1 |
B. L. Ahn, C. Y. Jang, S. B. Leigh, S. H, Yoo, and H. G. Jeong, Energy, 113, 1484 (2014).
|
2 |
D. S. Jang, S. J. Yook, and K. S. Lee, Energy, 116, 260 (2014).
|
3 |
L. Q. Yang, S. Jang, W. J. Hwang, and M. W. Shin, Thermochim. Acta., 455, 95 (2007). [DOI: http://dx.doi.org/10.1016/j.tca.2006.11.019].
DOI
ScienceOn
|
4 |
Y. Lai and N. Cordero, Proc. of the 7th EuroSimE Conference, 390 (2006).
|
5 |
E. Hong and N. Narendran, Proc. SPIE, 5187, 93 (2004). [DOI: http://dx.doi.org/10.1117/12.509682].
DOI
|
6 |
J. Wang, Y. Cai, X. Zhao, and C. Zhang, Microelectronics Journal, Accessed online 6 December 2013.
|
7 |
J. Li, F. Lin, D. Wang, and W. Tian, Thermal Engineering, 56, 18 (2013). [DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.03.016].
DOI
ScienceOn
|
8 |
Fluent, Version 6.1, Fluent, Inc., Lebanon, NH 2005.
|
9 |
Z. Lin and S. F. Wang, Thermal Engineering, 31, 2221 (2011). [DOI: http://dx.doi.org/10.1016/j.applthermaleng.2011.03.003
DOI
ScienceOn
|
10 |
B. Ramos-Alvarado, B. Feng, and G. P. Peterson, Thermal Engineering, 59, 648 (2013). [DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.06.036].
DOI
ScienceOn
|
11 |
R. Faranda, S. Guzzetti, and G. C. Lazaroiu, Thermal Engineering, 48, 155 (2012). [DOI: http://dx.doi.org/10.1016/j.applthermaleng.2012.05.018].
DOI
ScienceOn
|
12 |
Catia, V5R17, Dassault Systems, 2006.
|
13 |
Power Light Tec., Inc, http://www.powerlightec.com/
|
14 |
ICEM-CFD, Version 12.1, SAS IP, Inc., 2009.
|
15 |
A. Christensen and S. Graham, Thermal Engineering, 29, 364 (2009). [DOI: http://dx.doi.org/10.1016/j.applthermaleng.2008.03.019].
DOI
ScienceOn
|