• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.239-242
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• 2006

LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LGP (Light Guiding Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50{\sim}200$ um in diameter on it by etching process. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern design with 50um micro-lens was applied in the present study. The micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP. The attention was paid to the effects of different aspect ratio (i.e. $0.2{\sim}0.5$) of optical pattern conditions to the brightness distribution of BLU with micro-lens patterned LGP. Finally, high aspect ratio micro-lens patterned LGP showed superior results to the one made by low aspect ratio in average luminance.

• Journal of the Korea Convergence Society
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• v.11 no.6
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• pp.197-201
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• 2020

The molybdenum cup and molybdenum pin, which are the main materials of the molybdenum electrode used for the LCD BLU CCFL electrode, did not been developed in Japan and all of them are imported and used from Japan, is giving a competitive burden. In this research, to develop the manufacturing technology of molybdenum pin used for CCFL electrode of LCD BLU, development of linear processing technology, development of molybdenum wire surface treatment technology, development of wire cutting technology, production of molybdenum pin, design and fabrication of JIG and Fixture for inspection, molybdenum pin prototyping and analysis, and development of 100% molybdenum pin inspection technology. In this paper, especially, research on design and manufacturing of JIG and Fixture for molybdenum pin manufacturing and inspection is treated.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Korean Journal of Optics and Photonics
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• v.16 no.2
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• pp.113-120
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• 2005

Luminous efficiency and uniformity in a LCD-BLU are mainly determined by fine scattering patterns formed on the light guide panel. We propose a novel fabrication method of 3-dimensional scattered patterns based on anisotropic etching of silicon wafers. Micro-pyramid patterns with 70.5 degree apex-angle and micro-prism patterns with 109.4 degree apex-angle can be self-constructed by the wet, anisotropic etching of (100) and (110) silicon wafers, respectively, and those patterns are easily duplicated by the PDMS replica process. Experimental results on spatial and angular distributions of irradiation from the light guide panel with the micro-pyramid patterns were very consistent with the calculation results. Surface roughness of the silicon-based micro-patterns is free from any artificial defects since the micro-patterns are inherently formed with silicon crystal surfaces. Therefore, we expect that the silicon based micro-patterning process makes it possible to fabricate perfect 3-dimensional micro-structures with crystal surface and apex angles, which may guarantee mass-reproduction of the light guide panels in LCD-BLU.

• Journal of Information Display
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• v.1 no.1
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• pp.14-19
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• 2000

Due to distinct properties of plastic substrates such as poor thermal resistance, non-rigidness and high thermal expansion, it is difficult to fabricate plastic film LCDs by conventional LCD processes. Poor thermal resistance and high thermal expansion of substrates induced deformation of substrates surface, mismatch of thermal expansion between ITO electrodes and substrates resulted in defects in the ITO electrodes during the high temperature process. Defects of ITO electrodes and non-uniform cell gap caused by non-rigid and flexible properties were also observed in the pressuring process. Based on in these observations, we used a newly developed material and fabrication process to prevent deformation of substrates, defects of electrodes and to maintain uniform cell gap. The maximum temperature of the process is limited up to $110^{\circ}C$ and pressure loaded during the process is five times less than conventional one. With these invented processes and materials, we obtained highly reliable Plastic Film STN LCDs whose electro-optical characteristics are better than or equivalent to those of typical glass LCDs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.8
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• pp.793-798
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• 2009

In this paper, the simulation and optimization of SRH (Surface Relief Hologram) masks for printing LCD gate patterns using TIR (Total Internal Reflection) holographic lithography was investigated. A simulation and optimization algorithm based on SDTA (Scalar Diffraction Theory Analysis) method was developed. The accuracy of the algorithm was compared to that of the RCWA (Rigorous Coupled Wave Analysis) method for estimating the Fresnel diffraction pattern of Cr amplitude masks for the given system geometry. In addition, the results from the optimization algorithm were validated experimentally. It was found that one to the most important conditions for the fabrication of SRH masks is to avoid nonlinear shape distortions of the resulting grating. These distortions can be avoided by designing SRH masks with recorded gratings having small aspect ratios of width versus depth. The optimum gap size between the Cr and SRH masks was found using the optimization algorithm. A printed LCD gate pattern with a minimum line width of $1.5{\mu}m$ exposed using the optimized SRH mask was experimentally demonstrated.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.583-587
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• 2008

