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http://dx.doi.org/10.6117/kmeps.2013.20.2.029

Reflection Characteristics of Electroplated Deposits on LED Lead frame with Plating Condition  

Kee, SeHo (Department of Materials Science and Engineering, University of Seoul)
Kim, Wonjoong (Department of Materials Science and Engineering, University of Seoul)
Jung, JaePil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.2, 2013 , pp. 29-32 More about this Journal
Abstract
The surface roughness and reflectivity of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. In order to investigate the effect of stirring speed and temperature of the plating solution, surface roughness and reflectivity was measured. The experimental results revealed that the thickness of the deposit layer increased with stirring speed and temperature of the plating solution. Stirring speed is increased from 100 to 300 rpm, the surface roughness was reduced from 0.513 to 0.266 ${\mu}m$, and the reflectivity increased from 1.67 to 1.84 GAM. As temperature of the plating solution increased from 25 to $45^{\circ}C$, the surface roughness reduced from 0.507 to 0.350 ${\mu}m$, and the reflectivity increased from 1.68 to 1.84 GAM.
Keywords
LED; plating; packaging; surface roughness; reflectivity;
Citations & Related Records
Times Cited By KSCI : 7  (Citation Analysis)
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1 S. W. Han, I. J. Cho and Y. E. Shin, "Reliability of Sn-8Zn-3Bi Solder Paste Applied to Lead and Lead-free Plating on Lead-frame under Thermal Shock Test(in Kor.)", J. Microelectron. Packag. Soc., 14(2) 35-44 (2007).
2 S. H. Kim, J. S. Yun, D. S. Shin and J. I. Shim, "Optical and Electrical Characteristics of GaN-based Blue LEDs after Low-current Stress(in Kor.)", Korean Journal of Optics and Photonics, 23(2), 64-70 (2012).   과학기술학회마을   DOI   ScienceOn
3 D. W. Hong and S. J. Lee, "A Study on High Power LED Lamp Structures(in Kor.)", Korean Journal of Optics and Photonics, 21(3) 118-122 (2010).   과학기술학회마을   DOI   ScienceOn
4 Y. C. Lee, K. S. Kim, J. H. Ahn, J. W. Yoon, M. K. Ko and S. B. Jung, "Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package(in Kor.)", Korean J. Met. Mater., 48(11) 1035-1040 (2010).   DOI   ScienceOn
5 J. B. Kim, "The Issues and the Technology Trends of LED(in Kor.)", ETRI 24(6), 61-76 (2009).   과학기술학회마을
6 M. Meneghini, S. Podda, A. Morelli, R. Pintus, L. Trevisanello, G. Meneghesso, M. Vanzi and E. Zanoni, "High brightness GaN LEDs degradation during dc and pulsed stress", Microelectronics Reliability 46, 1720-1724 (2006).   DOI   ScienceOn
7 B. S. Seo, S. H. Kim, Y. G. Jeong and D. H. Park, "Thermal simulation using COB Type LED modules analysis of thermal characteristics(in Kor.)", Journal of Electrical Engineering & Technology Conference, 1722 (2011).
8 S. H. Hwang and Y. L. Lee, "Study on Thermal Performance of Multiple LED Packages with Heat Pipes(in Kor.)", Transactions of the KSME B, 35(6) 569 (2011).   과학기술학회마을   DOI   ScienceOn
9 S. J. Lee, "Basic Design Guidelines for LED Lamp Packages( in Kor.)", Korean Journal of Optics and Photonics, 22(3), 141-150 (2011).   과학기술학회마을   DOI   ScienceOn
10 S. J. Yu and D. H. Kim, "Development of White LED Lamp Having High Color Uniformity With Transfer Molding Technology(in Kor.)", Journal of the Korean Institute of Electrical and Electronic Material Engineers, 23(1), 38-41 (2010).   과학기술학회마을   DOI   ScienceOn
11 M. Schlesinger and M. Paunovic, Modern electroplating, 5th Edition, pp. 1-32, WILEY (2010).
12 Y. M. Koo, G. S. Kim and E. K. Kim, "Developing Low Cost, High Throughput Si Through Via Etching for LED Substrate(in Kor.)", J. Microelectron. Packag. Soc., 19(4), 19-23 (2012).   DOI   ScienceOn
13 S. H. Kim, S. I. Lee, J. K. Yang and D. H. Park, "Analysis of Thermal Properties in LED Package by Via-Hole and Dimension of FR4 PCB(in Kor.)", J. KIEEME, 24, 234 (2011).   과학기술학회마을   DOI   ScienceOn
14 S. H. Kee, Z. Xu, W. J. Kim and J. P. Jung, "Reflectivity and Thermal Shock Properties of Sn-3.5Ag Electroless-plated Deposit for LED Lead Frames(in Kor.)", Korean J. Met. Mater., 50(8) 563 (2012).   DOI
15 Z. Xu, S. Kumar, J. P. Jung and K. K. Kim, "Reflection Characteristics of Displacement Deposited Sn for LED Lead Frame", Mater. Trans., 53(5) 946 (2012).   DOI   ScienceOn