• Title/Summary/Keyword: LED Design

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User Acceptance of a Light-Emitting Diode Vest for Police Officer

  • Han, Hyunjeong;Park, Huiju;Jeon, Eunkyung
    • Fashion & Textile Research Journal
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    • v.15 no.5
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    • pp.834-840
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    • 2013
  • This study aims to suggest practical considerations for designing protective clothing with increased visibility that will have higher user acceptance by law enforcement officers. Light-emitting diode(LED) patrol vests were visually and structurally assessed, and 125 police officers' responses from surveys about user acceptance of the vest were analyzed. The current LED patrol vest was designed for enhanced safety of police officers by increasing visibility in the dark. However, the user acceptance rate of the LED patrol vest indicates low use of and low satisfaction with the vest despite its enhanced safety features. In particular, differences in materials, design, functionality of the pockets and size of the vest depending on the hours worked, were statistically significant. The police officers' responses suggest areas of improvement in design, materials, ease of movement, size and functionality. Key issues include 'tactile discomfort'; 'impeded vision from the glare of the LED'; 'frequent malfunctions of the LED'; 'impossible repair of the broken LED units'; 'no user feedback'; 'inconvenient to replace batteries'; 'brittle materials' and 'unpleasing look'. To increase user acceptance, designer should incorporate context-awareness, a convenient user interface, a modular design approach, first responders' self-image as public servants in relation to their aesthetic perspectives of their uniforms, and scientific evaluation of the effectiveness of the intended functions of the clothing. Suggested implications for designing the LED patrol vest can be applied to designing other functional/protective clothing for intended end users with special needs.

A Design of Heat-Sink and DMX512 Communication Control for High-Power LEDs (고출력 LED 방열 및 DMX512 통신 제어 설계)

  • Kim, Ki-Yun;Ham, Kwang-Keun
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.38C no.8
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    • pp.725-732
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    • 2013
  • Recently, various applications for LED lightings are growing continuously due to their better performances such as low power consumption, longer life time, operation speed, controllability, high quality color rendering, and sustainability. However, in developing the high-powered LEDs illumination system, heat-sink problem is one of the important obstacle. In this paper, a heat-sink design with multi-layered structure for high-powered LEDs is proposed, which is composed of metal core PCB, heat-pipes, heat-sink plates, and fans. And also, in this paper, a design for LED controls using DMX512 protocols through RS-485 communications is proposed, which is considered as de facto international standard in LEDs illumination control and is widely used in landscape lighting and stage lighting. In this paper, LED control and its application techniques are introduced and the method of wireless remote control for main controller is proposed.

DC-DC integrated LED Driver IC design with power control function (전력 제어 기능을 가진 DC-DC 내장형 LED Driver IC 설계)

  • Lee, Seung-Woo;Lee, Jung-Gi;Kim, Sun-Yeob
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.12
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    • pp.702-708
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    • 2020
  • Recently, as LED display systems have become larger, research on effective power control methods for the systems has been in progress. This paper proposes a power control method to minimize power loss due to the difference in LED characteristics for each channel of a backlight unit (BLU) system. The proposed LED driver IC has a power optimization function and detects the minimum headroom voltage for constant current operation of all channels and linearly controls the DC-DC converter output. Thus, it minimizes power consumption due to unnecessary additional voltage. In addition, it does not require a voltage sensing comparator or a voltage generation circuit for each channel. This has a great advantage in reducing the chip size and for stabilization when implementing an integrated circuit. In order to verify the proposed function, an IC was designed using Cadence and Synopsys' design tools, and it was fabricated with a Magnachip 0.35um 5V/40V CMOS process. The experiments confirmed that the proposed power control method controls the minimum required voltage of the BLU system.

Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis (반응표면분석법을 이용한 LED Die Bonding 공정능력 최적화)

  • Ha, Seok-Jae;Cho, Yong-Kyu;Cho, Myeong-Woo;Lee, Kwang-Cheol;Choi, Won-Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.10
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    • pp.4378-4384
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    • 2012
  • In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

A Study of Aspheric Mirror Optical Design to Improve Luminous Intensity Uniformity of LED Security Lights (LED 보안등의 광균일도 향상을 위한 비구면 Mirror형 광학 설계에 관한 연구)

  • Jung, In-Ho;Yoon, Cheol-Yong;Ye, In-Soo;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.1
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    • pp.114-119
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    • 2011
  • There is a limit to technology of improving luminous intensity uniformity and glare, known as a weakness of existing LED lamp. Because of Using many LED, LED lamp not only waste energy but have bad effect on efficiency. Our goal is to develop security lights solution which is contented with suitable area in KS(Korean Industrial Standards) and to remove glare by combining asphere in optical system with different concept. To improve luminous intensity uniformity, a reflect mirror system was used after an aspheric optical system design for this study. We made a mirror and measured it after analysing luminance changes depend on aspheric shapes with simulation program to see if aspheric shapes effect luminance distribution. We made progress to find problems and improve them by comparing measured data and analysed data. This result of the study will contribute to industry of LED lighting through developing solution of emotional illumination of LED security lights by knowing the importance of reflectivity with this study and improving luminous intensity uniformity with solving the problem.

Optical and Thermal Influence Analysis of High-power LED by MCPCB temperature (MCPCB의 온도에 따른 고출력 LED의 광학적, 열적 영향력 분석)

  • Lee, Seung-Min;Yang, Jong-Kyung;Jo, Ju-Ung;Lee, Jong-Chan;Park, Dae-Hee
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.12
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    • pp.2276-2280
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    • 2008
  • In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

Optimization of Al 6063 Heat Sink using CFD Simulation and Comparative Analysis of Thermal Dissipation Properties with Thermal Conductive Polycarbonate (CFD전산모사를 이용한 Al 6063 Heat Sink 최적화 설계와 열전도성 Polycarbonate와의 방열성능 비교 분석)

  • Her, In-Sung;Lee, Se-Il;Lee, A-Ram;Yu, Young Moon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.7
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    • pp.19-25
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    • 2014
  • In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

Study on the Development of LED Headlamps for Used Cars

  • Jung, Eui-Dae;Lee, Young-Lim
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.5
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    • pp.270-274
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    • 2014
  • Currently, LED headlamps are only attached to newly manufactured vehicles, and it remains difficult to mount LED headlamps on used cars. Therefore LED headlamps need to be developed for used cars as a replacement of their halogen lamps. Due to a number of spatial limitations, it is critical to ensure a certain level of thermal performance. In order to obtain a design for efficient heat radiation, this paper aimed to optimize thermal management through a combination of heat sinks, heat pipes and fans. Based on such a design, this paper succeeded in developing LED headlamps of the desired performance to replace the halogen bulbs of used cars.

The Optimum Frequency Response of GaAs/(Ga, Al) As DH-LED for Optical Communication (광통신용 GaAs/(Ga, Al)As DH-LED의 최적 주파수 응용에 대한 연구)

  • 오환술;김영권
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.3
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    • pp.60-65
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    • 1984
  • In this paper, we have used symmetrical GaAs/(Ga, Al) As DH-LED as a model for the optimization of frequency response which is the most important design parameter of the optical communication-LED. And optimum design parameters have been chosen to improve performance factors of the DH-LED by computer simulation. This is for the purpose of systematic consideration of the interrelation of the physical parameters such as impurity concentration of the active layer, thickness of the active layer, minority carrier lifetime, space charge capacitance and injected current density.

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Design of LED Luminaire for Parking Garage

  • Cui, Hao;Park, Si-Hyun
    • Journal of Electrical Engineering and Technology
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    • v.11 no.6
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    • pp.1880-1885
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    • 2016
  • This study aims to design a zonal lumen for parking garage LED lightings of a slim appearance and 20 W/2,000 lm capacity and to fabricate a lighting luminaire accordingly. The frame is of a one-dimensional bar type with a reverse V-shaped section, with LED chips arranged along both sides. To maximize the $60^{\circ}$ to $80^{\circ}$ zonal lumen, the geometric structure was designed with the apex of the reverse V-shaped section at $40^{\circ}$ and both sides at $70^{\circ}$. As for the LED light source, focusing lenses with narrower full-width half-maximum (FWHM) in luminous intensity were used. A ray-tracing simulation method was utilized for the zonal lumen simulation of the given structure. An actual hardware of luminaire based on the simulation results was fabricated and characterized. The suggested model is meant to develop LED lightings with a proper level of zonal lumen required in parking garages.