본 연구는 LCD 용 비정질 실리콘 박막 트랜지스터의 제조공정에서 가장 중요한 광 식각 공정을 중심으로 전체 공정을 개발하고, 공정의 안정성을 개선하여 소자의 신뢰성을 높이고자 한다. 본 연구의 수소화 된 비정질 실리콘 박막 트랜지스터는 Inverted Staggered 형태로 게이트 전극이 하부에 있다. 실험 방법은 게이트전극, 절연층, 전도층, 에치스토퍼 및 포토레지스터층을 연속 증착한다. 스토퍼층을 게이트 전극의 패턴으로 남기고, 그 위에 $n^+a-Si:H$ 층 및 NPR(Negative Photo Resister)을 형성시킨다. 상부 게이트 전극과 반대의 패턴으로 NPR층을 패터닝하여 그것을 마스크로 상부 $n^+a-Si:H$ 층을 식각하고, 남아있는 NPR층을 제거한다. 그 위에 Cr층을 증착한 후 패터닝하여 소오스-드레인 전극을 위한 Cr층을 형성시켜 박막 트랜지스터를 제조한다. 여기서 각 박막의 패터닝은 광 식각 공정으로 각 단위 박막의 특성에 맞는 광식각 공정이 필요하다. 제조한 박막 트랜지스터에서 가장 흔히 발생되는 문제는 주로 광식각공정시 발생하며, PR의 잔존이나 세척 시 얇은 화학막이 표면에 남거나 생겨서 발생되기도 하며, 이는 소자를 파괴시키는 주된 원인이 될 수 있다. 이와 같이 공정에 보다 엄격한 기준의 PR 패터닝, 박막의 식각 그리고 세척 등의 처리공정을 정밀하게 조절하여 소자의 특성을 확실히 개선 할 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.147-150
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• 2002

A light guide panel is an element of the LCD backlight module that is often used for the display of compact electronic devices. In this study, a laser marking system is proposed to fabricate light guide panel, which can be replaced of other manufacturing methods such as silk printing, stamping, and v-cutting methods. The objectives of this research are the establishment of laser marking system, evaluation of laser marking parameters, understanding marking process, application to PMMA, reliability test and quality inspection. A 50W $CO_2$ laser (CW) was used to perform different experiments in which, the influence of some processing parameters (average power, scanning speed) on the geometry and quality of groove pattern was studied. The width of the etched grooves increases with increasing a laser power and decreasing a scan speed. In order to analyze surface characteristics and optical properties (luminance, uniformity), SEM photography and BM7 (luminance measuring system) were used. As a result, the optimal conditions of the process parameters were determined.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.76-76
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• 2018

LCD 디스플레이 크기는 점차 대형화를 이루면서, 현재 LCD 디스플레이 크기는 3,000*3,320mm 크기까지 증가하여 개발이 활발이 이루어지고 있다. 디스플레이의 크기가 증가함에 따라 제조 장비의 크기도 증가되어야 하므로, LCD 디스플레이 CVD 공정에 사용되는 4,200*3,300mm 크기의 대형 Aluminium Vacuum Chamber 에 피막두께 $15{\mu}m$ 이상을 구현함과 동시에 두께 균일도가 우수하며 염수분무시험으로 168시간 이상의 내식성 확보가 가능한 양극산화조건 개발을 위하여 양극산화 피막의 각종 특성 평가를 실시하였다. 양극산화 피막 두께 측정은 와전류(Eddy Current)의 원리를 이용한 비파괴식 두께 측정법(ISO 2360, ASTM D 7091)을 적용하였으며, 염수분무시험 방법은 (KS D 9502)을 적용하였으며, HCl bubble stream 시험 방법은 HCl 5% 농도를 투명 아크릴 튜브에 채운후 bubble stream 을 종점으로 하여 평가를 실시하였으며, 열충격을 이용한 도금밀착성(KS D 0254), 도장접착력(ASTM D 3359) 등을 이용하여 전해조건 및 전해액 농도에 따른 피막 특성 비교평가를 실시하여 최적의 대형 Aluminium Vacuum Chamber 양극산화 전해 조건을 개발하여 4,200*3,300mm 크기의 대형 Aluminium Vacuum Chamber 제조를 목적으로 하였다.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.