• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.183-192
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• 2001

1- Buildup PCB technology is utilized to a bare chip attach substrate technology for packaging of semiconductor chip 2- Requirement for the substrate design rule is described in SIA International Technology Roadmap for Semiconductor. 3- There are seven fabrication methods of build-up technology. 4- Coating and lamination for resin and photo, and laser for micro via hope processes are available. Below $50\mu\textrm{m}$ in diameter is possible. 5- Fine pitch lines down to $30\mu\textrm{m}$ can be achieved by pattern plating with better electrical property. 6- Dielectric loss reduction is a key material improvement item for next generation build-up technology. 7- High band width up to 512 GB/s is possible with current wiring groundrule.

• 한국기계가공학회지
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• 제20권6호
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• pp.51-58
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• 2021

The notion of leisure has changed with industrial development and improvement in life quality. Bicycling is a healthy sport; it is an exercise performed while enjoying nature. There have been many changes in the materials that are used to manufacture the bicycle frame. Iron and aluminum have been mainly used in bicycle frames. However, carbon-based materials are lighter and stronger than metal frames. The bicycles made of carbon composite changes frame rigidity depending on the direction of the carbon sheet sacking angle. We study the direction of composite material and how they affect the stiffness of frames based on the stacking angle.

• 한국기계가공학회지
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• 제13권2호
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• pp.41-48
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• 2014

Direct writing(DW) is a method of patterning materials to a substrate directly, without a mask. It can use a variety of materials and be applied to various fields. Among DW systems, the flow-based type, using a syringe pump and nozzle, is simpler than other types. Furthermore, the range of materials is exceptionally wide. In additive processes, a three dimensional structure is made of stacking layer. Each layer is made of several lines. In this regard, good surface roughness of fabricated layers is essential to three dimensional fabrication. The surface roughness of any fabricated layer tends to change with the dispensing pattern. When multiple layers fabricated by a nozzle dispensing system are stacked, control of the nozzle position from the substrate is important in order to avoid interference between the nozzle and the fabricated layer. In this study, a fluid direct writing system for three dimensional structure fabrication was developed. Experimentsto control the position of the nozzle from substrate were conducted in order to examine the characteristics of the material used in this system.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• 한국초전도ㆍ저온공학회논문지
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• 제25권4호
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• pp.50-53
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• 2023

In this study, the photolithography process was chosen to reduce the aspect ratio of the cross-section of a high-temperature superconducting (HTS) tape by dividing the superconducting layer of the tape. Reducing the aspect ratio decreases the magnetization losses in the second-generation HTS tapes generated by AC magnetic fields. The HTS tape used in the experiment has a thin silver (Ag) layer of about 2 ㎛ on top of the REBCO superconducting layer and no additional stabilizer layer. A dry film resist (DFR) was laminated on top of the HTS tape by a lamination method for the segmentation. Exposure to a 395 nm UV lamp on a patterned mask cures the DFR. Dipping with a 1% Na₂CO₃ solution was followed to develop the uncured film side and to obtain the required pattern. The silver and superconducting layers of the REBCO films were cleaned with an acid solution after the etching. Finally, the segmented HTS tape was completed by stripping the DFR film with acetone.

• 융합정보논문지
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• 제11권6호
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• pp.219-225
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• 2021

배터리 패키지 방식은 안정성의 이유로 각형 패키지 방식이 선호되고 있으나 최근 파우치형 패키지의 안정성 검증에 따라 빠른 확대가 이루어지고 있다. 적층 공정을 이용한 파우치형은 공간 낭비를 줄일 수 있어 배터리 에너지 밀도가 높은 장점이 있으나 생산성이 낮은 단점을 가지고 있다. 따라서 본 논문에서는 조명확산 최소화를 위한 백라이트 조명기구 개선, 스테레오 카메라 위치 관계 변위 모니터링을 위한 기준 확보, 렌즈 풀림 모니터링을 위한 기준 확보를 통하여, 에지 검출 알고리즘 정밀도, 패턴 알고리즘 정밀도, 모션 컨트롤러 재현율을 추출함으로써 위치 결정시의 정확성 및 신뢰성을 확보하는 시스템을 구현을 제안한다. 실험결과 제안한 시스템은 에지 검출에서는 평균 0.032mm, 패턴 알고리즘에서는 0.023mm, 모션 컨트롤러에서는 0.014mm의 오차범위를 보여주고 있어 위치 결정 기구의 정확성과 신뢰성을 확보할 수 있다.

