• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.36-44
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• 2000

X-선 사진식각공정(이하 LIGA 기술이라 함)을 이용한 초소형, 초정밀 금형 및 3차원 구조물 제작 가공기술은, 생산기반 기술 중 금형기술 및 가공기술 분야에 해당하는 기술로 포항가속기와 같은 방사선 가속기에서 생성되는 수 보대 파장의 X-선을 이용하는 기술이다. 짧은 파장을 사용하는 연유로, 일반 반도체 공정으로는 실현할 수 없는 높고, 광학적 용도까지 가능한 거울정도의 벽면 거칠기(수백${\AA}$이하)를, 그러면서도 서브 마이크론의 정밀도 (1$\mu\textrm{m}$이하)를 가지는 금형 및 3차원 구조물을 일괄 가공할 수 있는 기술이다.(중략)

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.23-28
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• 2005

Microlens arrays were fabricated using a modified LIGA process based on the exposure of a PMMA (Polymethylmethacrylate) sheet to deep x-rays and subsequent thermal treatment. A successful modeling and analyses for microlens formation were presented according to the experimental procedure. A nickel mold insert was fabricated by the nickel electroforming process on the PMMA microlens arrays fabricated by the modified LIGA process. For the replication of microlens arrays having various diameters with different foci on the same substrate, the hot embossing and the microinjection molding processes have been successfully utilized with the fabricated mold insert. Fabricated microlenses showed good surface roughness than the mold insert. The focal lengths of the injection molded microlenses were successfully measured experimentally and also estimated theoretically.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.1-7
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• 2015

In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1871-1876
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• 2004

We demonstrate a novel fabrication technology for the microneedle array that can be used in the medical test field, which is transdermal drug delivery and blood analyte sampling. Previous researchers have used silicon-processed micromachining, a reactive ion etching, and molding techniques for the fabrication of microneedle array. However, these fabrication techniques have somewhat limitations apply to the microneedle array fabrication according to its application. Inclined LIGA process is suggested to overcome these problems. This process provides easier, sharper and longer out-of-plane microneedle array structure than conventional silicon-processed fabrication method did. Additionally, because of the advantage of the LIGA process based on mold fabrication for mass production, the polymer, PMMA(PolyMethylMethAcrylate), based microneedle array is useful as the mold base of nickel electroplating process; on the other hand, silicon-processed microneedle array is used in itself. In this research, we fabricate different types of out-of-plane microneedle array, which have different shape of tip, base and hole structure, using the inclined LIGA process. The fabricated microneedles have proper mechanical strength, height and sharpness to puncture human hand epidermis or dermis with less pain and without needle tip break during penetrating the skin.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.34-41
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• 2006

Microlens arrays were fabricated by a modified LIGA process composed of the exposure of a PMMA (Polymethylmethacrylate) sheet to deep x-rays and subsequent thermal treatment. A successful modeling and analyses for microlens formation were presented according to the experimental procedure. A nickel mold insert was fabricated by the nickel electroforming process on the PMMA microlens arrays fabricated by the modified LIGA process. For the replication of microlens arrays having various diameters with different foci on the same substrate, both hot embossing and microinjection molding processes have been successfully utilized with the fabricated mold insert. Replicated microlenses showed very good surface roughness with the order of 1 nm. The focal lengths of the injection molded microlenses were successfully estimated theoretically and also measured experimentally.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.383-386
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• 2007

In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.241-244
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• 2004

Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.74-74
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• 1998

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.387-390
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• 2009

This study was designed to fabricate the micro-electro-mechanical systems (MEMS) parts such as micro spur gears using hot extrusion of gas atomized Al-78Zn powders. For this purpose, it is important to develop new methods to fabricate micro-dies and choose suitable extrusion conditions for a micro-forming. Micro-dies with Ni were fabricated by LIGA technology. LIGA technology was capable to produce micro-extrusion dies with close tolerances, thick bearing length and adequate surface quality. Superplastic Al-78Zn powders have the great advantage in achieving deformation under low stresses and exhibiting good micro formability with average strain rates ranging from $10^{-3}$ to $10^{-2}\;s^{-1}$ and constant temperatures ranging from 503 to 563K. Al-78Zn powders were compacted into a cylindrical shape (${\Phi}3{\times}h10$) under compressive force of 10kN and, subsequently, the compacted powders were extruded at 563k in a hot furnace. Micro-extrusion has succeeded in forming micro-gear shafts.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.