into radiation detectors using methods that included slicing, dicing, lapping, polishing, and chemical etching. A wet passivation with sodium hypochlorite (NaOCl) was then carried out on the Br-etched detectors. The Te-rich layer on the CZT surface was successfully compensated to the Te oxide layer, which was analyzed with X-ray photoelectron spectroscopy data of both a Br-etched crystal and a passivated CZT crystals. We confirmed that passivation with NaOCl improved the transport property by analyzing the mobility-lifetime product and surface recombination velocity. The electrical and spectroscopic properties of large volume detectors were compared before and after passivation, and then the detectors were observed for a month. Both bar and quasi-hemispherical detectors show an enhancement in performance after passivation. Thus, we could identify the effect of NaOCl passivation on large volume CZT detectors.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.259-263
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• 2001

There are several steps such as slicing, lapping, chemical etching and mechanical polishing in the silicon wafer production process. The chemical etching step is necessary to remove damaged layer caused In the slicing and lapping steps. The typical etching liquor is the acid mixture comprising nitric acid, acetic acid and hydrofluoric acid. At present, the waste acid is treated by a neutralization method with a high alkali cost and balky solid residue. A solvent extraction method is applicable to separate and recover each acid. Acetic acid is first separated from the waste liquor using 2-ethlyhexyl alcohols as an extractant. Then, nitric acid is recovered using TBP(Tri-butyl phosphate) as an extractant. Finally hydrofluoric acid is separated with the TBP solvent extraction. The expected recovered acids in this process are 2㏖/l acetic acid, 6㏖/1 nitric acid and 6㏖/l hydrofluoric acid. The yields of this process are almost 100% for acetic acid and nitric acid. On the other hand, it is important to recover and reuse the metal values contained in various industrial wastes in a viewpoint of environmental preservation. Most of industrial products are made through the processes to separate impurities in raw materials, solid and liquid wastes being necessarily discharged as industrial wastes. Chemical methods such as solvent extraction, ion exchange and membrane, and physical methods such as heavy media separation, magnetic separation and electrostatic separation are considered as the methods for separation and recovery of the metal values from the wastes. Some examples of the application of solvent extraction to the treatment of wastes such as Ni-Co alloy scrap, Sm-Co alloy scrap, fly ash and flue dust, and liquid wastes such as plating solution, the rinse solution, etching solution and pickling solution are introduced.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.4
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• pp.13-20
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• 2014

In this paper, the effects of a nonionic surfactant on the etch uniformity and the etch profile during the wet-etching process of high-purity aluminum were investigated for the fabrication of uniform micropattern arrays. To improve the surface roughness of a high-purity aluminum plate, a mechanical lapping process and an electrolytic polishing process were used. After electrolytic polishing process, the surface roughness, Ra, of the high-purity aluminum plate was improved from $1.25{\mu}m$ to $0.02{\mu}m$. A photoresist was used as an etching mask during the aluminum etching process, where the mixture of phosphoric acid, acetic acid, nitric acid, a nonionic surfactant and water was used as the aluminum etchant. Different amounts of the Triton X-100 nonionic surfactant were added to the aluminum etchant to investigate the effect of a nonionic surfactant during the wet-etching process of high-purity aluminum. The etch rate and the etch profile were measured by an optical interferometer and a scanning electron microscope.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.81-81
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• 2009

반도체 산업의 중심 소재인 실리콘(Si)은 사용 목적과 환경에 따라 물성적 한계가 표출되기 시작했다. 그래서 각각의 목적에 맞는 재료의 개발이 필요하다는 것을 인식하게 되었다. SiC wafer는 큰 band gap energy와 고온 안정성, 캐리어의 높은 드리프트 속도 그리고 p-n 접합이 용이하다. 또한 소재 자체가 화학적으로 안정하고 $500\sim600^{\circ}C$에서 소자 제조 시 고온공정이 가능하며, 실리콘이나 GaAs에 비해 고출력을 낼 수 있는 재료이다. 반도체 소자로 이용하기 위한 wafer 가공 공정에 있어 물리적 힘에 의한 stress를 많이 받아 wafer가 휘는 현상이 생긴다. 반도체 소자의 기본이 되는 wafer가 휨 현상을 일으키면 wafer 위에 소자가 올라갈 경우 소자의 불균일성 때문에 반도체의 물성에 나쁜 영향을 미치게 된다. 그래서 반도체 소자의 기본이 되는 wafer의 휨 현상 개선이 중요하다. 본 연구에서는 산화로에서 Ar 분위기에서 압력 760torr, 온도 $1100^{\circ}C$ 부근에서의 조건으로 진행을 하여 wafer의 Flatness Tester(FT-900, NIDEK) 장비로 SORI, BOW, GBIR 값의 변화에 초점을 맞추었다. SiC 단결정을 sawing후 가공 전 wafer를 열처리하여 가공을 진행하는 것과 열처리 하지 않은 wafer의 SORI, BOW, GBIR 값 비교, 그리고 lapping, grinding, polishing 등의 가공 진행 중간 중간에 열처리를 하여 진행하는 것과 가공 진행 중간 중간에 열처리를 하지 않고 진행한 wafer의 SORI, BOW, GBIR 값의 비교를 통해 wafer의 휨 현상 개성에 관해 알아본다.

• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.101-106
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• 2000

SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.6
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• pp.1486-1496
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• 1993

The diamond wheel with superabrasive is required for mirror-like surface grinding of brittle materials. But the conventional dressing mothod can not apply to the diamond wheel with superabrasive. Recently electrolytic dressing method was developed for cast-iron bonded diamond wheel with superabrasive. This technique can take replace of lapping and polishing. Using the electrolytic dressing, the surface roughness of workpiece was improved largely and grinding force was very low and the continuity of the grinding force was also very improved. In this study, the purpose is the realization of mirror-like surface grinding of ferrite with electrolytic dressing of metal bonded diamond wheel. For application of ultraprecision grinding for brittle material, superabrasive wheel, air spindle and inprocess electrolytic dressing were used. In addition, the effects of pick current and pulse width on ground surface were investigated, and the suitable dressing conditions for ferrite were found out.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.319-320
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• 2012

Large aperture optical modulator called optical shutter is a key component to realize time-of-flight (TOF) based three dimensional (3D) imaging systems [1-2]. The transmission type electro-absorption modulator (EAM) is a prime candidate for 3D imaging systems due to its advantages such as small size, high modulation performance [3], and ease of forming two dimensional (2D) array over large area [4]. In order to use the EAM for 3D imaging systems, it is crucial to remove GaAs substrate over large area so as to obtain high uniformity modulation performance at 850 nm. In this study, we propose and experimentally demonstrate techniques for backside etching of GaAs substrate over a large area having high uniformity. Various methods such as lapping and polishing, dry etching for anisotropic etching, and wet etching ([20%] C6H8O7 : H2O2 = 5:1) for high selectivity backside etching [5] are employed. A high transmittance of 80% over the large aperture area ($5{\times}5mm^2$) can be obtained with good uniformity through optimized backside etching method. These results reveal that the proposed methods for backside etching can etch the substrate over a large area with high uniformity, and the EAM fabricated by using backside etching method is an excellent candidate as optical shutter for 3D imaging systems.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.6
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• pp.825-834
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• 1999

Recently, various implant cylinders were supplied. especially received gold cylinders, cast cylinders produced from premade gold and plastic cylinders and plastic cylinders. This study measured and compared precise fit produced when using conventional gold and plastic cylinders. The comparative fit of lapped and non-lapped castings made from plastic pattern was examined. The implant/abutment interface fit was evaluated by scanning electron microscopy(SEM) for each of four cylinders. The following results were obtained: 1. The case of plastic cylinder showed $9.67{\pm}1.50{\mu}m$ gap when Steri-Oss fixture was connected. 2. The case of lapped casting made from plastic cylinder showed $3.01{\pm}2.81{\mu}m$ gap when Steri-Oss fixture was connected. 3 The case of gold/plastic cylinder showed $9.80{\pm}1.68{\mu}m$ gap when Steri-Oss fixture was connected. 4. The case of gold cylinder showed ${5.47{\pm}2.43\mu}m$ gap when Steri-Oss fixture was connected. 5. In case of each cylinder which was connected with Steri-Oss fixture, the size of gap was showed less in the order of the case of gold/plastic cylinder, the case of plastic cylinder, the case of gold cylinder and the case of lapped casting made from plastic cylinder As results of this study, the use of premade gold cylinder offers an advantage over plastic pat-terns in precise fit. When plastic patterns are used, polishing of implant cylinder components should provide precise fit.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.51-57
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• 2001

A light beam reflected from a machined surface generally containes information concerning about its surface roughness. This study examines and proposes a surface roughness measurement technique for on-machine measurement of machined surfaces. The technique is based on the measurement of a reflected laser beam pattern and the statistical analysis of its light intensity distribution. The surface roughness was found to be closely related to the standard deviation of the light intensity on the primary axis of the reflected pattern. An image acquisition device is made up of a laser diode, a half mirror, a screen, and a CCD camera. The exact image with the primary and secondary axes of a reflected laser beam pattern is calculated through such image processing algorithm as thresholding, edge detection, image rotation, segmentation, etc. A median filter and a surrounding light correction algorithm are improve the image quality and reduce the measuring error. Using the developed measuring device the effect of screen materials and workpiece and workpiece materials was investigated. Experimental results regarding to relatively high-quality surfaces machined by grinding, polishing, lapping processes have shown the measurement error is within 10% in the range of $0.1{mu}m~0.8{\mu}m R_q.$Therefore, the proposed method is thought to be effectively used when quick measurements is needed with workpieces fixed on the machine.