• 한국수산과학회지
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• 제37권2호
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• pp.159-169
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• 2004

Sedimentation and depositional pattern of the fine-grained sediments in the southeastern inner shelf of Korea were studied using a very high-resolution seismic profiles and sediment data. The recent mud deposits up to 45 m thick are distributed in the inner shelf forming a nearshore belt from the eastern part of Geoje Island to off the Pohang along the coast. The sediment in this area consists of homogeneous mud with mean grain size between $8.6\;to\;5.3\phi$ and does not show any distinct variability It gradually becomes finer and well sorted northeastward along the coast. Sediments normally appear as structureless massive mud but X-radiographs show that some bioturbation and faint lamination are present. The sediments accumulate at a rate of 0.18-0.44 cm/yr and the rate coincides well with the long-term (a 1000-year scale) accumulation based on very high-resolution seismic data. Distribution of wet bulk density and velocity shows a gradual increase from the southeastern part of Ulsan to off Pohang, whereas porosity shows a reverse pattern. Correlations between velocity and porosity/mean grain size are different from other regions compared, due to the difference of sediment texture and sedimentary environment. The recent shelf deposits are seismically characterized by three distinct facies: 1) well-stratified (near the river mouth), 2) semi-transparent (eastern part of Geoje Island), and 3) transparent (off Ulsan). The results suggest that fine-grained sediment derived from rivers, forming a nearshore mud belt, have been transported northeastward by the northeastward-flowing coastal current.

• Journal of the Korean Wood Science and Technology
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• 제18권3호
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• pp.42-52
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• 1990

In this study, thick 24mm glulams were composed of thick. 3, 4, 6, 8mm Larch laminas to study that the theoretical analysis and the experimental analysis regarding the location of neutral axis of the glulams were compared, and to study on the effect of location of neutral axis on mechanical properties of glulam. The variation of location of neutral axis after proportional limit(or elastical limit) was studied to offer basic data to make the better composition method of glulam. The result obtained can be summarized as follows: 1. The theoretical neutral axis was 0.547 in solid wood, and also 0.547 in glulams because glulams were composed of only Larch laminas. 2. In solid wood, the deviation of the theoretical and the experimental neutral axis location was 0.1%, But in glulams, the deviation from-12.2% to + 7.8% showed nonuniform pattern but no large deviation. Because laminas was only of Larch and so the mechanical properties of laminas were monotonous. 3. The neutral axis exerted no influance on the elasticity of glulam, which meaned that the maximum shear strength in the neutral axis showed no influance on elasticity limit. 4. The only minutely lower elasticities of glulam than that of solid wood were shown. This was because of influance of glue lines of glulam on the elasticlties. 5. The failure type of glulam was wholly simple tension failure and the horizontal shear failure near neutral axis was not taken place, which was that glue line was complete in bonding and the strength of the lamina was not various but uniform. 6. The ratio of tension strain($^{\varepsilon}t$) I compression strain($^{\varepsilon}c$) initially showed uniform level After the elasticity limit. the ratio was increased with the flow of time and so the tension strain was more increased than compression strain. So this proved tension lamination technique, which is that the mechanical properties of glulam could be improved, if the lamina of more superior strength would he added on the bottom side of the glulam.

• Composites Research
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• 제31권5호
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• pp.215-220
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• 2018

본 연구에서는 적층 패턴이 다른 5가지 섬유금속적층판(Fiber Metal Laminates, FMLs)에 대한 유한요소해석을 수행하여 선행 연구로 수행한 낙추충격시험과의 유사성을 검증하였고, 효과적인 저속 충격 해석 모델을 개발하였다. 또한 동일한 두께를 가지는 연강(mild steel)과 에너지흡수율을 비교하여 Carbon-Steel 섬유금속적층판의 내충격성을 확인하였다. Carbon-Steel 섬유금속적층판은 동일한 두께를 가지는 연강에 비하여 우수한 충격흡수율을 보였으며, 모든 적층 패턴에서 96% 이상의 높은 에너지흡수율 갖는 것을 확인하였다. 본 연구에서 제시한 저속 충격 해석 모델은 복합형상 및 자동차 구조체 연구에 효과적으로 적용할 수 있을 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.1-5
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• 2004

다층 연성기판은 높은 전기 전도성과 낮은 절연상수로 잘 알려진 구리와 폴리이미드로 구성되어 있다. 본 연구에서는 이러한 다층연성기판을 패턴된 스테인리스 스틸 위에 구리선을 전기도금하고 폴리이미드를 코팅함에 의해서 균일한 형태의 $5{\mu}m$-pitch의 전도선을 제조하는데 성공하였다. 또한, 다층기판 형성시 비아흘은 UV 레이저로 형성시켰으며 구리와 주석을 전기 도금함으로 이를 채웠다. 그런다음 비아와 전도선이 붙은 채로 스테인리스 스틸에서 벗겨냈다. 이렇게 형성된 각각의 층을 한번에 적층하여 다층연성기판을 완성하였다. 적층시 주석과 구리사이에 고체상태 반응(Solid state reaction)이 발생하여 $Cu_6Sn_5$ and $Cu_3Sn$을 형성하였으며 비아패드에 비아가 수직으로 위치한 완전한 형태의 층간 연결을 형성하였다. 이러한 비아 형성 공정은 V형태의 비아나 페이스트 비아와 비교할 때 좋은 전기적 특성, 저가공정등의 여러 장점을 가지고 있다.