• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.82-82
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• 2009

본 연구에서는 Glass ceramic $SiO_2-CaO-Al_2O_3$를 사용하여 적층형 칩 퓨즈를 제조하였다. 퓨즈의 용단 특성 및 IR특성을 개선하기 위하여 기공조제로써 Corn starch 파우더(x=5, 10, 20, 30, 40, 50wt%)를 혼합하여 기공을 형성하게 하였다. 미세구조 관찰 결과 Corn starch 파우더의 함량이 증가함에 따라 기공률이 증가하였다. 또한 전극의 선폭(x=50, 100, 150, $200{\mu}m$)을 변화 시킴으로써 전극의 폭이 커질수록 저항값이 줄어든다는 것을 알 수가 있었다. 기공층 도입을 통하여 적층형 칩 퓨즈의 용단 특성의 개선 및 ARC 억제가 가능하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.593-596
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• 2002

In this paper, the effect of device model parameter variation on three-dimensional embedded passive devices was investigated using statistical analysis. The optimized equivalent circuit models for several different structures were obtained from HSPICE simulation. The mean and the standard deviation of model parameters were extracted and the sensitivity analysis for each component was performed. From the analysis, the performance and parametric yield of the devices can be analyzed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.115-118
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• 2002

This paper presents the design method and performance characteristics of a chip-type quadrature hybrid using LTCC-MLC technology. The design method for a chip-type quadrature hybrid is based on lumped element equivalent circuit of quarter-wave transformer. The chip-type quadrature hybrid was miniaturized to a greater extent using multilayer structure and lumped element. The proposed design method can also reduce the undesirable parasitic effects of the chip-type quadrature hybrid. The proposed chip-type quadrature hybrid was designed and fabricated using the proposed design method and the equivalent circuit model of a quarter-wave transformer. Fabrication and measurement of designed chip-type quadrature hybrid show much smaller size than a conventional distributed quadrature hybrid and a good agreement with simulated results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.669-672
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• 2003

With the advances on wireless internet technology, many research on minimization of wireless LAN is on the progress. To apply passive components in MCM, characteristic analysis of passive components is essential. In this paper, three square spiral inductors were modeled by HSPICE using PEEC (Partial Element Equivalent Circuit) method. Afterwards, Monte-Carlo analysis was performed to evaluate the optimized parameters. This work will give an idea on PEEC modeling of spiral inductor, and enable researchers with predictive data before large scale manufacturing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.611-615
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• 2003

The crystalline and dielectric properties on $Al_2O_3$ filled glass frit ($CaO-Al_2O_3-SiO_2-MgO-B_2O_3$) with admixtures of $TiO_2$ have been investigated. The dielectric constant value of $7.5{\sim}7.8$, quality factor value of 700 were obtained for glass frit : $Al_2O_3$ (50 : 50 wt%) ceramics. As the amount of $TiO_2$ increased, temperature coefficient of dielectric constant were decreased.

• 한국전기전자재료학회논문지
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• 제21권3호
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• pp.236-241
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• 2008

The effect of organic solvent mixture ratio on the rheology property of slurry and thickness control of ceramic green sheet was investigated. For selecting a suitable dispersant multiple light scattering method was used to evaluate the particle migration velocity and variation of clarification layer thickness. Using the selected dispersant the dispersion property of solution according to solvent mixture ratio was investigated. Binder and plasticizers were added to formulate slurries and their viscosity was evaluated according to solvent mixture ratio. Ceramic green sheets with average thickness of 30, 50 urn were fabricated via tape casting and their thickness tolerances measured. As a result according to solvent mixture ratio the solution and slurry properties varied and for the mixture ratio of ethanol/toluene of 80/20 the ceramic green sheet with the lowest thickness tolerance was obtained.

• 한국전기전자재료학회논문지
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• 제26권1호
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• pp.33-37
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• 2013

The properties of LTCC green sheets formed by the MLS-22 powder of NEG Inc. were investigated for acrylic binders with different PVB and Tg in the variation of temperature. The elongation of the green sheets showed large variation depending on the temperature, and was rapidly decreased near the Tg of the sheets. With the increase of the ratio of plasticizer/binder (P/B), large elongation of the sheets was observed due to the decrease of the Tg. In the stacking process of the multilayer ceramic, the optimal control of the temperature is highly required depending on the Tg of the binder and the ratio of P/Buniform coating.