• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.2055-2057
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• 2004

The Ku band that has been using for the satellite communication and broadcasting would be changed to K/Ka bands. The satellite system requires the antenna structure to fabricate low loss and small antenna that is able to be integrated with other Rf circuits for both Rx and Tx. So we should design it with dual feed antennas at K/Ka bands, high isolation between two different feeds and broadband circular polarization. This paper proposes the LTCC(Low Temperature Co-fired Ceramic) process for integration with other Rf circuits and the Axial mode of the helical antenna to satisfy those requirements.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• 한국세라믹학회지
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• 제56권6호
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• pp.526-533
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• 2019

Indialite/cordierite glass-ceramics demonstrate excellent microwave dielectric properties such as a low dielectric constant of 4.7 and an extremely high quality factor Qf of more than 200 × 10³ GHz when crystallized at 1300℃/20 h, which are essential criteria for application to 5G/6G mobile communication systems. The glass-ceramics applied to dielectric resonators, low-temperature co-fired ceramic (LTCC) substrates, and direct casting glass substrates are reviewed in this paper. The glass-ceramics are fabricated by the crystallization of glass with cordierite composition melted at 1550℃. The dielectric resonators are composed of crystallized glass pellets made from glass rods cast in a graphite mold. The LTCC substrates are made from indialite glass-ceramic powder crystallized at a low temperature of 1000℃/1 h, and the direct casting glass-ceramic substrates are composed of crystallized glass plates cast on a graphite plate. All these materials exhibit excellent microwave dielectric properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술대회 논문집
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• pp.13-13
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• 2010

Piezoelectric sensors are extensively used to measure force because of their high sensitivity and low cost. however, the development of device with reduced size but with improved sensitivity is highly important. Low-temperature co-fired ceramic (LTCC) is one of promising materials for this application than a silicon substrate because it has very good electrical and mechanical properties as well as possibility of making various three dimensional (3D) structures. In this work, piezoelectric pressure sensors based on hybrid LTCC technology were presented. The LTCC diaphragms with thickness of $400\;{\mu}m$ were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The piezoelectric sensing layer consists of PZT thin film deposited by RF magnetron sputtering method on between top and bottom Au electrodes. The PZT films deposited on LTCC diaphragms were successfully grown and were analyzed by using X-ray diffraction method (XRD) and field emission scanning electron microscope (FESEM).

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.71-76
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• 2004

무선 이동 통신에 응용할 수 있는 소형의 집적된 형태의 여파기를 LTCC기술과 인터디지털 커패시터 (Interdigital capacitor)를 가진 컴라인 타입(Combline type)의 구조를 이용해 구현했다. 또한 T 패턴을 가지는 마이크로스트립(Microstrip)타입의 공진기를 이용해 LTCC 기판의 전기적 성능을 측정했다. 구현된 여파기는 인터디지털과 컴라인 구조를 이용해 2.7mm${\times}$2.03mm의 비교적 소형으로 구현할 수 있었고 5.09 GHz의 중심주파수에서 1.8 dB의 삽입손실, 37.6 dB의 반사손실, 그리고 280 MHz의 대역폭을 가졌다. 제안된 여파기는 작은 크기와 간단한 구조로 인해 여러 가지 LTCC기판의 집적형 여파기로 응용될 수 있을 것이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.138-138
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• 2003

Low temperature co-fired ceramic (LTCC) technology offers significant benefits over the other established packaging technologies for high density, high microwave frequency, and fast signal application. Most conventional electroceraramics do not meet the basic requirements in respect of sinterability for LTCC technology. Attention is, therefore, focused on the role of glasses because of the capability they supply with lower sintering temperatures. In this study, commercial ceramic (MBRT-90) in the system BaO-N $d_2$ $O_3$-Ti $O_2$ (BNT: 40 ~ 80 wt%) and L $a_2$ $O_3$- $B_2$ $O_3$-Ti $O_2$ glass (LBT;60 ~ 20 wt%) were prepared. These glass/ceramic composites were evaluated for sintering behavior, phase evaluation, densities, interface reaction, crystallinity, microstructure and microwave dielectric properties. It was found that the addition LBT glass frits significantly lowered the sintering temperature to below 90$0^{\circ}C$ and as temperature increased (750~90$0^{\circ}C$) densification developed dynamically which was meant to be as over 95% of relative density. It is supposed that in the microstructure, the grain size was increased accompanying with the formation of different phases such as LaB $O_3$ and Ti $O_2$ under the condition of increasing sintering temperature. The sintered bodies represented applicable dielectric properties, namely 20 ~ 40 for $\varepsilon_{{\gamma}}$, ~ 10000 GHz for Q* $f_{0}$ and 10~80 ppm/$^{\circ}C$ for $\tau$$_{f}$. The results suggest that the composite is one of feasible candidates for the microwave use in LTCC technology.y.e use in LTCC technology.y.

• ETRI Journal
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• 제28권2호
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• pp.182-190
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• 2006

The circuit modeling of interdigitated capacitors fabricated by high-k low-temperature co-fired ceramic (LTCC) sheets was investigated. The s-parameters of each test structure were measured from 50 MHz to 10 GHz, and the modeling was performed using these measured sparameters up to the first resonant frequency. Each test structure was divided into appropriate building blocks. The equivalent circuit of each building block was composed based on the partial element equivalent circuit (PEEC) method. Modeling was executed to optimize the parameters in the equivalent circuit of each building block. The validity of the extracted parameters was verified by the predictive modeling for the test structures with different geometry. After that, Monte Carlo analysis and sensitivity analysis were performed based on the extracted parameters. The modeling methodology can allow a device designer to improve the yield and to save time and cost for the design and manufacturing of devices.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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• pp.29-33
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• 2003

최근 이동 정보통신 분야의 발전에 따라 단말기 및 관련 부품들을 소형 경량화 하는 것이 매우 중요한 기술요소로 부각되고 있다. 이를 위해서는 기판의 배선밀도를 높이는 것과 개별 부품 또는 모듈의 크기와 무게를 줄이는 것이 절실히 필요하며, 이러한 요구에 부응하기 위해 기존의 다층 PCB 기술이나 MCM 기술에 비해 우수한 배선밀도와 양호한 전기적 특성을 갖는 저온 동시소성 세라믹(Low Temperature Co-fired Ceramic) 기술이 개발, 적용되고 있다. 본 논문에서는 이러한 LTCC 기판의 소결에 있어 기존의 소결 공정인 전기로 소결 공정과 microwave를 이용한 소결 공정을 이용하여 소결 하였을 때, LTCC 기판의 수축율과 무게감소, 그에 따른 밀도변화, SEM 을 이용한 표면형상 분석을 통해 급속가열을 통한 공정시간의 단축, 낮은 에너지 소비로 인한 제조단가의 절감, 균일한 가열로 인한 소결온도의 저하 등의 장점을 갖는 microwave sintering 을 적용할 수 있는 가능성을 제시하였다.