• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4378-4384
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

• Journal of Industrial Convergence
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• v.17 no.4
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• pp.9-14
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• 2019

This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.29-32
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• 2013

The surface roughness and reflectivity of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. In order to investigate the effect of stirring speed and temperature of the plating solution, surface roughness and reflectivity was measured. The experimental results revealed that the thickness of the deposit layer increased with stirring speed and temperature of the plating solution. Stirring speed is increased from 100 to 300 rpm, the surface roughness was reduced from 0.513 to 0.266 ${\mu}m$, and the reflectivity increased from 1.67 to 1.84 GAM. As temperature of the plating solution increased from 25 to $45^{\circ}C$, the surface roughness reduced from 0.507 to 0.350 ${\mu}m$, and the reflectivity increased from 1.68 to 1.84 GAM.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.1-5
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• 2020

By adapting black body leadflame and thin film type Green A filter, we successfully demonstrated night vision imaging system (NVIS) Green A compatible LED. Fabricated NVIS compatible LEDs show small form factor compared to that of commercialized NVIS compatible LED. Especially, NVIS radiance and chromaticity of MIL-STD-3009 specification can be satisfied simultaneously and easily by controlling the color temperature of the white LED as well as the concentration of the Green A dye and the thickness of the Green A filter. The optimal dye concentration of the NVIS Green A filter is expected to be about 1 wt%. The results of this study are expected to contribute to miniaturization, weight reduction and localization of avionic display and lighting devices.

• Journal of Applied Reliability
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• v.13 no.3
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Earthquakes and Structures
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• v.26 no.5
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• pp.383-400
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• 2024

For a conventionally repaired frame-supported-transfer-slab (FSTS) reinforced concrete (RC) structure, both the transfer slab and the beam-to-column and transfer slab-to-column joints remain vulnerable to secondary earthquakes. Aimed at improving the seismic performance of a damaged FSTS RC structure, an innovative retrofitting scheme is proposed, which adopts the sector lead rubber dampers (SLRDs) at joints after the damaged FSTS RC structure is repaired by conventional approaches. In this paper, a series of quasi-static cyclic tests was conducted on a large-scale retrofitted FSTS RC structure. The seismic performance was evaluated and the key test results, including deformation characteristics, damage pattern, hysteretic behaviour, bearing capacity and strains on key components, were reported in detail. The test results indicated that the SLRDs started to dissipate energy under the service level earthquake, and thus prevented damages on the beam-to-column and transfer slab-to-column joints during the secondary earthquakes and shifted the plastic hinges away from the beam ends. The retrofitting scheme of using SLRDs also achieved the seismic design concept of 'strong joint, weak component'. The FSTS RC structure retrofitted by the SLRDs could recover more than 85% bearing capacity of its undamaged counterpart. The hysteresis curves were featured by the inverse "S" shape, indicating good bearing capacity and hysteresis performance. The deformation capacity of the damaged FSTS RC structure retrofitted by the SLRDs met the corresponding codified requirements for the case of the maximum considered earthquake, as set out in the Chinese seismic design code. The stability of the FSTS RC structure retrofitted by the SLRDs, which was revealed by the developed stains of the RC frame and transfer slab, was improved compared with the undamaged FSTS RC structure.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Safety and Health at Work
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• v.6 no.4
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• pp.263-267
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• 2015

Significant changes in the past year have taken place in the world of work that are bringing new challenges with regard to employee safety and health. These changes have led to emerging psychosocial risks (PSRs) at work. The risks are primarily linked to how work is designed, organized, and managed, and to the economic and social frame of work. These factors have increased the level of work-related stress and can lead to serious deterioration in mental and physical health. In tackling PSRs, the European labor inspectorates can have an important role by enforcing preventive and/or corrective interventions in the content and context of work. However, to improve working conditions, unilateral interventions in the context and content of work are insufficient and require adopting a common strategy to tackle PSRs, based on a holistic approach. The implementation of a common strategy by the European Labor Inspectorate for tackling PSRs is restricted by the lack of a common legislative frame with regard to PSR evaluation and management, the different levels of labor inspectors' training, and the different levels of employees' and employers' health and safety culture.